In Suk Kim

Person

Sommerville Park, SG

People

Patents Grantslast 30 patents

Information Patent Grant
Planarized passivation layer for semiconductor devices
- Patent number 8,264,088
- Issue date Sep 11, 2012
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Sin Leng Lim
- G02 - OPTICS
Information Patent Grant
Folded lands and vias for multichip semiconductor packages
- Patent number 8,072,051
- Issue date Dec 6, 2011
- Fairchild Semiconductor Corporation
- Manolito Galera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Planarized passivation layer for semiconductor devices
- Patent number 7,998,831
- Issue date Aug 16, 2011
- GLOBALFOUNDRIES Singapore Pte. Ltd.
- Sin Leng Lim
- G02 - OPTICS

Patents Applicationslast 30 patents

Information Patent Application
PLANARIZED PASSIVATION LAYER FOR SEMICONDUCTOR DEVICES
- Publication number 20110266688
- Publication date Nov 3, 2011
- GLOBALFOUNDRIES SINGAPORE PTE. LTD.
- Sin Leng LIM
- G02 - OPTICS
Information Patent Application
MOBILE TANGIBLE VALUE BANKING SYSTEM
- Publication number 20110270744
- Publication date Nov 3, 2011
- Ginger Baker
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR PACKAGES WITH EMBEDDED HEAT SINK
- Publication number 20110163428
- Publication date Jul 7, 2011
- Manolito Fabres Galera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FOLDED LANDS AND VIAS FOR MULTICHIP SEMICONDUCTOR PACKAGES
- Publication number 20110062568
- Publication date Mar 17, 2011
- Manolito Galera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEM AND METHOD FOR PROVIDING AUTHENTICATION FOR CARD NOT PRESENT...
- Publication number 20100312703
- Publication date Dec 9, 2010
- Ashish Kulpati
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE
- Publication number 20100276793
- Publication date Nov 4, 2010
- Manolito Galera
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLANARIZED PASSIVATION LAYER FOR SEMICONDUCTOR DEVICES
- Publication number 20080246159
- Publication date Oct 9, 2008
- CHARTERED SEMICONDUCTOR MANUFACTURING, LTD.
- Sin Leng LIM
- G02 - OPTICS

Person

Patents Grantslast 30 patents

Planarized passivation layer for semiconductor devices

Folded lands and vias for multichip semiconductor packages

Planarized passivation layer for semiconductor devices

Patents Applicationslast 30 patents

PLANARIZED PASSIVATION LAYER FOR SEMICONDUCTOR DEVICES

MOBILE TANGIBLE VALUE BANKING SYSTEM

SEMICONDUCTOR PACKAGES WITH EMBEDDED HEAT SINK

FOLDED LANDS AND VIAS FOR MULTICHIP SEMICONDUCTOR PACKAGES

SYSTEM AND METHOD FOR PROVIDING AUTHENTICATION FOR CARD NOT PRESENT...

HIGH PIN DENSITY SEMICONDUCTOR SYSTEM-IN-A-PACKAGE

PLANARIZED PASSIVATION LAYER FOR SEMICONDUCTOR DEVICES