Ilyoung Han

Person

Uiwang-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 12,224,262
- Issue date Feb 11, 2025
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus and method of manufacturing semiconduct...
- Patent number 11,990,444
- Issue date May 21, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and driving method thereof
- Patent number 11,984,345
- Issue date May 14, 2024
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of determining a critical temperature of a semiconductor pac...
- Patent number 11,942,344
- Issue date Mar 26, 2024
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate processing apparatus and driving method thereof
- Patent number 11,651,990
- Issue date May 16, 2023
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate debonding apparatus
- Patent number 11,581,202
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor manufacturing apparatus including a beam shaper for s...
- Patent number 11,462,410
- Issue date Oct 4, 2022
- Samsung Electronics Co., Ltd.
- Nohsung Kwak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor manufacturing apparatus
- Patent number 11,430,679
- Issue date Aug 30, 2022
- Samsung Electronics Co., Ltd.
- Kwangnam Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate bonding apparatus
- Patent number 10,923,452
- Issue date Feb 16, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding method, bonding apparatus, and method for manufacturing sub...
- Patent number 9,640,507
- Issue date May 2, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonding apparatus and substrate manufacturing equipment including t...
- Patent number 9,553,069
- Issue date Jan 24, 2017
- Samsung Electronics Co., Ltd.
- Ilyoung Han
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus of manufacturing semiconductor packages and methods of ma...
- Patent number 9,245,787
- Issue date Jan 26, 2016
- Samsung Electronics Co., Ltd.
- Chang-Seong Jeon
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20240266317
- Publication date Aug 8, 2024
- Samsung Electronics Co., Ltd.
- Taeyeong Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...
- Publication number 20240170445
- Publication date May 23, 2024
- Samsung Electronics Co., Ltd.
- Juno Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND DRIVING METHOD THEREOF
- Publication number 20230253236
- Publication date Aug 10, 2023
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIE ALIGNMENT METHOD USING MAGNETIC FORCE
- Publication number 20230178280
- Publication date Jun 8, 2023
- Samsung Electronics Co., Ltd.
- Sumin KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF DETERMINING A CRITICAL TEMPERATURE OF A SEMICONDUCTOR PAC...
- Publication number 20220102172
- Publication date Mar 31, 2022
- Samsung Electronics Co., Ltd.
- ILYOUNG HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE DEBONDING APPARATUS
- Publication number 20210358778
- Publication date Nov 18, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING A BEAM SHAPER FOR S...
- Publication number 20210082704
- Publication date Mar 18, 2021
- Samsung Electronics Co., Ltd.
- Nohsung Kwak
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
- Publication number 20210057373
- Publication date Feb 25, 2021
- SAMSUNG ELECTRONICS CO,. LTD.
- TAEYEONG KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MANUFACTURING APPARATUS
- Publication number 20210035830
- Publication date Feb 4, 2021
- Samsung Electronics Co., Ltd.
- Kwangnam KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE PROCESSING APPARATUS AND DRIVING METHOD THEREOF
- Publication number 20210005504
- Publication date Jan 7, 2021
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBSTRATE BONDING APPARATUS
- Publication number 20200373274
- Publication date Nov 26, 2020
- Samsung Electronics Co., Ltd.
- Ilyoung HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING T...
- Publication number 20160118362
- Publication date Apr 28, 2016
- Samsung Electronics Co., Ltd.
- ILYOUNG HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
BONDING METHOD, BONDING APPARATUS, AND METHOD FOR MANUFACTURING SUB...
- Publication number 20150053350
- Publication date Feb 26, 2015
- ILYOUNG HAN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS OF MANUFACTURING SEMICONDUCTOR PACKAGES AND METHODS OF MA...
- Publication number 20120313332
- Publication date Dec 13, 2012
- Chang-Seong Jeon
- H01 - BASIC ELECTRIC ELEMENTS

Ilyoung Han

Person

Patents Grantslast 30 patents

Substrate bonding apparatus and method of manufacturing semiconduct...

Substrate bonding apparatus and method of manufacturing semiconduct...

Substrate processing apparatus and driving method thereof

Method of determining a critical temperature of a semiconductor pac...

Substrate processing apparatus and driving method thereof

Substrate debonding apparatus

Semiconductor manufacturing apparatus including a beam shaper for s...

Semiconductor manufacturing apparatus

Substrate bonding apparatus

Bonding method, bonding apparatus, and method for manufacturing sub...

Bonding apparatus and substrate manufacturing equipment including t...

Apparatus of manufacturing semiconductor packages and methods of ma...

Patents Applicationslast 30 patents

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SEMICONDUCTOR...

SUBSTRATE PROCESSING APPARATUS AND DRIVING METHOD THEREOF

DIE ALIGNMENT METHOD USING MAGNETIC FORCE

METHOD OF DETERMINING A CRITICAL TEMPERATURE OF A SEMICONDUCTOR PAC...

SUBSTRATE DEBONDING APPARATUS

SEMICONDUCTOR MANUFACTURING APPARATUS INCLUDING A BEAM SHAPER FOR S...

SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...

SEMICONDUCTOR MANUFACTURING APPARATUS

SUBSTRATE PROCESSING APPARATUS AND DRIVING METHOD THEREOF

SUBSTRATE BONDING APPARATUS

BONDING APPARATUS AND SUBSTRATE MANUFACTURING EQUIPMENT INCLUDING T...

BONDING METHOD, BONDING APPARATUS, AND METHOD FOR MANUFACTURING SUB...

APPARATUS OF MANUFACTURING SEMICONDUCTOR PACKAGES AND METHODS OF MA...