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Mesa, AZ, US

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Patents Grantslast 30 patents

Information Patent Grant
Direct wafer bonded structure method of making
- Patent number 5,413,952
- Issue date May 9, 1995
- Motorola, Inc.
- Irenee Pages
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device metallization process
- Patent number 4,837,183
- Issue date Jun 6, 1989
- Motorola Inc.
- Anthony Polito
- H01 - BASIC ELECTRIC ELEMENTS