Ing-Ming Lee

Person

Hsinchu, TW

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor devices having conductive pad structures with multi-b...
- Patent number 12,051,659
- Issue date Jul 30, 2024
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of fabricating semiconductor devices having conductive pad...
- Patent number 11,688,703
- Issue date Jun 27, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical plating system and method of using
- Patent number 11,598,016
- Issue date Mar 7, 2023
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods of fabricating semiconductor devices having conductive pad...
- Patent number 11,309,265
- Issue date Apr 19, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Po-Hsun Huang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electrochemical plating system and method of using
- Patent number 11,230,784
- Issue date Jan 25, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Metal shielding layer in backside illumination image sensor chips a...
- Patent number 11,018,176
- Issue date May 25, 2021
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal shielding layer in backside illumination image sensor chips a...
- Patent number 10,276,621
- Issue date Apr 30, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal shielding layer in backside illumination image sensor chips a...
- Patent number 9,620,555
- Issue date Apr 11, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metal shielding layer in backside illumination image sensor chips a...
- Patent number 9,224,773
- Issue date Dec 29, 2015
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Image sensor cross-talk reduction system and method
- Patent number 8,759,928
- Issue date Jun 24, 2014
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-B...
- Publication number 20230275049
- Publication date Aug 31, 2023
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD...
- Publication number 20220238467
- Publication date Jul 28, 2022
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Po-Hsun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING
- Publication number 20220042197
- Publication date Feb 10, 2022
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING
- Publication number 20200173051
- Publication date Jun 4, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Jun-Nan Nian
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD...
- Publication number 20200035628
- Publication date Jan 30, 2020
- Taiwan Semiconductor Manufacturing Co., Ltd.
- Po-Hsun HUANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Shielding Layer in Backside Illumination Image Sensor Chips a...
- Publication number 20190252427
- Publication date Aug 15, 2019
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Shielding Layer in Backside Illumination Image Sensor Chips a...
- Publication number 20170213861
- Publication date Jul 27, 2017
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Shielding Layer in Backside Illumination Image Sensor Chips a...
- Publication number 20160118434
- Publication date Apr 28, 2016
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Image Sensor Cross-Talk Reduction System and Method
- Publication number 20130264668
- Publication date Oct 10, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal Shielding Layer in Backside Illumination Image Sensor Chips a...
- Publication number 20130134541
- Publication date May 30, 2013
- Taiwan Semiconductor Manufacturing Company, Ltd.
- Shih-Chieh Chang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTRONIC APPARATUS WITH PROTECTION CIRCUIT
- Publication number 20110298289
- Publication date Dec 8, 2011
- PHILIPS & LITE-ON DIGITAL SOLUTIONS CORPORATION
- Ing-Ming Lee
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Ing-Ming Lee

Person

Patents Grantslast 30 patents

Semiconductor devices having conductive pad structures with multi-b...

Methods of fabricating semiconductor devices having conductive pad...

Electrochemical plating system and method of using

Methods of fabricating semiconductor devices having conductive pad...

Electrochemical plating system and method of using

Metal shielding layer in backside illumination image sensor chips a...

Metal shielding layer in backside illumination image sensor chips a...

Metal shielding layer in backside illumination image sensor chips a...

Metal shielding layer in backside illumination image sensor chips a...

Image sensor cross-talk reduction system and method

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD STRUCTURES WITH MULTI-B...

METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD...

ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING

ELECTROCHEMICAL PLATING SYSTEM AND METHOD OF USING

METHODS OF FABRICATING SEMICONDUCTOR DEVICES HAVING CONDUCTIVE PAD...

Metal Shielding Layer in Backside Illumination Image Sensor Chips a...

Metal Shielding Layer in Backside Illumination Image Sensor Chips a...

Metal Shielding Layer in Backside Illumination Image Sensor Chips a...

Image Sensor Cross-Talk Reduction System and Method

Metal Shielding Layer in Backside Illumination Image Sensor Chips a...

ELECTRONIC APPARATUS WITH PROTECTION CIRCUIT