Iris Moder

Person

Villach, AT

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device having semiconductor device elements in a semi...
- Patent number 12,107,130
- Issue date Oct 1, 2024
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,881,397
- Issue date Jan 23, 2024
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of porosifying part of a semiconductor wafer
- Patent number 11,810,779
- Issue date Nov 7, 2023
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with a porous portion, wafer composite and met...
- Patent number 11,476,111
- Issue date Oct 18, 2022
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for partially removing a semiconductor wafer
- Patent number 11,404,262
- Issue date Aug 2, 2022
- Infineon Technologies AG
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor surface smoothing and semiconductor arrangement
- Patent number 11,373,857
- Issue date Jun 28, 2022
- Infineon Technologies AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Silicon carbide devices, semiconductor devices and methods for form...
- Patent number 11,342,433
- Issue date May 24, 2022
- Infineon Technologies AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method
- Patent number 11,038,028
- Issue date Jun 15, 2021
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 11,011,409
- Issue date May 18, 2021
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Reticle and exposure method including projection of a reticle patte...
- Patent number 10,802,404
- Issue date Oct 13, 2020
- Infineon Technologies AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Semiconductor device and semiconductor wafer including a porous lay...
- Patent number 10,714,377
- Issue date Jul 14, 2020
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 10,535,553
- Issue date Jan 14, 2020
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a semiconductor device comprising etching...
- Patent number 10,497,583
- Issue date Dec 3, 2019
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of wafer thinning and realizing backside metal structures
- Patent number 10,325,804
- Issue date Jun 18, 2019
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Monolithically integrated chip including active electrical componen...
- Patent number 10,199,372
- Issue date Feb 5, 2019
- Infineon Technologies AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and methods for forming a plurality of semicon...
- Patent number 10,074,566
- Issue date Sep 11, 2018
- Infineon Technologies AG
- Johannes Baumgartl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for thinning substrates
- Patent number 10,049,914
- Issue date Aug 14, 2018
- Infineon Technologies AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Devices with backside metal structures and methods of formation the...
- Patent number 9,960,076
- Issue date May 1, 2018
- Infineon Technologies AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming a semiconductor device and semiconductor device
- Patent number 9,954,065
- Issue date Apr 24, 2018
- Infineon Technologies AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrates with buried isolation layers and methods of formation th...
- Patent number 9,875,926
- Issue date Jan 23, 2018
- Infineon Technologies AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement including buried anodic oxide and manufac...
- Patent number 9,472,395
- Issue date Oct 18, 2016
- Infineon Technologies AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20240153759
- Publication date May 9, 2024
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SUBSTRATE HAVING AN ALIGNMENT STRUCTURE
- Publication number 20230275033
- Publication date Aug 31, 2023
- INFINEON TECHNOLOGIES AG
- Thomas Huber
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES
- Publication number 20230127556
- Publication date Apr 27, 2023
- INFINEON TECHNOLOGIES AG
- Bernhard Goller
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20220359194
- Publication date Nov 10, 2022
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER
- Publication number 20220310380
- Publication date Sep 29, 2022
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Devices, Semiconductor Devices and Methods for Form...
- Publication number 20220246745
- Publication date Aug 4, 2022
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING
- Publication number 20210391218
- Publication date Dec 16, 2021
- Felix Johannes Heinrich Ernst
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...
- Publication number 20210391377
- Publication date Dec 16, 2021
- Alexander Frey
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR DEVICE ELEMENTS IN A SEMI...
- Publication number 20210265468
- Publication date Aug 26, 2021
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR SURFACE SMOOTHING AND SEMICONDUCTOR ARRANGEMENT
- Publication number 20200365385
- Publication date Nov 19, 2020
- INFINEON TECHNOLOGIES AG
- Bernhard GOLLER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...
- Publication number 20200286730
- Publication date Sep 10, 2020
- INFINEON TECHNOLOGIES AG
- Iris MODER
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Silicon Carbide Devices, Semiconductor Devices and Methods for Form...
- Publication number 20200176580
- Publication date Jun 4, 2020
- INFINEON TECHNOLOGIES AG
- Ralf Siemieniec
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Partially Removing a Semiconductor Wafer
- Publication number 20200168449
- Publication date May 28, 2020
- Sophia Friedler
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20200098617
- Publication date Mar 26, 2020
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Manufacturing Method
- Publication number 20190348506
- Publication date Nov 14, 2019
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Semiconductor Wafer Including a Porous Lay...
- Publication number 20190074212
- Publication date Mar 7, 2019
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MONOLITHICALLY INTEGRATED CHIP INCLUDING ACTIVE ELECTRICAL COMPONEN...
- Publication number 20180374843
- Publication date Dec 27, 2018
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Thinning Substrates
- Publication number 20180330981
- Publication date Nov 15, 2018
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing a Semiconductor Device Comprising Etching...
- Publication number 20180277391
- Publication date Sep 27, 2018
- INFINEON TECHNOLOGIES AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
RETICLE AND EXPOSURE METHOD INCLUDING PROJECTION OF A RETICLE PATTE...
- Publication number 20180267408
- Publication date Sep 20, 2018
- INFINEON TECHNOLOGIES AG
- Joerg Ortner
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20180233399
- Publication date Aug 16, 2018
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR D...
- Publication number 20180144982
- Publication date May 24, 2018
- INFINEON TECHNOLOGIES AG
- Ingo Muri
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Wafer Thinning and Realizing Backside Metal Structures
- Publication number 20180144974
- Publication date May 24, 2018
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Devices with Backside Metal Structures and Methods of Formation The...
- Publication number 20180040504
- Publication date Feb 8, 2018
- INFINEON TECHNOLOGIES AG
- Oliver Hellmund
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Device and Methods for Forming a Plurality of Semicon...
- Publication number 20170338153
- Publication date Nov 23, 2017
- INFINEON TECHNOLOGIES AG
- Johannes Baumgartl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Substrates with Buried Isolation Layers and Methods of Formation Th...
- Publication number 20170154808
- Publication date Jun 1, 2017
- INFINEON TECHNOLOGIES AG
- Iris Moder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR THINNING SUBSTRATES
- Publication number 20170148664
- Publication date May 25, 2017
- INFINEON TECHNOLOGIES AG
- Roland Rupp
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of Forming a Semiconductor Device and Semiconductor Device
- Publication number 20170133465
- Publication date May 11, 2017
- INFINEON TECHNOLOGIES AG
- Anton Mauder
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MICROFILTRATION DEVICE
- Publication number 20170030890
- Publication date Feb 2, 2017
- INFINEON TECHNOLOGIES AG
- Gerald Holweg
- G01 - MEASURING TESTING
Information Patent Application
Semiconductor Arrangement Including Buried Anodic Oxide and Manufac...
- Publication number 20160203977
- Publication date Jul 14, 2016
- INFINEON TECHNOLOGIES AG
- Hans-Joachim Schulze
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device having semiconductor device elements in a semi...

