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Gyeonggi-do, KR
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Patents Grants
last 30 patents
Information
Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
Patent number
11,842,991
Issue date
Dec 12, 2023
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
EMI shielding for flip chip package with exposed die backside
Patent number
11,715,703
Issue date
Aug 1, 2023
STATS ChipPAC Pte. Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
EMI shielding for flip chip package with exposed die backside
Patent number
11,342,278
Issue date
May 24, 2022
STATS ChipPAC Pte. Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming SIP module over film layer
Patent number
11,309,193
Issue date
Apr 19, 2022
STATS ChipPAC Pte. Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming SIP module over film layer
Patent number
10,804,119
Issue date
Oct 13, 2020
STATS ChipPAC Pte. Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
EMI shielding for flip chip package with exposed die backside
Patent number
10,804,217
Issue date
Oct 13, 2020
STATS ChipPAC Pte. Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
Patent number
10,797,039
Issue date
Oct 6, 2020
STATS ChipPAC Pte. Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming SIP with electrical comp...
Patent number
10,629,565
Issue date
Apr 21, 2020
STATS ChipPAC Pte. Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming SIP with electrical comp...
Patent number
10,418,341
Issue date
Sep 17, 2019
STATS ChipPAC Pte. Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
Patent number
10,388,637
Issue date
Aug 20, 2019
STATS ChipPAC Pte. Ltd.
OhHan Kim
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Dummy conductive structures for EMI shielding
Patent number
10,319,684
Issue date
Jun 11, 2019
STATS ChipPAC Pte. Ltd.
InSang Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device and method of forming conductive ink layer as...
Patent number
9,331,007
Issue date
May 3, 2016
STATS ChipPAC, Ltd.
Insang Yoon
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
Publication number
20220246541
Publication date
Aug 4, 2022
STATS ChipPAC Pte Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
Publication number
20200402817
Publication date
Dec 24, 2020
STATS ChipPAC Pte Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
Publication number
20200395312
Publication date
Dec 17, 2020
STATS ChipPAC Pte Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
Publication number
20200373289
Publication date
Nov 26, 2020
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
Publication number
20200051926
Publication date
Feb 13, 2020
STATS ChipPAC Pte Ltd.
SungWon Cho
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming SIP with Electrical Comp...
Publication number
20190355695
Publication date
Nov 21, 2019
STATS ChipPAC Pte Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Dummy Conductive Structures for EMI Shielding
Publication number
20180294233
Publication date
Oct 11, 2018
STATS ChipPAC Pte Ltd.
InSang Yoon
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
Publication number
20180269195
Publication date
Sep 20, 2018
STATS ChipPAC Pte Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
Publication number
20180261569
Publication date
Sep 13, 2018
STATS ChipPAC Pte Ltd.
DeokKyung Yang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-I...
Publication number
20180158768
Publication date
Jun 7, 2018
STATS ChipPAC Pte Ltd.
OhHan Kim
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming SIP with Electrical Comp...
Publication number
20180061806
Publication date
Mar 1, 2018
STATS ChipPAC Pte Ltd.
JinHee Jung
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Device and Method of Forming Conductive Ink Layer as...
Publication number
20140103509
Publication date
Apr 17, 2014
STATS ChipPAC, Ltd.
Insang Yoon
H01 - BASIC ELECTRIC ELEMENTS