Ingo Muri

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Power relay circuit
- Patent number 12,176,172
- Issue date Dec 24, 2024
- Infineon Technologies Austria AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device having semiconductor device elements in a semi...
- Patent number 12,107,130
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superjunction transistor device and method for forming a superjunct...
- Patent number 12,034,040
- Issue date Jul 9, 2024
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Superjunction transistor device
- Patent number 11,929,395
- Issue date Mar 12, 2024
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a superjunction device
- Patent number 11,894,445
- Issue date Feb 6, 2024
- Infineon Technologies Austria AG
- Daniel Tutuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of porosifying part of a semiconductor wafer
- Patent number 11,810,779
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a superjunction device
- Patent number 11,652,138
- Issue date May 16, 2023
- Infineon Technologies Austria AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device including an electrical contact with a metal l...
- Patent number 11,552,048
- Issue date Jan 10, 2023
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for partially removing a semiconductor wafer
- Patent number 11,404,262
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a superjunction transistor device
- Patent number 11,348,838
- Issue date May 31, 2022
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor chip including back-side conductive layer
- Patent number 11,328,955
- Issue date May 10, 2022
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming a superjunction transistor device
- Patent number 11,189,690
- Issue date Nov 30, 2021
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power relay circuit
- Patent number 11,139,125
- Issue date Oct 5, 2021
- Infineon Technologies Austria AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 11,038,028
- Issue date Jun 15, 2021
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 11,011,409
- Issue date May 18, 2021
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle and exposure method including projection of a reticle patte...
- Patent number 10,802,404
- Issue date Oct 13, 2020
- Infineon Technologies AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor chip including self-aligned, back-side conductive lay...
- Patent number 10,784,161
- Issue date Sep 22, 2020
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor wafer including a porous lay...
- Patent number 10,714,377
- Issue date Jul 14, 2020
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 10,535,553
- Issue date Jan 14, 2020
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device comprising etching...
- Patent number 10,497,583
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer contacting device, and arrangement and method for electrochem...
- Patent number 10,373,839
- Issue date Aug 6, 2019
- Infineon Technologies AG
- Friedrich Kroener
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer thinning and realizing backside metal structures
- Patent number 10,325,804
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithically integrated chip including active electrical componen...
- Patent number 10,199,372
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for providing a planarizable workpiece support, a workpiece...
- Patent number 10,199,255
- Issue date Feb 5, 2019
- Infineon Technologioes AG
- Ingo Muri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device and methods for forming a plurality of semicon...
- Patent number 10,074,566
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Johannes Baumgartl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thinning substrates
- Patent number 10,049,914
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 9,960,076
- Issue date May 1, 2018
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device and semiconductor device
- Patent number 9,954,065
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with buried isolation layers and methods of formation th...
- Patent number 9,875,926
- Issue date Jan 23, 2018
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for planarizing one or more workpieces, a workpiece planariz...
- Patent number 9,862,037
- Issue date Jan 9, 2018
- Infineon Technologies AG
- Ingo Muri
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER INCLUDING A TEST STRUCTURE
- Publication number 20250112097
- Publication date Apr 3, 2025
- Infineon Technologies Austria AG
- Nicole Schulze-Ollmert
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERJUNCTION TRANSISTOR DEVICE
- Publication number 20240321953
- Publication date Sep 26, 2024
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUPERJUNCTION DEVICE
- Publication number 20240128356
- Publication date Apr 18, 2024
- Infineon Technologies Austria AG
- Daniel Tutuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing Semiconductor Chips having a Side Wall Sealing
- Publication number 20220352048
- Publication date Nov 3, 2022
- Infineon Technologies Austria AG
- Christian Fachmann
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER
- Publication number 20220310380
- Publication date Sep 29, 2022
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Superjunction Transistor Device
- Publication number 20220270933
- Publication date Aug 25, 2022
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TRANSISTOR DEVICE AND METHOD OF MANUFACTURING
- Publication number 20220246744
- Publication date Aug 4, 2022
- INFINEON TECHNOLOGIES AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERJUNCTION TRANSISTOR DEVICE
- Publication number 20220052154
- Publication date Feb 17, 2022
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Superjunction Device
- Publication number 20220052182
- Publication date Feb 17, 2022
- Daniel Tutuc
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Relay Circuit
- Publication number 20210407746
- Publication date Dec 30, 2021
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING
- Publication number 20210391218
- Publication date Dec 16, 2021
- Felix Johannes Heinrich Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...
- Publication number 20210391377
- Publication date Dec 16, 2021
- Alexander Frey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A SUPERJUNCTION DEVICE
- Publication number 20210376064
- Publication date Dec 2, 2021
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPERJUNCTION TRANSISTOR DEVICE AND METHOD FOR FORMING A SUPERJUNCT...
- Publication number 20210376063
- Publication date Dec 2, 2021
- Infineon Technologies Austria AG
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR DEVICE ELEMENTS IN A SEMI...
- Publication number 20210265468
- Publication date Aug 26, 2021
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL L...
- Publication number 20210167036
- Publication date Jun 3, 2021
- INFINEON TECHNOLOGIES AG
- Oliver HELLMUND
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Superjunction Transistor Device
- Publication number 20200395252
- Publication date Dec 17, 2020
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR CHIP INCLUDING BACK-SIDE CONDUCTIVE LAYER
- Publication number 20200365457
- Publication date Nov 19, 2020
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Forming a Superjunction Transistor Device
- Publication number 20200194547
- Publication date Jun 18, 2020
- Hans Weber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Partially Removing a Semiconductor Wafer
- Publication number 20200168449
- Publication date May 28, 2020
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Power Relay Circuit
- Publication number 20200161062
- Publication date May 21, 2020
- Infineon Technologies Austria AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20200098617
- Publication date Mar 26, 2020
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method
- Publication number 20190348506
- Publication date Nov 14, 2019
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Chip Including Self-Aligned, Back-Side Conductive Lay...
- Publication number 20190096758
- Publication date Mar 28, 2019
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Semiconductor Wafer Including a Porous Lay...
- Publication number 20190074212
- Publication date Mar 7, 2019
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED CHIP INCLUDING ACTIVE ELECTRICAL COMPONEN...
- Publication number 20180374843
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Thinning Substrates
- Publication number 20180330981
- Publication date Nov 15, 2018
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device Comprising Etching...
- Publication number 20180277391
- Publication date Sep 27, 2018
- INFINEON TECHNOLOGIES AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETICLE AND EXPOSURE METHOD INCLUDING PROJECTION OF A RETICLE PATTE...
- Publication number 20180267408
- Publication date Sep 20, 2018
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20180233399
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Power relay circuit

