In Seob BAE

Person

Changwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Lead frame
- Patent number 12,341,086
- Issue date Jun 24, 2025
- HAESUNG DS CO., LTD
- Dong Jin Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 11,876,012
- Issue date Jan 16, 2024
- HAESUNG DS CO., LTD.
- Sung Il Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing circuit board
- Patent number 11,854,830
- Issue date Dec 26, 2023
- HAESUNG DS CO., LTD.
- Dong Jin Yoon
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method of fabricating carrier for wafer level package by using lead...
- Patent number 11,227,775
- Issue date Jan 18, 2022
- HAESUNGDS CO., LTD.
- Dong Young Pyeon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 10,910,299
- Issue date Feb 2, 2021
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing semiconductor package substrate
- Patent number 10,840,161
- Issue date Nov 17, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and method for manufacturing same
- Patent number 10,840,170
- Issue date Nov 17, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package substrate and semicon...
- Patent number 10,811,302
- Issue date Oct 20, 2020
- HAESUNG DS CO., LTD.
- Sung II Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and method for manufacturing same
- Patent number 10,643,932
- Issue date May 5, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package substrate and manufacturing method therefor
- Patent number 10,643,933
- Issue date May 5, 2020
- HAESUNG DS CO., LTD.
- In Seob Bae
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing semiconductor package substrate with limite...
- Patent number 9,460,986
- Issue date Oct 4, 2016
- HAESUNG DS CO., LTD.
- Sung Il Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, semiconductor package including the lead frame, and met...
- Patent number 9,171,789
- Issue date Oct 27, 2015
- HAESUNG DS CO., LTD.
- Dong-Il Shin
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

Patents Applicationslast 30 patents

Information Patent Application
METHOD OF MANUFACTURING LEAD FRAME
- Publication number 20250006508
- Publication date Jan 2, 2025
- HAESUNG DS CO., LTD.
- Gwang Ryeol PARK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME
- Publication number 20230102887
- Publication date Mar 30, 2023
- HAESUNG DS CO., LTD.
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME,...
- Publication number 20230080101
- Publication date Mar 16, 2023
- HAESUNG DS CO., LTD.
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAM...
- Publication number 20220285251
- Publication date Sep 8, 2022
- HAESUNG DS CO., LTD.
- Wonbin Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR GRINDING SURFACE OF SUBSTRATE
- Publication number 20220274223
- Publication date Sep 1, 2022
- HAESUNG DS CO., LTD.
- Jong Hoe Ku
- B24 - GRINDING POLISHING
Information Patent Application
METHOD OF MANUFACTURING CIRCUIT BOARD
- Publication number 20210217629
- Publication date Jul 15, 2021
- HAESUNG DS CO., LTD
- Dong Jin YOON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS FOR AND METHOD OF POLISHING SURFACE OF SUBSTRATE
- Publication number 20210107094
- Publication date Apr 15, 2021
- HAESUNG DS CO., LTD
- Sung Il KANG
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...
- Publication number 20210098268
- Publication date Apr 1, 2021
- HAESUNG DS CO., LTD
- Dong Young PYEON
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
- Publication number 20200411362
- Publication date Dec 31, 2020
- HAESUNG DS CO., LTD
- Sung Il KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20200227344
- Publication date Jul 16, 2020
- HAESUNG DS CO., LTD
- In Seob BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE
- Publication number 20200168521
- Publication date May 28, 2020
- HAESUNG DS CO., LTD. ?
- In Seob BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
- Publication number 20190267315
- Publication date Aug 29, 2019
- HAESUNG DS CO., LTD
- In Seob BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR
- Publication number 20190122968
- Publication date Apr 25, 2019
- Haesung DS CO., Ltd.
- In Seob BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
- Publication number 20190067082
- Publication date Feb 28, 2019
- HAESUNG DS CO., LTD
- Sung Il KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME
- Publication number 20190057930
- Publication date Feb 21, 2019
- HAESUNG DS CO., LTD
- In Seob BAE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...
- Publication number 20150194323
- Publication date Jul 9, 2015
- HAESUNG DS CO., LTD
- Sung Il KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE LEAD FRAME, AND MET...
- Publication number 20140252580
- Publication date Sep 11, 2014
- Samsung Techwin Co., Ltd.
- Dong-Il SHIN
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR

In Seob BAE

Person

Patents Grantslast 30 patents

Lead frame

Method of manufacturing semiconductor package substrate and semicon...

Method of manufacturing circuit board

Method of fabricating carrier for wafer level package by using lead...

Method of manufacturing semiconductor package substrate and semicon...

Method for manufacturing semiconductor package substrate

Semiconductor package substrate and method for manufacturing same

Method of manufacturing semiconductor package substrate and semicon...

Semiconductor package substrate and method for manufacturing same

Semiconductor package substrate and manufacturing method therefor

Method of manufacturing semiconductor package substrate with limite...

Lead frame, semiconductor package including the lead frame, and met...

Patents Applicationslast 30 patents

METHOD OF MANUFACTURING LEAD FRAME

LEAD FRAME

SEMICONDUCTOR PACKAGE SUBSTRATE, METHOD OF MANUFACTURING THE SAME,...

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD OF MANUFACTURING THE SAM...

APPARATUS FOR GRINDING SURFACE OF SUBSTRATE

METHOD OF MANUFACTURING CIRCUIT BOARD

APPARATUS FOR AND METHOD OF POLISHING SURFACE OF SUBSTRATE

METHOD OF FABRICATING CARRIER FOR WAFER LEVEL PACKAGE BY USING LEAD...

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

METHOD FOR MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...

SEMICONDUCTOR PACKAGE SUBSTRATE AND MANUFACTURING METHOD THEREFOR

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...

SEMICONDUCTOR PACKAGE SUBSTRATE AND METHOD FOR MANUFACTURING SAME

METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE SUBSTRATE AND SEMICON...

LEAD FRAME, SEMICONDUCTOR PACKAGE INCLUDING THE LEAD FRAME, AND MET...