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Patents Grantslast 30 patents

Information Patent Grant
Carrier structure including pockets for accommodating semiconductor...
- Patent number 12,230,575
- Issue date Feb 18, 2025
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip-stacked semiconductor package with increased package reliability
- Patent number 11,756,935
- Issue date Sep 12, 2023
- Samsung Electronics Co., Ltd.
- Insup Shin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package and method of manufacturing the same
- Patent number 11,721,601
- Issue date Aug 8, 2023
- Samsung Electronics Co., Ltd.
- Hyeongmun Kang
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package having a molding layer including a molding ca...
- Patent number 10,361,177
- Issue date Jul 23, 2019
- Samsung Electronics Co., Ltd.
- Yun-Young Kim
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240321831
- Publication date Sep 26, 2024
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20240290754
- Publication date Aug 29, 2024
- SAMSUNG ELECTRONICS CO,. LTD.
- Yu-Duk KIM
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CARRIER STRUCTURE INCLUDING POCKETS FOR ACCOMMODATING SEMICONDUCTOR...
- Publication number 20220367367
- Publication date Nov 17, 2022
- Samsung Electronics Co., Ltd.
- Hyeongmun KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP-STACKED SEMICONDUCTOR PACKAGE WITH INCREASED PACKAGE RELIABILITY
- Publication number 20210398947
- Publication date Dec 23, 2021
- Samsung Electronics Co., Ltd.
- Insup SHIN
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF MANUFACTURING THE SAME
- Publication number 20210210397
- Publication date Jul 8, 2021
- Samsung Electronics Co., Ltd.
- HYEONGMUN KANG
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE AND METHOD OF FABRICATING THE SAME
- Publication number 20190067258
- Publication date Feb 28, 2019
- Samsung Electronics Co., Ltd.
- Yun-Young KIM
- H01 - BASIC ELECTRIC ELEMENTS