Insang Yoon

Person

Gyeonggi-do, KR

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 11,842,991
- Issue date Dec 12, 2023
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,715,703
- Issue date Aug 1, 2023
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 11,342,278
- Issue date May 24, 2022
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP module over film layer
- Patent number 11,309,193
- Issue date Apr 19, 2022
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming SIP module over film layer
- Patent number 10,804,119
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
EMI shielding for flip chip package with exposed die backside
- Patent number 10,804,217
- Issue date Oct 13, 2020
- STATS ChipPAC Pte. Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,797,039
- Issue date Oct 6, 2020
- STATS ChipPAC Pte. Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP with electrical comp...
- Patent number 10,629,565
- Issue date Apr 21, 2020
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming SIP with electrical comp...
- Patent number 10,418,341
- Issue date Sep 17, 2019
- STATS ChipPAC Pte. Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming a 3D interposer system-i...
- Patent number 10,388,637
- Issue date Aug 20, 2019
- STATS ChipPAC Pte. Ltd.
- OhHan Kim
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Dummy conductive structures for EMI shielding
- Patent number 10,319,684
- Issue date Jun 11, 2019
- STATS ChipPAC Pte. Ltd.
- InSang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of forming conductive ink layer as...
- Patent number 9,331,007
- Issue date May 3, 2016
- STATS ChipPAC, Ltd.
- Insang Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20220246541
- Publication date Aug 4, 2022
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
- Publication number 20200402817
- Publication date Dec 24, 2020
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20200395312
- Publication date Dec 17, 2020
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
- Publication number 20200373289
- Publication date Nov 26, 2020
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
EMI Shielding for Flip Chip Package with Exposed Die Backside
- Publication number 20200051926
- Publication date Feb 13, 2020
- STATS ChipPAC Pte Ltd.
- SungWon Cho
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP with Electrical Comp...
- Publication number 20190355695
- Publication date Nov 21, 2019
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Dummy Conductive Structures for EMI Shielding
- Publication number 20180294233
- Publication date Oct 11, 2018
- STATS ChipPAC Pte Ltd.
- InSang Yoon
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP Module Over Film Layer
- Publication number 20180269195
- Publication date Sep 20, 2018
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-i...
- Publication number 20180261569
- Publication date Sep 13, 2018
- STATS ChipPAC Pte Ltd.
- DeokKyung Yang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming a 3D Interposer System-I...
- Publication number 20180158768
- Publication date Jun 7, 2018
- STATS ChipPAC Pte Ltd.
- OhHan Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming SIP with Electrical Comp...
- Publication number 20180061806
- Publication date Mar 1, 2018
- STATS ChipPAC Pte Ltd.
- JinHee Jung
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Method of Forming Conductive Ink Layer as...
- Publication number 20140103509
- Publication date Apr 17, 2014
- STATS ChipPAC, Ltd.
- Insang Yoon
- H01 - BASIC ELECTRIC ELEMENTS

Insang Yoon

Person

Patents Grantslast 30 patents

Semiconductor device and method of forming a 3D interposer system-i...

EMI shielding for flip chip package with exposed die backside

EMI shielding for flip chip package with exposed die backside

Semiconductor device and method of forming SIP module over film layer

Method of forming SIP module over film layer

EMI shielding for flip chip package with exposed die backside

Semiconductor device and method of forming a 3D interposer system-i...

Semiconductor device and method of forming SIP with electrical comp...

Semiconductor device and method of forming SIP with electrical comp...

Semiconductor device and method of forming a 3D interposer system-i...

Dummy conductive structures for EMI shielding

Semiconductor device and method of forming conductive ink layer as...

Patents Applicationslast 30 patents

EMI Shielding for Flip Chip Package with Exposed Die Backside

Semiconductor Device and Method of Forming SIP Module Over Film Layer

EMI Shielding for Flip Chip Package with Exposed Die Backside

Semiconductor Device and Method of Forming a 3D Interposer System-i...

EMI Shielding for Flip Chip Package with Exposed Die Backside

Semiconductor Device and Method of Forming SIP with Electrical Comp...

Dummy Conductive Structures for EMI Shielding

Semiconductor Device and Method of Forming SIP Module Over Film Layer

Semiconductor Device and Method of Forming a 3D Interposer System-i...

Semiconductor Device and Method of Forming a 3D Interposer System-I...

Semiconductor Device and Method of Forming SIP with Electrical Comp...

Semiconductor Device and Method of Forming Conductive Ink Layer as...