In-De Ou

Person

Kaohsiung, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Carrier with embedded component and method for fabricating the same
- Patent number 8,000,107
- Issue date Aug 16, 2011
- Advanced Semiconductor Engineering, Inc.
- Yung-Hui Wang
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electronic package
- Patent number 7,586,184
- Issue date Sep 8, 2009
- Advanced Semiconductor Engineering, Inc.
- Chih Pin Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame package structure with high density of lead pins arrange...
- Patent number 7,256,480
- Issue date Aug 14, 2007
- Advanced Semiconductor Engineering, Inc.
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Circuit substrate and fabrication method thereof
- Patent number 7,060,595
- Issue date Jun 13, 2006
- Advanced Semiconductor Engineering, Inc.
- In-De Ou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Thermally enhanced semiconductor build-up package
- Patent number 6,750,397
- Issue date Jun 15, 2004
- Advanced Semiconductor Engineering, Inc.
- In-De Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a build-up package of a semiconductor
- Patent number 6,701,614
- Issue date Mar 9, 2004
- Advanced Semiconductor Engineering Inc.
- Yi-Chuan Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor build-up package
- Patent number 6,680,529
- Issue date Jan 20, 2004
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Carrier with embedded component and method for fabricating the same
- Publication number 20080273313
- Publication date Nov 6, 2008
- Advanced Semiconductor Engineering, Inc.
- Yung-Hui Wang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
ELECTRONIC PACKAGE
- Publication number 20080145589
- Publication date Jun 19, 2008
- Advanced Semiconductor Engineering, Inc.
- Chih Pin Hung
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
LEAD FRAME PACKAGE STRUCTURE WITH HIGH DENSITY OF LEAD PINS ARRANGE...
- Publication number 20070080431
- Publication date Apr 12, 2007
- Chih-Pin Hung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit substrate and fabrication method thereof
- Publication number 20040080052
- Publication date Apr 29, 2004
- Advanced Semiconductor Engineering, Inc.
- In-De Ou
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor build-up package
- Publication number 20030157747
- Publication date Aug 21, 2003
- Advanced Semiconductor Engineering, Inc.
- Kun-Ching Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a build-up package of a semiconductor die and str...
- Publication number 20030156402
- Publication date Aug 21, 2003
- Advanced Semiconductor Engineering, Inc.
- Yi-Chuan Ding
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Thermally enhanced semiconductor build-up package
- Publication number 20030155145
- Publication date Aug 21, 2003
- Advanced Semiconductor Engineering, Inc.
- In-De Ou
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of making printed circuit board
- Publication number 20020189091
- Publication date Dec 19, 2002
- Advanced Semiconductor Engineering, Inc.
- Yi Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Flip chip process
- Publication number 20020081771
- Publication date Jun 27, 2002
- Yi-Chuan Ding
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Carrier with embedded component and method for fabricating the same

Electronic package

Lead frame package structure with high density of lead pins arrange...

Circuit substrate and fabrication method thereof

Thermally enhanced semiconductor build-up package

Method for making a build-up package of a semiconductor

Semiconductor build-up package

Patents Applicationslast 30 patents

Carrier with embedded component and method for fabricating the same

ELECTRONIC PACKAGE

LEAD FRAME PACKAGE STRUCTURE WITH HIGH DENSITY OF LEAD PINS ARRANGE...

Circuit substrate and fabrication method thereof

Semiconductor build-up package

Method for making a build-up package of a semiconductor die and str...

Thermally enhanced semiconductor build-up package

Method of making printed circuit board

Flip chip process