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Inhyo HWANG

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  • Asan-si, KR
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Patents Grantslast 30 patents

  • Information Patent Grant

    Semiconductor package and method of fabricating the same
    • Patent number 12,159,858
    • Issue date Dec 3, 2024
    • Samsung Electronics Co., Ltd.
    • Hyunsoo Chung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor package
    • Patent number 12,033,948
    • Issue date Jul 9, 2024
    • Samsung Electronics Co., Ltd.
    • Young Lyong Kim
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 11,784,171
    • Issue date Oct 10, 2023
    • Samsung Electronics Co., Ltd.
    • Ae-Nee Jang
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Grant

    Semiconductor device
    • Patent number 11,329,032
    • Issue date May 10, 2022
    • Samsung Electronics Co., Ltd.
    • Ae-Nee Jang
    • H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20250054915
    • Publication date Feb 13, 2025
    • Samsung Electronics Co., Ltd.
    • HYUNSOO CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20250046749
    • Publication date Feb 6, 2025
    • Samsung Electronics Co., Ltd.
    • Hyunsoo Chung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20250022843
    • Publication date Jan 16, 2025
    • Samsung Electronics Co., Ltd.
    • Hyunsoo Chung
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240395719
    • Publication date Nov 28, 2024
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240332200
    • Publication date Oct 3, 2024
    • Samsung Electronics Co., Ltd.
    • YOUNG LYONG KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD FOR MANUFACTURING THE SAME
    • Publication number 20240222230
    • Publication date Jul 4, 2024
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20240079340
    • Publication date Mar 7, 2024
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE MANUFACTURED THROUGH A THERMOCOMPRESSION PROC...
    • Publication number 20240063167
    • Publication date Feb 22, 2024
    • Samsung Electronics Co., Ltd.
    • Hyunsoo CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20240040805
    • Publication date Feb 1, 2024
    • Samsung Electronics Co., Ltd.
    • HYUNSOO CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20240032311
    • Publication date Jan 25, 2024
    • Samsung Electronics Co., Ltd.
    • HYUNSOO CHUNG
  • Information Patent Application

    SEMICONDUCTOR DEVICE INCLUDING DUMMY PAD
    • Publication number 20240006356
    • Publication date Jan 4, 2024
    • Samsung Electronics Co., Ltd.
    • INHYO HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230144602
    • Publication date May 11, 2023
    • Samsung Electronics Co., Ltd.
    • YOUNGLYONG KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING THROUGH-SILICON VIA AND METHOD OF F...
    • Publication number 20230126686
    • Publication date Apr 27, 2023
    • Samsung Electronics Co., Ltd.
    • INHYO HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230069511
    • Publication date Mar 2, 2023
    • Samsung Electronics Co., Ltd.
    • HYUNSOO CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20230047345
    • Publication date Feb 16, 2023
    • Samsung Electronics Co.,Ltd.
    • Inhyo HWANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
    • Publication number 20230023883
    • Publication date Jan 26, 2023
    • Samsung Electronics Co., Ltd.
    • HYUNSOO CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE INCLUDING HEAT SINKS
    • Publication number 20230005814
    • Publication date Jan 5, 2023
    • Samsung Electronics Co., Ltd.
    • HYUNSOO CHUNG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR PACKAGE
    • Publication number 20220415809
    • Publication date Dec 29, 2022
    • Samsung Electronics Co., Ltd.
    • YOUNG LYONG KIM
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20220208743
    • Publication date Jun 30, 2022
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS
  • Information Patent Application

    SEMICONDUCTOR DEVICE
    • Publication number 20210233897
    • Publication date Jul 29, 2021
    • Samsung Electronics Co., Ltd.
    • Ae-Nee JANG
    • H01 - BASIC ELECTRIC ELEMENTS