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Insup SHIN
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Seoul, KR
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last 30 patents
Information
Patent Grant
Chip-stacked semiconductor package with increased package reliability
Patent number
11,756,935
Issue date
Sep 12, 2023
Samsung Electronics Co., Ltd.
Insup Shin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package and method of manufacturing the same
Patent number
11,721,601
Issue date
Aug 8, 2023
Samsung Electronics Co., Ltd.
Hyeongmun Kang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package having a molding layer including a molding ca...
Patent number
10,361,177
Issue date
Jul 23, 2019
Samsung Electronics Co., Ltd.
Yun-Young Kim
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240321831
Publication date
Sep 26, 2024
Samsung Electronics Co., Ltd.
Insup SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE
Publication number
20240290754
Publication date
Aug 29, 2024
SAMSUNG ELECTRONICS CO,. LTD.
Yu-Duk KIM
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CARRIER STRUCTURE INCLUDING POCKETS FOR ACCOMMODATING SEMICONDUCTOR...
Publication number
20220367367
Publication date
Nov 17, 2022
Samsung Electronics Co., Ltd.
Hyeongmun KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE WITH INCREASED PACKAGE RELIABILITY
Publication number
20210398947
Publication date
Dec 23, 2021
Samsung Electronics Co., Ltd.
Insup SHIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
Publication number
20210210397
Publication date
Jul 8, 2021
Samsung Electronics Co., Ltd.
HYEONGMUN KANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
Publication number
20190067258
Publication date
Feb 28, 2019
Samsung Electronics Co., Ltd.
Yun-Young KIM
H01 - BASIC ELECTRIC ELEMENTS