Il-Woon Shin

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Busan, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method of manufacturing a rigid-flexible printed circuit board
- Patent number 9,338,899
- Issue date May 10, 2016
- SAMSUNG ELECTRO-MECHANICS CO., LTD.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing rigid-flexible printed circuit board
- Patent number 8,631,567
- Issue date Jan 21, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Built-up printed circuit board with stack type via-holes
- Patent number 7,705,247
- Issue date Apr 27, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for manufacturing built-up printed circuit board with stacke...
- Patent number 7,152,318
- Issue date Dec 26, 2006
- Samsung Electro-Mechanics Co., Ltd.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
RIGID-FLEXIBLE PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING TH...
- Publication number 20140096383
- Publication date Apr 10, 2014
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je LEE
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING RIGID-FLEXIBLE PRINTED CIRCUIT BOARD
- Publication number 20100162562
- Publication date Jul 1, 2010
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Rigid-flexible printed circuit board and method of manufacturing th...
- Publication number 20080014768
- Publication date Jan 17, 2008
- Samsung Electro-Mechanics Co., Ltd.
- Yang Je Lee
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Built-up printed circuit board with stack type via-holes
- Publication number 20070039753
- Publication date Feb 22, 2007
- Samsung Electro-Mechanics CO., LTD.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Built-up printed circuit board with stacked via-holes and method fo...
- Publication number 20040112637
- Publication date Jun 17, 2004
- Samsung Electro-Mechanics CO., LTD.
- Bong-Suck Kim
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR