Ikuya Miyazawa

Person

Chino-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Liquid ejecting head and liquid ejecting apparatus
- Patent number 10,850,519
- Issue date Dec 1, 2020
- Seiko Epson Corporation
- Ikuya Miyazawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
MEMS device, liquid ejecting head, and liquid ejecting apparatus
- Patent number 10,603,914
- Issue date Mar 31, 2020
- Seiko Epson Corporation
- Masashi Fujioka
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Conduction structure, method of manufacturing conduction structure,...
- Patent number 9,822,452
- Issue date Nov 21, 2017
- Seiko Epson Corporation
- Tsuyoshi Yoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Conduction structure, method of manufacturing conduction structure,...
- Patent number 9,708,715
- Issue date Jul 18, 2017
- Seiko Epson Corporation
- Tsuyoshi Yoda
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Liquid droplet ejecting head, printing apparatus and method of manu...
- Patent number 8,960,861
- Issue date Feb 24, 2015
- Seiko Epson Corporation
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Liquid droplet ejecting head and printing apparatus
- Patent number 8,960,865
- Issue date Feb 24, 2015
- Seiko Epson Corporation
- Ikuya Miyazawa
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Grant
Method of manufacturing semiconductor device, semiconductor device,...
- Patent number 7,214,615
- Issue date May 8, 2007
- Seiko Epson Corporation
- Ikuya Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 7,029,937
- Issue date Apr 18, 2006
- Seiko Epson Corporation
- Ikuya Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and a method of manufacturing the same, a circ...
- Patent number 6,873,054
- Issue date Mar 29, 2005
- Seiko Epson Corporation
- Ikuya Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same, circuit...
- Patent number 6,841,849
- Issue date Jan 11, 2005
- Seiko Epson Corporation
- Ikuya Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Soldering method, soldering device, and method and device of fabric...
- Patent number 6,732,907
- Issue date May 11, 2004
- Seiko Epson Corporation
- Ikuya Miyazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus of manufacturing electronic circuit module, an...
- Patent number 6,730,173
- Issue date May 4, 2004
- Seiko Epson Corporation
- Ikuya Miyazawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS
- Publication number 20200094558
- Publication date Mar 26, 2020
- SEIKO EPSON CORPORATION
- Ikuya MIYAZAWA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS
- Publication number 20190143690
- Publication date May 16, 2019
- SEIKO EPSON CORPORATION
- Masashi FUJIOKA
- B81 - MICRO-STRUCTURAL TECHNOLOGY
Information Patent Application
CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...
- Publication number 20150230333
- Publication date Aug 13, 2015
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...
- Publication number 20150224772
- Publication date Aug 13, 2015
- SEIKO EPSON CORPORATION
- Tsuyoshi YODA
- B32 - LAYERED PRODUCTS
Information Patent Application
LIQUID DROPLET EJECTING HEAD, PRINTING APPARATUS AND METHOD OF MANU...
- Publication number 20140085383
- Publication date Mar 27, 2014
- SEIKO EPSON CORPORATION
- Tsuyoshi Yoda
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
LIQUID DROPLET EJECTING HEAD AND PRINTING APPARATUS
- Publication number 20140085384
- Publication date Mar 27, 2014
- SEIKO EPSON CORPORATION
- Ikuya MIYAZAWA
- B41 - PRINTING LINING MACHINES TYPEWRITERS STAMPS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20040155330
- Publication date Aug 12, 2004
- SEIKO EPSON CORPORATION
- Ikuya Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same, circuit...
- Publication number 20040142574
- Publication date Jul 22, 2004
- SEIKO EPSON CORPORATION
- Ikuya Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and a method of manufacturing the same, a circ...
- Publication number 20040016942
- Publication date Jan 29, 2004
- SEIKO EPSON CORPORATION
- Ikuya Miyazawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method and apparatus of manufacturing electronic circuit module, an...
- Publication number 20020182842
- Publication date Dec 5, 2002
- SEIKO EPSON CORPORATION
- Ikuya Miyazawa
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering method, soldering device, and method and device of fabric...
- Publication number 20020130163
- Publication date Sep 19, 2002
- SEIKO EPSON CORPORATION
- Ikuya Miyazawa
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Ikuya Miyazawa

Person

Patents Grantslast 30 patents

Liquid ejecting head and liquid ejecting apparatus

MEMS device, liquid ejecting head, and liquid ejecting apparatus

Conduction structure, method of manufacturing conduction structure,...

Conduction structure, method of manufacturing conduction structure,...

Liquid droplet ejecting head, printing apparatus and method of manu...

Liquid droplet ejecting head and printing apparatus

Method of manufacturing semiconductor device, semiconductor device,...

Semiconductor device and method of manufacturing the same, circuit...

Semiconductor device and a method of manufacturing the same, a circ...

Semiconductor device and method of manufacturing the same, circuit...

Soldering method, soldering device, and method and device of fabric...

Method and apparatus of manufacturing electronic circuit module, an...

Patents Applicationslast 30 patents

LIQUID EJECTING HEAD AND LIQUID EJECTING APPARATUS

MEMS DEVICE, LIQUID EJECTING HEAD, AND LIQUID EJECTING APPARATUS

CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...

CONDUCTION STRUCTURE, METHOD OF MANUFACTURING CONDUCTION STRUCTURE,...

LIQUID DROPLET EJECTING HEAD, PRINTING APPARATUS AND METHOD OF MANU...

LIQUID DROPLET EJECTING HEAD AND PRINTING APPARATUS

Semiconductor device and method of manufacturing the same, circuit...

Semiconductor device and method of manufacturing the same, circuit...

Semiconductor device and a method of manufacturing the same, a circ...

Method and apparatus of manufacturing electronic circuit module, an...

Soldering method, soldering device, and method and device of fabric...