Semiconductor device with a porous portion, wafer composite and met...

Method of porosifying part of a semiconductor wafer

Semiconductor device with a porous portion, wafer composite and met...

Method for partially removing a semiconductor wafer

Semiconductor surface smoothing and semiconductor arrangement

Silicon carbide devices, semiconductor devices and methods for form...

Semiconductor device and manufacturing method

Devices with backside metal structures and methods of formation the...

Reticle and exposure method including projection of a reticle patte...

Semiconductor device and semiconductor wafer including a porous lay...

Devices with backside metal structures and methods of formation the...

Method for manufacturing a semiconductor device comprising etching...

Method of wafer thinning and realizing backside metal structures

Monolithically integrated chip including active electrical componen...

Semiconductor device and methods for forming a plurality of semicon...

Method for thinning substrates

Devices with backside metal structures and methods of formation the...

Method of forming a semiconductor device and semiconductor device

Substrates with buried isolation layers and methods of formation th...

Semiconductor arrangement including buried anodic oxide and manufac...

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

SEMICONDUCTOR SUBSTRATE HAVING AN ALIGNMENT STRUCTURE

MANUFACTURING AND REUSE OF SEMICONDUCTOR SUBSTRATES

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

METHOD OF POROSIFYING PART OF A SEMICONDUCTOR WAFER

Silicon Carbide Devices, Semiconductor Devices and Methods for Form...

SEMICONDUCTOR DEVICE MANUFACTURING BY THINNING AND DICING

METHOD OF THINNING A SEMICONDUCTOR SUBSTRATE TO HIGH EVENNESS AND S...

SEMICONDUCTOR DEVICE HAVING SEMICONDUCTOR DEVICE ELEMENTS IN A SEMI...

SEMICONDUCTOR SURFACE SMOOTHING AND SEMICONDUCTOR ARRANGEMENT

SEMICONDUCTOR DEVICE WITH A POROUS PORTION, WAFER COMPOSITE AND MET...

Silicon Carbide Devices, Semiconductor Devices and Methods for Form...

Method for Partially Removing a Semiconductor Wafer

Devices with Backside Metal Structures and Methods of Formation The...

Semiconductor Device and Manufacturing Method

Semiconductor Device and Semiconductor Wafer Including a Porous Lay...

MONOLITHICALLY INTEGRATED CHIP INCLUDING ACTIVE ELECTRICAL COMPONEN...

Method for Thinning Substrates

Method for Manufacturing a Semiconductor Device Comprising Etching...

RETICLE AND EXPOSURE METHOD INCLUDING PROJECTION OF A RETICLE PATTE...

Devices with Backside Metal Structures and Methods of Formation The...

SEMICONDUCTOR DEVICES AND METHODS FOR MANUFACTURING SEMICONDUCTOR D...

Method of Wafer Thinning and Realizing Backside Metal Structures

Devices with Backside Metal Structures and Methods of Formation The...

Semiconductor Device and Methods for Forming a Plurality of Semicon...

Substrates with Buried Isolation Layers and Methods of Formation Th...

METHOD FOR THINNING SUBSTRATES

Method of Forming a Semiconductor Device and Semiconductor Device

MICROFILTRATION DEVICE

Semiconductor Arrangement Including Buried Anodic Oxide and Manufac...