Inpil Yoo

Person

Unterhaching, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 12,308,364
- Issue date May 20, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dual side direct cooling semiconductor package
- Patent number 12,266,590
- Issue date Apr 1, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
High power module package structures
- Patent number 12,230,601
- Issue date Feb 18, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon Im
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Submodule semiconductor package
- Patent number 12,205,918
- Issue date Jan 21, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang Eom
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor packages using package in package systems and related...
- Patent number 11,984,424
- Issue date May 14, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 11,848,320
- Issue date Dec 19, 2023
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Power module package for direct cooling multiple power modules
- Patent number 11,430,777
- Issue date Aug 30, 2022
- Semiconductor Components Industries, LLC
- Jerome Teysseyre
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Clips for semiconductor package and related methods
- Patent number 11,264,311
- Issue date Mar 1, 2022
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Heat transfer for power modules
- Patent number 11,145,571
- Issue date Oct 12, 2021
- Semiconductor Components Industries, LLC
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Temperature sensing and fault detection for paralleled double-side...
- Patent number 10,916,931
- Issue date Feb 9, 2021
- Infineon Technologies AG
- Tomas Manuel Reiter
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor module cooling system
- Patent number 10,199,238
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of manufacturing a cooler for semiconductor modules
- Patent number 9,934,990
- Issue date Apr 3, 2018
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic cooler for semiconductor modules
- Patent number 9,613,885
- Issue date Apr 4, 2017
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic module and method of manufacturing the same
- Patent number 9,589,922
- Issue date Mar 7, 2017
- Infineon Technologies AG
- Christian Neugirg
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plastic cooler for semiconductor modules
- Patent number 9,564,384
- Issue date Feb 7, 2017
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Cooling system for molded modules and corresponding manufacturing m...
- Patent number 9,449,895
- Issue date Sep 20, 2016
- Infineon Technologies AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
- Publication number 20250233050
- Publication date Jul 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20250192097
- Publication date Jun 12, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20250125297
- Publication date Apr 17, 2025
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Maria Cristina ESTACIO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20240258268
- Publication date Aug 1, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20240186211
- Publication date Jun 6, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20240120328
- Publication date Apr 11, 2024
- SEMICONDUCTOR COMPONENTS INDUSTRIES, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HIGH POWER MODULE PACKAGE STRUCTURES
- Publication number 20230253362
- Publication date Aug 10, 2023
- Semiconductor Components Industries, LLC
- Seungwon IM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE
- Publication number 20230019930
- Publication date Jan 19, 2023
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUBMODULE SEMICONDUCTOR PACKAGE
- Publication number 20220406744
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20220406767
- Publication date Dec 22, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20220173022
- Publication date Jun 2, 2022
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES
- Publication number 20220157688
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- JooYang EOM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES
- Publication number 20220157801
- Publication date May 19, 2022
- Semiconductor Components Industries, LLC
- Jerome TEYSSEYRE
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...
- Publication number 20210242167
- Publication date Aug 5, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS
- Publication number 20210111104
- Publication date Apr 15, 2021
- Semiconductor Components Industries, LLC
- Inpil YOO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HEAT TRANSFER FOR POWER MODULES
- Publication number 20200388557
- Publication date Dec 10, 2020
- Semiconductor Components Industries, LLC
- Inpil YOO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Temperature Sensing and Fault Detection for Paralleled Double-Side...
- Publication number 20190222018
- Publication date Jul 18, 2019
- INFINEON TECHNOLOGIES AG
- Tomas Manuel Reiter
- G05 - CONTROLLING REGULATING
Information Patent Application
Semiconductor Module Cooling System
- Publication number 20180182643
- Publication date Jun 28, 2018
- INFINEON TECHNOLOGIES AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20170154835
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Manufacturing a Cooler for Semiconductor Modules
- Publication number 20170140946
- Publication date May 18, 2017
- INFINEON TECHNOLOGIES AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
PLASTIC COOLER FOR SEMICONDUCTOR MODULES
- Publication number 20160260654
- Publication date Sep 8, 2016
- INFINEON TECHNOLOGIES AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic module and method of manufacturing the same
- Publication number 20150264796
- Publication date Sep 17, 2015
- INFINEON TECHNOLOGIES AG
- Christian NEUGIRG
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Cooling System for Molded Modules and Corresponding Manufacturing M...
- Publication number 20140327128
- Publication date Nov 6, 2014
- INFINEON TECHNOLOGIES AG
- Inpil Yoo
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Power module package for direct cooling multiple power modules

Dual side direct cooling semiconductor package

High power module package structures

Submodule semiconductor package

Semiconductor packages using package in package systems and related...

Power module package for direct cooling multiple power modules

Power module package for direct cooling multiple power modules

Clips for semiconductor package and related methods

Heat transfer for power modules

Temperature sensing and fault detection for paralleled double-side...

Semiconductor module cooling system

Method of manufacturing a cooler for semiconductor modules

Plastic cooler for semiconductor modules

Electronic module and method of manufacturing the same

Plastic cooler for semiconductor modules

Cooling system for molded modules and corresponding manufacturing m...

Patents Applicationslast 30 patents

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

HIGH POWER MODULE PACKAGE STRUCTURES

SUBMODULE SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

HIGH POWER MODULE PACKAGE STRUCTURES

DUAL SIDE DIRECT COOLING SEMICONDUCTOR PACKAGE

SUBMODULE SEMICONDUCTOR PACKAGE

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

DIRECT-COOLING FOR SEMICONDUCTOR DEVICE MODULES

POWER MODULE PACKAGE FOR DIRECT COOLING MULTIPLE POWER MODULES

SEMICONDUCTOR PACKAGES USING PACKAGE IN PACKAGE SYSTEMS AND RELATED...

CLIPS FOR SEMICONDUCTOR PACKAGE AND RELATED METHODS

HEAT TRANSFER FOR POWER MODULES

Temperature Sensing and Fault Detection for Paralleled Double-Side...

Semiconductor Module Cooling System

Electronic module and method of manufacturing the same

Method of Manufacturing a Cooler for Semiconductor Modules

PLASTIC COOLER FOR SEMICONDUCTOR MODULES

Electronic module and method of manufacturing the same

Cooling System for Molded Modules and Corresponding Manufacturing M...