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Inbae Chang

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  • Chuncheon-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Substrate bonding apparatus
    • Patent number 11,581,188
    • Issue date Feb 14, 2023
    • Samsung Electronics Co., Ltd.
    • Junhyung Kim
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

  • Information Patent Application

    SUBSTRATE BONDING APPARATUS
    • Publication number 20210104405
    • Publication date Apr 8, 2021
    • KNU-INDUSTRY COOPERATION FOUNDATION
    • Junhyung Kim
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR