IRINA V. VASILYEVA

Person

BOISE, ID, US

People

Patents Grantslast 30 patents

Information Patent Grant
Methods of exposing conductive Vias of semiconductor devices and re...
- Patent number 12,237,217
- Issue date Feb 25, 2025
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,923,272
- Issue date Mar 5, 2024
- Micron Technology, Inc.
- Zhuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistor, integrated circuitry, method of forming a vert...
- Patent number 11,871,582
- Issue date Jan 9, 2024
- Micron Technology, Inc.
- Hung-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Integrated assemblies and methods of forming integrated assemblies
- Patent number 11,335,626
- Issue date May 17, 2022
- Micron Technology, Inc.
- Zhuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Vertical transistor, integrated circuitry, method of forming a vert...
- Patent number 11,264,395
- Issue date Mar 1, 2022
- Micron Technology, Inc.
- Hung-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming devices including multi-portion liners
- Patent number 11,050,020
- Issue date Jun 29, 2021
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reduction of roughness on a sidewall of an opening
- Patent number 10,923,478
- Issue date Feb 16, 2021
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices including multi-portion liners
- Patent number 10,879,462
- Issue date Dec 29, 2020
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structures including multi-portion...
- Patent number 10,665,782
- Issue date May 26, 2020
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor structures including multi-portion liners
- Patent number 10,658,580
- Issue date May 19, 2020
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming semiconductor structures including multi-portion...
- Patent number 10,249,819
- Issue date Apr 2, 2019
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Through substrate via liner densification
- Patent number 10,163,655
- Issue date Dec 25, 2018
- Micron Technology, Inc.
- Jin Lu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming structures
- Patent number 9,761,797
- Issue date Sep 12, 2017
- Micron Technology, Inc.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for backside photo alignment
- Patent number 9,741,612
- Issue date Aug 22, 2017
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of forming structures
- Patent number 9,401,474
- Issue date Jul 26, 2016
- Micron Technology, Inc.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor devices and methods for backside photo alignment
- Patent number 9,299,663
- Issue date Mar 29, 2016
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of exposing conductive vias of semiconductor devices and as...
- Patent number 9,034,752
- Issue date May 19, 2015
- Micron Technology, Inc.
- Hongqi Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method of forming capacitors
- Patent number 8,318,578
- Issue date Nov 27, 2012
- Micron Technology, Inc.
- Kevin Shea
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Methods of forming capacitors
- Patent number 7,618,874
- Issue date Nov 17, 2009
- Micron Technology, Inc.
- Kevin Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Plasma enhanced chemical vapor deposition method of forming titaniu...
- Patent number 7,396,570
- Issue date Jul 8, 2008
- Micron Technology, Inc.
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced chemical vapor deposition method of forming titaniu...
- Patent number 7,393,563
- Issue date Jul 1, 2008
- Micron Technology, Inc.
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced chemical vapor deposition method of forming a titan...
- Patent number 7,033,642
- Issue date Apr 25, 2006
- Micron Technology, Inc.
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced chemical vapor deposition method of forming titaniu...
- Patent number 6,767,823
- Issue date Jul 27, 2004
- Micron Technology, Inc.
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced chemical vapor deposition methods of forming titani...
- Patent number 6,734,051
- Issue date May 11, 2004
- Micron Technology, Inc.
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Chemical vapor deposition method of forming a material over at leas...
- Patent number 6,730,355
- Issue date May 4, 2004
- Micron Technology, Inc.
- Ammar Derraa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Plasma enhanced chemical vapor deposition method of forming titaniu...
- Patent number 6,586,285
- Issue date Jul 1, 2003
- Micron Technology, Inc.
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Method for depositing a tungsten layer on silicon
- Patent number 5,733,816
- Issue date Mar 31, 1998
- Micron Technology, Inc.
- Ravi Iyer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
Vertical Transistor, Integrated Circuitry, Method Of Forming A Vert...
- Publication number 20240164114
- Publication date May 16, 2024
- Micron Technology, Inc.
- Hung-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220238417
- Publication date Jul 28, 2022
- Micron Technology, Inc.
- Zhuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Vertical Transistor, Integrated Circuitry, Method Of Forming A Vert...
- Publication number 20220093617
- Publication date Mar 24, 2022
- Micron Technology, Inc.
- Hung-Wei Liu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Integrated Assemblies and Methods of Forming Integrated Assemblies
- Publication number 20220084906
- Publication date Mar 17, 2022
- Micron Technology, Inc.
- Zhuo Chen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...
- Publication number 20210183697
- Publication date Jun 17, 2021
- Micron Technology, Inc.
- Hongqi Li
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Application
DEVICES INCLUDING MULTI-PORTION LINERS
- Publication number 20200274059
- Publication date Aug 27, 2020
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING DEVICES INCLUDING MULTI-PORTION LINERS
- Publication number 20200274060
- Publication date Aug 27, 2020
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
REDUCTION OF ROUGHNESS ON A SIDEWALL OF AN OPENING
- Publication number 20200243535
- Publication date Jul 30, 2020
- Micron Technology, Inc.
- Christopher J. Gambee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING SEMICONDUCTOR STRUCTURES INCLUDING MULTI-PORTION...
- Publication number 20180366645
- Publication date Dec 20, 2018
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING MULTI-PORTION LINERS
- Publication number 20180123036
- Publication date May 3, 2018
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
THROUGH SUBSTRATE VIA LINER DENSIFICATION
- Publication number 20170148674
- Publication date May 25, 2017
- Micron Technology, Inc.
- JIN LU
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Structures
- Publication number 20160308126
- Publication date Oct 20, 2016
- Micron Technology, Inc.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
- Publication number 20160172242
- Publication date Jun 16, 2016
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of Forming Structures
- Publication number 20160005966
- Publication date Jan 7, 2016
- Micron Technology, Inc.
- Hyun Sik Kim
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT
- Publication number 20150333014
- Publication date Nov 19, 2015
- Micron Technology, Inc.
- Brandon P. Wirz
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR STRUCTURES INCLUDING MULTI-PORTION LINERS AND RELATED...
- Publication number 20150287916
- Publication date Oct 8, 2015
- Micron Technology, Inc.
- Kyle B. Campbell
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...
- Publication number 20150145146
- Publication date May 28, 2015
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND AS...
- Publication number 20140183740
- Publication date Jul 3, 2014
- Micron Technology, Inc.
- Hongqi Li
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming Capacitors
- Publication number 20100025362
- Publication date Feb 4, 2010
- Micron Technology, Inc.
- Kevin Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS OF FORMING CAPACITORS
- Publication number 20090275185
- Publication date Nov 5, 2009
- Kevin Shea
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon nitride passivation layers having oxidized interface
- Publication number 20070164390
- Publication date Jul 19, 2007
- Irina V. Vasilyeva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon nitride passivation layers having oxidized interface
- Publication number 20070012661
- Publication date Jan 18, 2007
- Irina V. Vasilyeva
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Plasma enhanced chemical vapor deposition method of forming titaniu...
- Publication number 20060172087
- Publication date Aug 3, 2006
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced chemical vapor deposition method of forming titaniu...
- Publication number 20060172088
- Publication date Aug 3, 2006
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced chemical vapor deposition method of forming a titan...
- Publication number 20050079697
- Publication date Apr 14, 2005
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced chemical vapor deposition method of forming titaniu...
- Publication number 20030170982
- Publication date Sep 11, 2003
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Chemical vapor deposition method of forming titanium silicide compr...
- Publication number 20030170390
- Publication date Sep 11, 2003
- Ammar Derraa
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Plasma enhanced chemical vapor deposition methods of forming titani...
- Publication number 20030170983
- Publication date Sep 11, 2003
- Cem Basceri
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...