Semiconductor device having semiconductor device elements in a semi...

Superjunction transistor device and method for forming a superjunct...

Superjunction transistor device

Method for producing a superjunction device

Method of porosifying part of a semiconductor wafer

Method for producing a superjunction device

Semiconductor device including an electrical contact with a metal l...

Method for partially removing a semiconductor wafer

Method for forming a superjunction transistor device

Semiconductor chip including back-side conductive layer

Method for forming a superjunction transistor device

Power relay circuit

Semiconductor device and manufacturing method

Devices with backside metal structures and methods of formation the...

Reticle and exposure method including projection of a reticle patte...

Semiconductor chip including self-aligned, back-side conductive lay...

Semiconductor device and semiconductor wafer including a porous lay...

Devices with backside metal structures and methods of formation the...

Method for manufacturing a semiconductor device comprising etching...

Wafer contacting device, and arrangement and method for electrochem...

Method of wafer thinning and realizing backside metal structures

Monolithically integrated chip including active electrical componen...

Method for providing a planarizable workpiece support, a workpiece...

Semiconductor device and methods for forming a plurality of semicon...

Method for thinning substrates

Devices with backside metal structures and methods of formation the...

Method of forming a semiconductor device and semiconductor device

Substrates with buried isolation layers and methods of formation th...

Method for planarizing one or more workpieces, a workpiece planariz...

Patents Applicationslast 30 patents

SEMICONDUCTOR WAFER INCLUDING A TEST STRUCTURE

SUPERJUNCTION TRANSISTOR DEVICE

METHOD FOR PRODUCING A SUPERJUNCTION DEVICE

Method of Manufacturing Semiconductor Chips having a Side Wall Sealing

METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER

Superjunction Transistor Device

TRANSISTOR DEVICE AND METHOD OF MANUFACTURING

SUPERJUNCTION TRANSISTOR DEVICE

Method for Producing a Superjunction Device

Power Relay Circuit

SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING

METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...

METHOD FOR PRODUCING A SUPERJUNCTION DEVICE

SUPERJUNCTION TRANSISTOR DEVICE AND METHOD FOR FORMING A SUPERJUNCT...

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR DEVICE ELEMENTS IN A SEMI...

SEMICONDUCTOR DEVICE INCLUDING AN ELECTRICAL CONTACT WITH A METAL L...

Method for Forming a Superjunction Transistor Device

SEMICONDUCTOR CHIP INCLUDING BACK-SIDE CONDUCTIVE LAYER

Method for Forming a Superjunction Transistor Device

Method for Partially Removing a Semiconductor Wafer

Power Relay Circuit

Devices with Backside Metal Structures and Methods of Formation The...

Semiconductor Device and Manufacturing Method

Semiconductor Chip Including Self-Aligned, Back-Side Conductive Lay...

Semiconductor Device and Semiconductor Wafer Including a Porous Lay...

MONOLITHICALLY INTEGRATED CHIP INCLUDING ACTIVE ELECTRICAL COMPONEN...

Method for Thinning Substrates

Method for Manufacturing a Semiconductor Device Comprising Etching...

RETICLE AND EXPOSURE METHOD INCLUDING PROJECTION OF A RETICLE PATTE...

Devices with Backside Metal Structures and Methods of Formation The...