Irmgard Escher-Poeppel

Person

Duggendorf, DE

People

Patents Grantslast 30 patents

Information Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
- Patent number 11,688,713
- Issue date Jun 27, 2023
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Predictive chip-maintenance
- Patent number 11,531,056
- Issue date Dec 20, 2022
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor flip-chip package
- Patent number 11,393,742
- Issue date Jul 19, 2022
- Infineon Technologies AG
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package system
- Patent number 10,886,186
- Issue date Jan 5, 2021
- Infineon Technologies AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
- Patent number 10,734,352
- Issue date Aug 4, 2020
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of reducing a sheet resistance in an electronic device, and...
- Patent number 10,573,533
- Issue date Feb 25, 2020
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a power semiconductor module
- Patent number 10,096,584
- Issue date Oct 9, 2018
- Infineon Technologies AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing a chip assemblage
- Patent number 10,014,275
- Issue date Jul 3, 2018
- Infineon Technologies AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a number of chip as...
- Patent number 9,818,730
- Issue date Nov 14, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device package including metal blocks
- Patent number 9,768,037
- Issue date Sep 19, 2017
- Infineon Technologies AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor arrangement, method for producing a semiconductor mod...
- Patent number 9,620,459
- Issue date Apr 11, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
System and method for packaged MEMS device having embedding arrange...
- Patent number 9,584,889
- Issue date Feb 28, 2017
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Grant
Semiconductor arrangement, method for producing a semiconductor mod...
- Patent number 9,559,065
- Issue date Jan 31, 2017
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a sensor device using a graphene layer
- Patent number 9,536,953
- Issue date Jan 3, 2017
- Infineon Technologies AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electronic device and method for fabricating an electronic device
- Patent number 9,355,984
- Issue date May 31, 2016
- Infineon Technologies AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating a semiconductor device with encapsulant
- Patent number 9,287,206
- Issue date Mar 15, 2016
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Removable indicator structure in electronic chips of a common subst...
- Patent number 9,275,916
- Issue date Mar 1, 2016
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for manufacturing a chip package
- Patent number 9,230,894
- Issue date Jan 5, 2016
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing an electronic module and an electronic module
- Patent number 9,129,959
- Issue date Sep 8, 2015
- Infineon Technologies AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a sensor device using a graphene layer
- Patent number 9,070,615
- Issue date Jun 30, 2015
- Infineon Technologies AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Grant
Stackable semiconductor package with encapsulant and electrically c...
- Patent number 8,829,663
- Issue date Sep 9, 2014
- Infineon Technologies AG
- Jens Pohl
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a sensor device using a graphene layer
- Patent number 8,759,153
- Issue date Jun 24, 2014
- Infineon Technologies AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor device and semiconductor pac...
- Patent number 8,728,869
- Issue date May 20, 2014
- Intel Corporation
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 8,658,468
- Issue date Feb 25, 2014
- Intel Mobile Communications GmbH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 8,492,200
- Issue date Jul 23, 2013
- Intel Mobile Communications GmbH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,394,673
- Issue date Mar 12, 2013
- Infineon Technologies AG
- Gerhard Josef Poeppel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 8,258,624
- Issue date Sep 4, 2012
- Intel Mobile Communications GmbH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for fabricating a semiconductor and semiconductor package
- Patent number 8,216,881
- Issue date Jul 10, 2012
- Intel Mobile Communications GmbH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 8,169,070
- Issue date May 1, 2012
- Infineon Technologies AG
- Gerhard Josef Poeppel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Grant
Method of fabricating a semiconductor device
- Patent number 8,119,452
- Issue date Feb 21, 2012
- Infineon Technologies AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
PREDICTIVE CHIP-MAINTENANCE
- Publication number 20210325445
- Publication date Oct 21, 2021
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Additive Manufacturing of a Frontside or Backside Interconnect of a...
- Publication number 20210225798
- Publication date Jul 22, 2021
- Infineon Technologies Austria AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Fabricating a Semiconductor Flip-Chip Package
- Publication number 20200388561
- Publication date Dec 10, 2020
- Thorsten Meyer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Package and Method of Forming a Semiconductor Package
- Publication number 20200365548
- Publication date Nov 19, 2020
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICES INCLUDING ADHESION PROMOTING STRUCTURES AND M...
- Publication number 20200227312
- Publication date Jul 16, 2020
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Heat Dissipation Device, Semiconductor Packaging System and Method...
- Publication number 20200006187
- Publication date Jan 2, 2020
- INFINEON TECHNOLOGIES AG
- Ralf Otremba
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE SYSTEM
- Publication number 20190304858
- Publication date Oct 3, 2019
- INFINEON TECHNOLOGIES AG
- Thorsten Scharf
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
- Publication number 20190103378
- Publication date Apr 4, 2019
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF REDUCING A SHEET RESISTANCE IN AN ELECTRONIC DEVICE, AND...
- Publication number 20190013210
- Publication date Jan 10, 2019
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING A CHIP ASSEMBLAGE
- Publication number 20170271298
- Publication date Sep 21, 2017
- INFINEON TECHNOLOGIES AG
- Alexander Heinrich
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing a Power Semiconductor Module
- Publication number 20170125395
- Publication date May 4, 2017
- INFINEON TECHNOLOGIES AG
- Olaf Hohlfeld
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of reducing a sheet resistance in an electronic device, and...
- Publication number 20160336226
- Publication date Nov 17, 2016
- INFINEON TECHNOLOGIES AG
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Electronic Device Package Including Metal Blocks
- Publication number 20150332938
- Publication date Nov 19, 2015
- INFINEON TECHNOLOGIES AG
- Petteri Palm
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making a Sensor Device Using a Graphene Layer
- Publication number 20150287788
- Publication date Oct 8, 2015
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Method for Producing a Semiconductor Mod...
- Publication number 20150061144
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor Arrangement, Method for Producing a Number of Chip As...
- Publication number 20150061100
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Packaged MEMS Device
- Publication number 20150061048
- Publication date Mar 5, 2015
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H04 - ELECTRIC COMMUNICATION TECHNIQUE
Information Patent Application
ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE
- Publication number 20150021792
- Publication date Jan 22, 2015
- INFINEON TECHNOLOGIES AG
- Irmgard Escher-Poeppel
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Removable indicator structure in electronic chips of a common subst...
- Publication number 20140327003
- Publication date Nov 6, 2014
- Edward FUERGUT
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Making a Sensor Device Using a Graphene Layer
- Publication number 20140264255
- Publication date Sep 18, 2014
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20140127859
- Publication date May 8, 2014
- Intel Mobile Communications GmbH
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing an Electronic Module and an Electronic Module
- Publication number 20140054780
- Publication date Feb 27, 2014
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR MANUFACTURING A CHIP PACKAGE
- Publication number 20130295720
- Publication date Nov 7, 2013
- INFINEON TECHNOLOGIES AG
- Edward Fuergut
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PAC...
- Publication number 20130267063
- Publication date Oct 10, 2013
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Sensor Device and Method
- Publication number 20130056703
- Publication date Mar 7, 2013
- INFINEON TECHNOLOGIES AG
- Klaus Elian
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20120319298
- Publication date Dec 20, 2012
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20120258571
- Publication date Oct 11, 2012
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120214277
- Publication date Aug 23, 2012
- INFINEON TECHNOLOGIES AG
- Gerhard Josef Poeppel
- H03 - BASIC ELECTRONIC CIRCUITRY
Information Patent Application
METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE
- Publication number 20110281405
- Publication date Nov 17, 2011
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE
- Publication number 20110057304
- Publication date Mar 10, 2011
- INFINEON TECHNOLOGIES AG
- Gottfried Beer
- H01 - BASIC ELECTRIC ELEMENTS

