Ippei TAKAHASHI

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Nagakute-shi, JP

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Patents Grantslast 30 patents

Information Patent Grant
Semiconductor wafer including silicon carbide wafer and method for...
- Patent number 11,348,844
- Issue date May 31, 2022
- Denso Corporation
- Shinya Takei
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR WAFER INCLUDING SILICON CARBIDE WAFER AND METHOD FOR...
- Publication number 20210143070
- Publication date May 13, 2021
- DENSO CORPORATION
- Shinya TAKEI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE
- Publication number 20180151364
- Publication date May 31, 2018
- Toyota Jidosha Kabushiki Kaisha
- Hiroyuki YOSHIDA
- H01 - BASIC ELECTRIC ELEMENTS