Ikuo Mashimo

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Patents Grantslast 30 patents

Information Patent Grant
Wafer demounting method, wafer demounting device, and wafer demount...
- Patent number 7,364,616
- Issue date Apr 29, 2008
- Mimasu Semiconductor Industry Co. Ltd
- Masato Tsuchiya
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL

Patents Applicationslast 30 patents

Information Patent Application
PROCESS FOR PRODUCING POLYCRYSTALLINE SILICON SUBSTRATE AND POLYCRY...
- Publication number 20100269903
- Publication date Oct 28, 2010
- Mimasu Semiconductor Industry Co., Ltd.
- Masato Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PROCESS FOR PRODUCING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTR...
- Publication number 20090266414
- Publication date Oct 29, 2009
- Mimasu Semiconductor Industry Co., Ltd.
- Masato Tsuchiya
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
PROCESS FOR PRODUCING SEMICONDUCTOR SUBSTRATE, SEMICONDUCTOR SUBSTR...
- Publication number 20090166780
- Publication date Jul 2, 2009
- MIMASU SEMICONDUCTOR INDUSTRY CO., LTD.
- Masato Tsuchiya
- C30 - CRYSTAL GROWTH
Information Patent Application
Process for Producing Semiconductor Substrate, Semiconductor Substr...
- Publication number 20080048279
- Publication date Feb 28, 2008
- Masato Tsuchiya
- C30 - CRYSTAL GROWTH
Information Patent Application
Wafer demounting method, wafer demounting device, and wafer demount...
- Publication number 20060286769
- Publication date Dec 21, 2006
- Masato Tsuchiya
- H01 - BASIC ELECTRIC ELEMENTS