Isabel C. Chu

Person

Melrose, NY, US

People

Patents Grantslast 30 patents

Information Patent Grant
Multi-layer encapsulation to enable endpoint-based process control...
- Patent number 10,957,850
- Issue date Mar 23, 2021
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,714,683
- Issue date Jul 14, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric fill for memory pillar elements
- Patent number 10,692,925
- Issue date Jun 23, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multilayer hardmask for high performance MRAM devices
- Patent number 10,680,169
- Issue date Jun 9, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for patterning features in tantalum nitride (Ta...
- Patent number 10,672,618
- Issue date Jun 2, 2020
- International Business Machines Corporation
- Vinh Luong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gap fill evaluation for integrated circuits
- Patent number 10,622,250
- Issue date Apr 14, 2020
- International Business Machines Corporation
- Isabel Cristina Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Dielectric gap fill evaluation for integrated circuits
- Patent number 10,312,140
- Issue date Jun 4, 2019
- International Business Machines Corporation
- Isabel Cristina Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate N and P fin etching for reduced CMOS device leakage
- Patent number 10,229,910
- Issue date Mar 12, 2019
- International Business Machines Corporation
- Isabel C. Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Separate N and P fin etching for reduced CMOS device leakage
- Patent number 9,711,507
- Issue date Jul 18, 2017
- International Business Machines Corporation
- Isabel C. Chu
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES
- Publication number 20200144491
- Publication date May 7, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC FILL FOR MEMORY PILLAR ELEMENTS
- Publication number 20200119089
- Publication date Apr 16, 2020
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-LAYER ENCAPSULATION TO ENABLE ENDPOINT-BASED PROCESS CONTROL...
- Publication number 20200111951
- Publication date Apr 9, 2020
- International Business Machines Corporation
- Ashim Dutta
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES
- Publication number 20190386210
- Publication date Dec 19, 2019
- International Business Machines Corporation
- Michael Rizzolo
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS
- Publication number 20190189504
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Isabel Cristina Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS
- Publication number 20190189503
- Publication date Jun 20, 2019
- International Business Machines Corporation
- Isabel Cristina Chu
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Systems and Methods for Patterning Features in Tantalum Nitride (Ta...
- Publication number 20190096672
- Publication date Mar 28, 2019
- TOKYO ELECTRON LIMITED
- Vinh Luong
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEPARATE N AND P FIN ETCHING FOR REDUCED CMOS DEVICE LEAKAGE
- Publication number 20180097002
- Publication date Apr 5, 2018
- International Business Machines Corporation
- Isabel C. Chu
- H01 - BASIC ELECTRIC ELEMENTS

Isabel C. Chu

Person

Patents Grantslast 30 patents

Multi-layer encapsulation to enable endpoint-based process control...

Multilayer hardmask for high performance MRAM devices

Dielectric fill for memory pillar elements

Multilayer hardmask for high performance MRAM devices

Systems and methods for patterning features in tantalum nitride (Ta...

Dielectric gap fill evaluation for integrated circuits

Dielectric gap fill evaluation for integrated circuits

Separate N and P fin etching for reduced CMOS device leakage

Separate N and P fin etching for reduced CMOS device leakage

Patents Applicationslast 30 patents

MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES

DIELECTRIC FILL FOR MEMORY PILLAR ELEMENTS

MULTI-LAYER ENCAPSULATION TO ENABLE ENDPOINT-BASED PROCESS CONTROL...

MULTILAYER HARDMASK FOR HIGH PERFORMANCE MRAM DEVICES

DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS

DIELECTRIC GAP FILL EVALUATION FOR INTEGRATED CIRCUITS

Systems and Methods for Patterning Features in Tantalum Nitride (Ta...

SEPARATE N AND P FIN ETCHING FOR REDUCED CMOS DEVICE LEAKAGE