Ikuo SHOHJI

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Maebashi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Wiring substrate for bonding using solder having a low melting poin...
- Patent number 9,883,586
- Issue date Jan 30, 2018
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wiring substrate and method of manufacturing wiring substrate
- Patent number 9,572,252
- Issue date Feb 14, 2017
- Toppan Printing Co., Ltd.
- Tetsuyuki Tsuchida
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Patents Applicationslast 30 patents

Information Patent Application
WIRING SUBSTRATE AND METHOD OF MANUFACTURING WIRING SUBSTRATE
- Publication number 20140332259
- Publication date Nov 13, 2014
- Toppan Printing Co., Ltd.
- Tetsuyuki TSUCHIDA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...