Inkeun BAEK

Person

Suwon-si, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Inspection apparatus and method of inspecting wafer
- Patent number 12,196,669
- Issue date Jan 14, 2025
- Samsung Electronics Co., Ltd.
- Martin Priwisch
- G01 - MEASURING TESTING
Information Patent Grant
Semiconductor substrate processing apparatus and semiconductor subs...
- Patent number 12,165,933
- Issue date Dec 10, 2024
- Samsung Electronics Co., Ltd.
- Inkeun Baek
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Inspection apparatus and inspection method using same
- Patent number 11,946,881
- Issue date Apr 2, 2024
- Samsung Electronics Co., Ltd.
- Martin Priwisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid probe, physical property analysis apparatus including the sa...
- Patent number 11,680,898
- Issue date Jun 20, 2023
- Samsung Electronics Co., Ltd.
- Junbum Park
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Probe for detecting near field and near-field detecting system incl...
- Patent number 11,579,168
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Ikseon Jeon
- G01 - MEASURING TESTING
Information Patent Grant
Probe for detecting near field and near-field detection system incl...
- Patent number 11,579,167
- Issue date Feb 14, 2023
- Samsung Electronics Co., Ltd.
- Jongmin Yoon
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
MATERIAL MEASUREMENT SYSTEM AND METHOD
- Publication number 20250003734
- Publication date Jan 2, 2025
- Samsung Electronics Co., Ltd.
- Sungyoon Ryu
- G01 - MEASURING TESTING
Information Patent Application
METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER
- Publication number 20240234216
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Inkeun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TERAHERTZ SIGNAL MEASURING APPARATUS AND MEASURING METHOD
- Publication number 20240230528
- Publication date Jul 11, 2024
- Samsung Electronics Co., Ltd.
- Sunhong Jun
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER
- Publication number 20240136232
- Publication date Apr 25, 2024
- Samsung Electronics Co., Ltd.
- Inkeun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE AND INSPECTION APPARATUS INCLUDING THE SAME
- Publication number 20240019362
- Publication date Jan 18, 2024
- Samsung Electronics Co., Ltd.
- Junbum Park
- G01 - MEASURING TESTING
Information Patent Application
TERAHERTZ PROBE
- Publication number 20230417820
- Publication date Dec 28, 2023
- Samsung Electronics Co., Ltd.
- Martin Priwisch
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS AND METHOD OF INSPECTING WAFER
- Publication number 20230204503
- Publication date Jun 29, 2023
- Samsung Electronics Co., Ltd.
- Martin Priwisch
- G01 - MEASURING TESTING
Information Patent Application
INSPECTION APPARATUS AND INSPECTION METHOD USING SAME
- Publication number 20220412898
- Publication date Dec 29, 2022
- Samsung Electronics Co., Ltd.
- Martin Priwisch
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTING SYSTEM INCL...
- Publication number 20220155340
- Publication date May 19, 2022
- Samsung Electronics Co., Ltd.
- Ikseon Jeon
- G01 - MEASURING TESTING
Information Patent Application
PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTION SYSTEM INCL...
- Publication number 20220082584
- Publication date Mar 17, 2022
- Samsung Electronics Co., Ltd.
- Jongmin YOON
- G01 - MEASURING TESTING
Information Patent Application
SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR SUBS...
- Publication number 20220037215
- Publication date Feb 3, 2022
- Samsung Electronics Co., Ltd.
- Inkeun BAEK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID PROBE, PHYSICAL PROPERTY ANALYSIS APPARATUS INCLUDING THE SA...
- Publication number 20220011225
- Publication date Jan 13, 2022
- Samsung Electronics Co., Ltd.
- Junbum PARK
- G01 - MEASURING TESTING

Inkeun BAEK

Person

Patents Grantslast 30 patents

Inspection apparatus and method of inspecting wafer

Semiconductor substrate processing apparatus and semiconductor subs...

Inspection apparatus and inspection method using same

Hybrid probe, physical property analysis apparatus including the sa...

Probe for detecting near field and near-field detecting system incl...

Probe for detecting near field and near-field detection system incl...

Patents Applicationslast 30 patents

MATERIAL MEASUREMENT SYSTEM AND METHOD

METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER

TERAHERTZ SIGNAL MEASURING APPARATUS AND MEASURING METHOD

METHOD OF EXTRACTING PROPERTIES OF A LAYER ON A WAFER

PROBE AND INSPECTION APPARATUS INCLUDING THE SAME

TERAHERTZ PROBE

INSPECTION APPARATUS AND METHOD OF INSPECTING WAFER

INSPECTION APPARATUS AND INSPECTION METHOD USING SAME

PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTING SYSTEM INCL...

PROBE FOR DETECTING NEAR FIELD AND NEAR-FIELD DETECTION SYSTEM INCL...

SEMICONDUCTOR SUBSTRATE PROCESSING APPARATUS AND SEMICONDUCTOR SUBS...

HYBRID PROBE, PHYSICAL PROPERTY ANALYSIS APPARATUS INCLUDING THE SA...