Ikue Yokomizo

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Nagoya, JP

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Patents Grantslast 30 patents

Information Patent Grant
Electrical overlay measurement methods and structures for wafer-to-...
- Patent number 11,569,139
- Issue date Jan 31, 2023
- Western Digital Technologies, Inc.
- Ikue Yokomizo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded assembly containing side bonding structures and methods of m...
- Patent number 10,797,035
- Issue date Oct 6, 2020
- SanDisk Technologies LLC
- Michiaki Sano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Distortion-compensated wafer bonding method and apparatus using a t...
- Patent number 10,790,296
- Issue date Sep 29, 2020
- SanDisk Technologies LLC
- Takashi Yamaha
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
ELECTRICAL OVERLAY MEASUREMENT METHODS AND STRUCTURES FOR WAFER-TO-...
- Publication number 20220285234
- Publication date Sep 8, 2022
- WESTERN DIGITAL TECHNOLOGIES, INC.,
- Ikue YOKOMIZO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDED ASSEMBLY CONTAINING SIDE BONDING STRUCTURES AND METHODS OF M...
- Publication number 20200321324
- Publication date Oct 8, 2020
- SANDISK TECHNOLOGIES LLC
- Michiaki Sano
- H01 - BASIC ELECTRIC ELEMENTS