Irwin Yablok

Person

Portland, OR, US

People

Patents Grantslast 30 patents

Information Patent Grant
Epitaxial wafer and a method of manufacturing thereof
- Patent number 9,691,632
- Issue date Jun 27, 2017
- Siltronic AG
- Peter Storck
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatuses for manufacturing ultra thin device layers...
- Patent number 7,531,429
- Issue date May 12, 2009
- Intel Corporation
- Peter Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Transistors with increased mobility in the channel zone and method...
- Patent number 7,491,988
- Issue date Feb 17, 2009
- Intel Corporation
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a silicon-on-insulator (SOI) wafer with an...
- Patent number 7,473,614
- Issue date Jan 6, 2009
- Intel Corporation
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods of vertically stacking wafers using porous silicon
- Patent number 7,378,331
- Issue date May 27, 2008
- Intel Corporation
- Mohamad Shaheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete device layer transfer without edge exclusion via direct wa...
- Patent number 7,161,224
- Issue date Jan 9, 2007
- Intel Corporation
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Methods and apparatuses for manufacturing ultra thin device layers...
- Patent number 7,091,108
- Issue date Aug 15, 2006
- Intel Corporation
- Peter Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for making a semiconductor device having increased carrier m...
- Patent number 6,924,543
- Issue date Aug 2, 2005
- Intel Corporation
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of forming silicon on insulator wafers
- Patent number 6,911,380
- Issue date Jun 28, 2005
- Intel Corporation
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Complete device layer transfer without edge exclusion via direct wa...
- Patent number 6,908,027
- Issue date Jun 21, 2005
- Intel Corporation
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
EPITAXIAL WAFER AND A METHOD OF MANUFACTURING THEREOF
- Publication number 20150303071
- Publication date Oct 22, 2015
- SILTRONIC AG
- Peter STORCK
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Back gate doping for SOI substrates
- Publication number 20100155880
- Publication date Jun 24, 2010
- Intel Corporation
- Ibrahim Ban
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a silicon-on-insulator (SOI) wafer with an...
- Publication number 20090096025
- Publication date Apr 16, 2009
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPLICATIONS OF POLYCRYSTALLINE WAFERS
- Publication number 20080122042
- Publication date May 29, 2008
- Michael Goldstein
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Insulation layer for silicon-on-insulator wafer
- Publication number 20070063279
- Publication date Mar 22, 2007
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses for manufacturing ultra thin device layers...
- Publication number 20060177994
- Publication date Aug 10, 2006
- Peter Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods of vertically stacking wafers using porous silicon
- Publication number 20060138627
- Publication date Jun 29, 2006
- Mohamad Shaheen
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing a silicon-on-Insulator (SOI) wafer with an...
- Publication number 20060102988
- Publication date May 18, 2006
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Transistors with increased mobility in the channel zone and method...
- Publication number 20050285212
- Publication date Dec 29, 2005
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor wafers with non-standard crystal orientations and met...
- Publication number 20050217560
- Publication date Oct 6, 2005
- Peter G. Tolchinsky
- C30 - CRYSTAL GROWTH
Information Patent Application
Complete device layer transfer without edge exclusion via direct wa...
- Publication number 20050173781
- Publication date Aug 11, 2005
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Devices and methods employing high thermal conductivity heat dissip...
- Publication number 20050070048
- Publication date Mar 31, 2005
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Methods and apparatuses for manufacturing ultra thin device layers...
- Publication number 20050059221
- Publication date Mar 17, 2005
- Peter Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for making a semiconductor device having increased carrier m...
- Publication number 20040251480
- Publication date Dec 16, 2004
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Complete device layer transfer without edge exclusion via direct wa...
- Publication number 20040188501
- Publication date Sep 30, 2004
- Peter Tolchinsky
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of forming silicon on insulator wafers
- Publication number 20040014302
- Publication date Jan 22, 2004
- Peter G. Tolchinsky
- H01 - BASIC ELECTRIC ELEMENTS

Irwin Yablok

Person

Patents Grantslast 30 patents

Epitaxial wafer and a method of manufacturing thereof

Methods and apparatuses for manufacturing ultra thin device layers...

Transistors with increased mobility in the channel zone and method...

Method for manufacturing a silicon-on-insulator (SOI) wafer with an...

Methods of vertically stacking wafers using porous silicon

Complete device layer transfer without edge exclusion via direct wa...

Methods and apparatuses for manufacturing ultra thin device layers...

Method for making a semiconductor device having increased carrier m...

Method of forming silicon on insulator wafers

Complete device layer transfer without edge exclusion via direct wa...

Patents Applicationslast 30 patents

EPITAXIAL WAFER AND A METHOD OF MANUFACTURING THEREOF

Back gate doping for SOI substrates

Method for manufacturing a silicon-on-insulator (SOI) wafer with an...

APPLICATIONS OF POLYCRYSTALLINE WAFERS

Insulation layer for silicon-on-insulator wafer

Methods and apparatuses for manufacturing ultra thin device layers...

Methods of vertically stacking wafers using porous silicon

Method for manufacturing a silicon-on-Insulator (SOI) wafer with an...

Transistors with increased mobility in the channel zone and method...

Semiconductor wafers with non-standard crystal orientations and met...

Complete device layer transfer without edge exclusion via direct wa...

Devices and methods employing high thermal conductivity heat dissip...

Methods and apparatuses for manufacturing ultra thin device layers...

Method for making a semiconductor device having increased carrier m...

Complete device layer transfer without edge exclusion via direct wa...

Method of forming silicon on insulator wafers