In Ho Hyun

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Kiheung, KR

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Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing known good die array having solder bumps
- Patent number 5,940,680
- Issue date Aug 17, 1999
- SamSung Electronics Co., Ltd.
- Kyu Jin Lee
- G01 - MEASURING TESTING
Information Patent Grant
Test socket and method for producing known good dies using the test...
- Patent number 5,644,247
- Issue date Jul 1, 1997
- Samsung Electronics Co., Ltd.
- In Ho Hyun
- G01 - MEASURING TESTING