In Soo Kang

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Chungbuk, KR

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Patents Grantslast 30 patents

Information Patent Grant
Flip chip semiconductor package and fabrication method thereof
- Patent number 8,093,721
- Issue date Jan 10, 2012
- Nepes Corporation
- In-Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
FLIP CHIP SEMICONDUCTOR PACKAGE AND FABRICATION METHOD THEREOF
- Publication number 20100230810
- Publication date Sep 16, 2010
- In-Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP WITH SOLDER BUMP SUPPRESSING GROWTH OF INTER-MET...
- Publication number 20090020871
- Publication date Jan 22, 2009
- NEPES CORPORATION
- In Soo Kang
- H01 - BASIC ELECTRIC ELEMENTS