Il K. Shim

Person

Seoul, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Method for fabricating CuInS2 thin film by metal organic chemical v...
- Patent number 8,053,029
- Issue date Nov 8, 2011
- Samsung SDI Co., Ltd.
- Il Wun Shim
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Marking Bad printed circuit boards for semiconductor packages
- Patent number 6,021,563
- Issue date Feb 8, 2000
- Anam Semiconductor Inc.
- Young Wook Heo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing ball grid array semiconductor package
- Patent number 6,020,218
- Issue date Feb 1, 2000
- Anam Semiconductor Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package with solder balls fused on pr...
- Patent number 5,953,589
- Issue date Sep 14, 1999
- Anam Semiconductor Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flexible circuit board for ball grid array semiconductor package
- Patent number 5,864,470
- Issue date Jan 26, 1999
- Anam Semiconductor Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Unit printed circuit board carrier frame for ball grid array semico...
- Patent number 5,854,741
- Issue date Dec 29, 1998
- Amkor Electronics, Inc.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package with improved heat dissipatio...
- Patent number 5,729,432
- Issue date Mar 17, 1998
- Anam Industrial Col, Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Ball grid array semiconductor package with ring-type heat sink
- Patent number 5,708,567
- Issue date Jan 13, 1998
- Anam Industrial Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and circuit board structure for leveling solder balls in bal...
- Patent number 5,641,946
- Issue date Jun 24, 1997
- Anam Industrial Co., Ltd.
- Il Kwon Shim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mold runner removal from a substrate-based packaged electronic device
- Patent number 5,635,671
- Issue date Jun 3, 1997
- Amkor Electronics, Inc.
- Bruce J. Freyman
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR PREPARING LAYERED NANOSTRUCTURES AND LAYERED NANOSTRUCTU...
- Publication number 20080075939
- Publication date Mar 27, 2008
- Samsung Electronics Co., Ltd.
- Ho Young KWAK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR FABRICATING CuInS2 THIN FILM BY METAL ORGANIC CHEMICAL V...
- Publication number 20080012015
- Publication date Jan 17, 2008
- Samsung Electronics Co., Ltd.
- Il Wun SHIM
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

Person

Patents Grantslast 30 patents

Method for fabricating CuInS2 thin film by metal organic chemical v...

Marking Bad printed circuit boards for semiconductor packages

Method of manufacturing ball grid array semiconductor package

Ball grid array semiconductor package with solder balls fused on pr...

Flexible circuit board for ball grid array semiconductor package

Unit printed circuit board carrier frame for ball grid array semico...

Ball grid array semiconductor package with improved heat dissipatio...

Ball grid array semiconductor package with ring-type heat sink

Method and circuit board structure for leveling solder balls in bal...

Mold runner removal from a substrate-based packaged electronic device

Patents Applicationslast 30 patents

METHOD FOR PREPARING LAYERED NANOSTRUCTURES AND LAYERED NANOSTRUCTU...

METHOD FOR FABRICATING CuInS2 THIN FILM BY METAL ORGANIC CHEMICAL V...