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Il Kwon Shim
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Tempe, AZ, US
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Patents Grants
last 30 patents
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Patent Grant
Chip-scale semiconductor package of the fan-out type and method of...
Patent number
6,462,274
Issue date
Oct 8, 2002
Amkor Technology, Inc.
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
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Patent Application
PACKAGE FOR MULTIPLE INTEGRATED CIRCUITS AND METHOD OF MAKING
Publication number
20030082845
Publication date
May 1, 2003
Amkor Technology, Inc.
PAUL HOFFMAN
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
Methods Of Attaching A Sheet Of An Adhesive Film To A Substrate In...
Publication number
20020096253
Publication date
Jul 25, 2002
AMKOR Technology, Inc.,
Il Kwon Shim
H01 - BASIC ELECTRIC ELEMENTS