Ill Heoung Choi

Person

Hwaseong-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Light emitting diode, manufacturing method thereof, light emitting...
- Patent number 9,153,759
- Issue date Oct 6, 2015
- Samsung Electronics Co., Ltd.
- Hak Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for light emitting device package, light emitting device...
- Patent number 9,099,332
- Issue date Aug 4, 2015
- Samsung Electronics Co., Ltd.
- Kyung-mi Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Illumination apparatus employing light-emitting device package
- Patent number 8,840,265
- Issue date Sep 23, 2014
- Samsung Electronics Co., Ltd.
- Kyung-mi Moon
- F21 - LIGHTING
Information Patent Grant
Illumination apparatus employing light-emitting device package
- Patent number 8,807,786
- Issue date Aug 19, 2014
- Samsung Electronics Co., Ltd.
- Kyung-mi Moon
- F21 - LIGHTING
Information Patent Grant
Light emitting diode, manufacturing method thereof, light emitting...
- Patent number 8,785,953
- Issue date Jul 22, 2014
- Samsung Electronics Co., Ltd.
- Hak Hwan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for light emitting device package, light emitting device...
- Patent number 8,638,037
- Issue date Jan 28, 2014
- Samsung Electronics Co., Ltd.
- Kyung-mi Moon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame for chip package, chip package, package module, and illu...
- Patent number 8,455,889
- Issue date Jun 4, 2013
- Samsung Electronics Co., Ltd.
- Young-jin Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fuse circuit on cell region and method...
- Patent number 7,368,330
- Issue date May 6, 2008
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with semiconductor chips stacked therein and...
- Patent number 7,115,441
- Issue date Oct 3, 2006
- Samsung Electronics Co., Ltd.
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Duel die package
- Patent number 6,864,566
- Issue date Mar 8, 2005
- Samsung Electronics Co., Ltd.
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package having a semiconductor chip with center...
- Patent number 6,855,575
- Issue date Feb 15, 2005
- Samsung Electronics Co., Ltd.
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having fuse circuit on cell region and method...
- Patent number 6,825,511
- Issue date Nov 30, 2004
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package with semiconductor chips stacked therein and...
- Patent number 6,781,240
- Issue date Aug 24, 2004
- Samsung Electronics Co., Ltd.
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Stack semiconductor chip package and lead frame
- Patent number 6,724,074
- Issue date Apr 20, 2004
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip package
- Patent number 6,445,077
- Issue date Sep 3, 2002
- Samsung Electronics Co., Ltd.
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING...
- Publication number 20140299906
- Publication date Oct 9, 2014
- Hak Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE...
- Publication number 20140103371
- Publication date Apr 17, 2014
- Samsung Electronics Co., Ltd.
- Kyung-mi MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DEVICE (LED), MANUFACTURING METHOD THEREOF, AND LED...
- Publication number 20130092962
- Publication date Apr 18, 2013
- Samsung Electronics Co., Ltd.
- Ho Sun Paek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING...
- Publication number 20120241797
- Publication date Sep 27, 2012
- Hak Hwan KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ILLUMINATION APPARATUS EMPLOYING LIGHT-EMITTING DEVICE PACKAGE
- Publication number 20110267814
- Publication date Nov 3, 2011
- Kyung-mi Moon
- F21 - LIGHTING
Information Patent Application
LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE...
- Publication number 20110260646
- Publication date Oct 27, 2011
- Kyung-mi MOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD...
- Publication number 20080160682
- Publication date Jul 3, 2008
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having fuse circuit on cell region and method...
- Publication number 20050054155
- Publication date Mar 10, 2005
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with semiconductor chips stacked therein and...
- Publication number 20040241908
- Publication date Dec 2, 2004
- SAMSUNG ELECTRONICS CO., LTD.
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Stack semiconductor chip package and lead frame
- Publication number 20030122239
- Publication date Jul 3, 2003
- Samsung Electronics, Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device having fuse circuit on cell region and method...
- Publication number 20030085446
- Publication date May 8, 2003
- Samsung Electronics Co., Ltd.
- Young-Hee Song
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dual die package
- Publication number 20030038348
- Publication date Feb 27, 2003
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor package with semiconductor chips stacked therein and...
- Publication number 20020197769
- Publication date Dec 26, 2002
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package having a semiconductor chip with center...
- Publication number 20020185751
- Publication date Dec 12, 2002
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip stack package and fabrication method thereof
- Publication number 20020084519
- Publication date Jul 4, 2002
- Samsung Electronics Co., Ltd.
- Ill-Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor chip package having a semiconductor chip with center...
- Publication number 20020030259
- Publication date Mar 14, 2002
- Ill Heung Choi
- H01 - BASIC ELECTRIC ELEMENTS

Ill Heoung Choi

Person

Patents Grantslast 30 patents

Light emitting diode, manufacturing method thereof, light emitting...

Lead frame for light emitting device package, light emitting device...

Illumination apparatus employing light-emitting device package

Illumination apparatus employing light-emitting device package

Light emitting diode, manufacturing method thereof, light emitting...

Lead frame for light emitting device package, light emitting device...

Lead frame for chip package, chip package, package module, and illu...

Semiconductor device having fuse circuit on cell region and method...

Semiconductor package with semiconductor chips stacked therein and...

Duel die package

Semiconductor chip package having a semiconductor chip with center...

Semiconductor device having fuse circuit on cell region and method...

Semiconductor package with semiconductor chips stacked therein and...

Stack semiconductor chip package and lead frame

Semiconductor chip package

Patents Applicationslast 30 patents

LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING...

LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE...

LIGHT EMITTING DEVICE (LED), MANUFACTURING METHOD THEREOF, AND LED...

LIGHT EMITTING DIODE, MANUFACTURING METHOD THEREOF, LIGHT EMITTING...

ILLUMINATION APPARATUS EMPLOYING LIGHT-EMITTING DEVICE PACKAGE

LEAD FRAME FOR LIGHT EMITTING DEVICE PACKAGE, LIGHT EMITTING DEVICE...

SEMICONDUCTOR DEVICE HAVING FUSE CIRCUIT ON CELL REGION AND METHOD...

Semiconductor device having fuse circuit on cell region and method...

Semiconductor package with semiconductor chips stacked therein and...

Stack semiconductor chip package and lead frame

Semiconductor device having fuse circuit on cell region and method...

Dual die package

Semiconductor package with semiconductor chips stacked therein and...

Semiconductor chip package having a semiconductor chip with center...

Semiconductor chip stack package and fabrication method thereof

Semiconductor chip package having a semiconductor chip with center...