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Inhwa Baek
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Hwaseong-si, KR
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last 30 patents
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Patent Application
SUBSTRATE BONDING APPARATUS AND METHOD OF MANUFACTURING SEMICONDUCT...
Publication number
20240242981
Publication date
Jul 18, 2024
Samsung Electronics Co., Ltd.
Sehoon JANG
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
SUBSTRATE BONDING APPARATUS
Publication number
20240153906
Publication date
May 9, 2024
Samsung Electronics Co., Ltd.
Byeongtak PARK
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PLASMA PROCESSING APPARATUS, WAFER TO WAFER BONDING SYSTEM AND WAFE...
Publication number
20240038536
Publication date
Feb 1, 2024
Samsung Electronics Co., Ltd.
YONGIN LEE
H01 - BASIC ELECTRIC ELEMENTS
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Patent Application
PLASMA PROCESSING APPARATUS, SUBSTRATE BONDING SYSTEM INCLUDING THE...
Publication number
20230215698
Publication date
Jul 6, 2023
Samsung Electronics Co., Ltd.
Inhwa Baek
H01 - BASIC ELECTRIC ELEMENTS