Irmgard Escher-Poeppel

Person

Patents Grantslast 30 patents

Additive manufacturing of a frontside or backside interconnect of a...

Predictive chip-maintenance

Method for fabricating a semiconductor flip-chip package

Semiconductor package system

Metallic interconnect, a method of manufacturing a metallic interco...

Method of reducing a sheet resistance in an electronic device, and...

Method for producing a power semiconductor module

Method for producing a chip assemblage

Semiconductor arrangement, method for producing a number of chip as...

Electronic device package including metal blocks

Semiconductor arrangement, method for producing a semiconductor mod...

System and method for packaged MEMS device having embedding arrange...

Semiconductor arrangement, method for producing a semiconductor mod...

Method for making a sensor device using a graphene layer

Electronic device and method for fabricating an electronic device

Method of fabricating a semiconductor device with encapsulant

Removable indicator structure in electronic chips of a common subst...

Methods for manufacturing a chip package

Method for manufacturing an electronic module and an electronic module

Method for making a sensor device using a graphene layer

Stackable semiconductor package with encapsulant and electrically c...

Method for making a sensor device using a graphene layer

Method for fabricating a semiconductor device and semiconductor pac...

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

Semiconductor device

Method for fabricating a semiconductor and semiconductor package

Method for fabricating a semiconductor and semiconductor package

Semiconductor device

Method of fabricating a semiconductor device

Patents Applicationslast 30 patents

PREDICTIVE CHIP-MAINTENANCE

Additive Manufacturing of a Frontside or Backside Interconnect of a...

Method for Fabricating a Semiconductor Flip-Chip Package

Semiconductor Package and Method of Forming a Semiconductor Package

SEMICONDUCTOR DEVICES INCLUDING ADHESION PROMOTING STRUCTURES AND M...

Heat Dissipation Device, Semiconductor Packaging System and Method...

SEMICONDUCTOR PACKAGE SYSTEM

Metallic Interconnect, a Method of Manufacturing a Metallic Interco...

METHOD OF REDUCING A SHEET RESISTANCE IN AN ELECTRONIC DEVICE, AND...

METHOD FOR PRODUCING A CHIP ASSEMBLAGE

Method for Producing a Power Semiconductor Module

Method of reducing a sheet resistance in an electronic device, and...

Electronic Device Package Including Metal Blocks

Method for Making a Sensor Device Using a Graphene Layer

Semiconductor Arrangement, Method for Producing a Semiconductor Mod...

Semiconductor Arrangement, Method for Producing a Number of Chip As...

Packaged MEMS Device

ELECTRONIC DEVICE AND METHOD FOR FABRICATING AN ELECTRONIC DEVICE

Removable indicator structure in electronic chips of a common subst...

Method for Making a Sensor Device Using a Graphene Layer

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

Method for Manufacturing an Electronic Module and an Electronic Module

METHODS FOR MANUFACTURING A CHIP PACKAGE

METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PAC...

Sensor Device and Method

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE

METHOD OF FABRICATING A SEMICONDUCTOR DEVICE AND SEMICONDUCTOR DEVICE

METHOD FOR FABRICATING A SEMICONDUCTOR AND SEMICONDUCTOR PACKAGE