Inessa Obenhuber

Person

San Francsco, CA, US

People

Patents Applicationslast 30 patents

Information Patent Application
MULTI-SURFACE IC PACKAGING STRUCTURES
- Publication number 20110215475
- Publication date Sep 8, 2011
- Interconnect Portfollo LLC
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-Surface IC Packaging Structures and Methods for their Manufac...
- Publication number 20100221871
- Publication date Sep 2, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Low Profile Discrete Electronic Components and Applications of Same
- Publication number 20100165525
- Publication date Jul 1, 2010
- Interconnect Portfolio LLC
- Joseph C. Fjelstad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Partitioned Integrated Circuit Package with Central Clock Driver
- Publication number 20090091017
- Publication date Apr 9, 2009
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-surface IC packaging structures and methods for their manufac...
- Publication number 20060157846
- Publication date Jul 20, 2006
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-surface contact IC packaging structures and assemblies
- Publication number 20050093152
- Publication date May 5, 2005
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Multi-surface IC packaging structures and methods for their manufac...
- Publication number 20050093127
- Publication date May 5, 2005
- Joseph C. Fjelstad
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Refinement of a search query based on information stored on a local...
- Publication number 20050091205
- Publication date Apr 28, 2005
- Jeffrey Alan Joseph Sidlosky
- G06 - COMPUTING CALCULATING COUNTING

Inessa Obenhuber

Person

Patents Applicationslast 30 patents

MULTI-SURFACE IC PACKAGING STRUCTURES

Multi-Surface IC Packaging Structures and Methods for their Manufac...

Low Profile Discrete Electronic Components and Applications of Same

Partitioned Integrated Circuit Package with Central Clock Driver

Multi-surface IC packaging structures and methods for their manufac...

Multi-surface contact IC packaging structures and assemblies

Multi-surface IC packaging structures and methods for their manufac...

Refinement of a search query based on information stored on a local...