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Ikio Sugiura
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Chiyoda-ku, JP
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last 30 patents
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Patent Grant
Manufacturing method of semiconductor package
Patent number
9,953,844
Issue date
Apr 24, 2018
Mitsubishi Electric Corporation
Masanori Nimura
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
MANUFACTURING METHOD OF SEMICONDUCTOR PACKAGE AND SEMICONDUCTOR PAC...
Publication number
20160163565
Publication date
Jun 9, 2016
Mitsubishi Electric Corporation
Masanori NIMURA
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SEMICONDUCTOR PACKAGE AND IMPLEMENTATION STRUCTURE OF SEMICONDUCTOR...
Publication number
20120091572
Publication date
Apr 19, 2012
Mitsubishi Electric Corporation
Tsuneo Hamaguchi
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...