Inderjit Singh

Person

San Jose, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Method for producing a semiconductor die package using leadframe wi...
- Patent number 6,890,793
- Issue date May 10, 2005
- Fairchild Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Flip chip with solder pre-plated leadframe including locating holes
- Patent number 6,580,165
- Issue date Jun 17, 2003
- Fairchild Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
PTC fuse including external heat source
- Patent number 6,489,879
- Issue date Dec 3, 2002
- National Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging fuses
- Patent number 6,459,143
- Issue date Oct 1, 2002
- National Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-station rotary die handling device
- Patent number 6,364,089
- Issue date Apr 2, 2002
- National Semiconductor Corporation
- Inderjit Singh
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Bond pad sealing using wire bonding
- Patent number 6,278,191
- Issue date Aug 21, 2001
- National Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of packaging fuses
- Patent number 6,255,141
- Issue date Jul 3, 2001
- National Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method and apparatus for ultra-fine pitch wire bonding
- Patent number 6,213,378
- Issue date Apr 10, 2001
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method and apparatus for fine pitch wire bonding
- Patent number 6,065,667
- Issue date May 23, 2000
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Wire bonding methods and apparatus for heat sensitive metallization...
- Patent number 6,031,216
- Issue date Feb 29, 2000
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Encapsulated ball bonding apparatus and method
- Patent number 5,938,105
- Issue date Aug 17, 1999
- National Semiconductor Corporation
- Inderjit Singh
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bonding wire inductor for use in an integrated circuit package and...
- Patent number 5,886,393
- Issue date Mar 23, 1999
- National Semiconductor Corporation
- Richard Billings Merrill
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Solution to mold wire sweep in fine pitch devices
- Patent number 5,780,772
- Issue date Jul 14, 1998
- National Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Flip chip with solder pre-plated leadframe including locating holes
- Publication number 20030178717
- Publication date Sep 25, 2003
- Fairchild Semiconductor Corporation
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of packaging fuses
- Publication number 20010015477
- Publication date Aug 23, 2001
- Inderjit Singh
- H01 - BASIC ELECTRIC ELEMENTS

Inderjit Singh

Person

Patents Grantslast 30 patents

Method for producing a semiconductor die package using leadframe wi...

Flip chip with solder pre-plated leadframe including locating holes

PTC fuse including external heat source

Method of packaging fuses

Multi-station rotary die handling device

Bond pad sealing using wire bonding

Method of packaging fuses

Method and apparatus for ultra-fine pitch wire bonding

Method and apparatus for fine pitch wire bonding

Wire bonding methods and apparatus for heat sensitive metallization...

Encapsulated ball bonding apparatus and method

Bonding wire inductor for use in an integrated circuit package and...

Solution to mold wire sweep in fine pitch devices

Patents Applicationslast 30 patents

Flip chip with solder pre-plated leadframe including locating holes

Method of packaging fuses