IRINA V. VASILYEVA

Person

Patents Grantslast 30 patents

Methods of exposing conductive Vias of semiconductor devices and re...

Integrated assemblies and methods of forming integrated assemblies

Vertical transistor, integrated circuitry, method of forming a vert...

Integrated assemblies and methods of forming integrated assemblies

Vertical transistor, integrated circuitry, method of forming a vert...

Methods of forming devices including multi-portion liners

Reduction of roughness on a sidewall of an opening

Devices including multi-portion liners

Methods of forming semiconductor structures including multi-portion...

Semiconductor structures including multi-portion liners

Methods of forming semiconductor structures including multi-portion...

Through substrate via liner densification

Methods of forming structures

Semiconductor devices and methods for backside photo alignment

Methods of forming structures

Semiconductor devices and methods for backside photo alignment

Methods of exposing conductive vias of semiconductor devices and as...

Method of forming capacitors

Methods of forming capacitors

Plasma enhanced chemical vapor deposition method of forming titaniu...

Plasma enhanced chemical vapor deposition method of forming titaniu...

Plasma enhanced chemical vapor deposition method of forming a titan...

Plasma enhanced chemical vapor deposition method of forming titaniu...

Plasma enhanced chemical vapor deposition methods of forming titani...

Chemical vapor deposition method of forming a material over at leas...

Plasma enhanced chemical vapor deposition method of forming titaniu...

Method for depositing a tungsten layer on silicon

Patents Applicationslast 30 patents

Vertical Transistor, Integrated Circuitry, Method Of Forming A Vert...

Integrated Assemblies and Methods of Forming Integrated Assemblies

Vertical Transistor, Integrated Circuitry, Method Of Forming A Vert...

Integrated Assemblies and Methods of Forming Integrated Assemblies

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...

DEVICES INCLUDING MULTI-PORTION LINERS

METHODS OF FORMING DEVICES INCLUDING MULTI-PORTION LINERS

REDUCTION OF ROUGHNESS ON A SIDEWALL OF AN OPENING

METHODS OF FORMING SEMICONDUCTOR STRUCTURES INCLUDING MULTI-PORTION...

SEMICONDUCTOR STRUCTURES INCLUDING MULTI-PORTION LINERS

THROUGH SUBSTRATE VIA LINER DENSIFICATION

Methods of Forming Structures

SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT

Methods of Forming Structures

SEMICONDUCTOR DEVICES AND METHODS FOR BACKSIDE PHOTO ALIGNMENT

SEMICONDUCTOR STRUCTURES INCLUDING MULTI-PORTION LINERS AND RELATED...

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND RE...

METHODS OF EXPOSING CONDUCTIVE VIAS OF SEMICONDUCTOR DEVICES AND AS...

Method of Forming Capacitors

METHODS OF FORMING CAPACITORS

Silicon nitride passivation layers having oxidized interface

Silicon nitride passivation layers having oxidized interface

Plasma enhanced chemical vapor deposition method of forming titaniu...

Plasma enhanced chemical vapor deposition method of forming titaniu...

Plasma enhanced chemical vapor deposition method of forming a titan...

Plasma enhanced chemical vapor deposition method of forming titaniu...

Chemical vapor deposition method of forming titanium silicide compr...

Plasma enhanced chemical vapor deposition methods of forming titani...