Isamu Kawashima

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Tape adhering method and tape adhering device
- Patent number 8,440,040
- Issue date May 14, 2013
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Surface protection film peeling method and surface protection film...
- Patent number 8,151,856
- Issue date Apr 10, 2012
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Grant
Workpiece processing device
- Patent number 7,490,650
- Issue date Feb 17, 2009
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Device for calculating the quantity of light and method thereof
- Patent number 7,158,910
- Issue date Jan 2, 2007
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- G01 - MEASURING TESTING
Information Patent Grant
Processing apparatus and wafer processing method
- Patent number 6,946,311
- Issue date Sep 20, 2005
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wafer planarization apparatus and planarization method thereof
- Patent number 6,805,616
- Issue date Oct 19, 2004
- Tokyo Seimitsu Co., Ltd.
- Isamu Kawashima
- B24 - GRINDING POLISHING

Patents Applicationslast 30 patents

Information Patent Application
TAPE ADHERING METHOD AND TAPE ADHERING DEVICE
- Publication number 20110024020
- Publication date Feb 3, 2011
- TOKYO SEIMITSU CO., LTD.
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
PEELING TAPE ADHERING METHOD AND PEELING TAPE ADHERING DEVICE
- Publication number 20070284028
- Publication date Dec 13, 2007
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
WORKPIECE PROCESSING DEVICE
- Publication number 20070277934
- Publication date Dec 6, 2007
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAPE ADHERING METHOD AND TAPE ADHERING DEVICE
- Publication number 20070267132
- Publication date Nov 22, 2007
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
SURFACE PROTECTION FILM PEELING METHOD AND SURFACE PROTECTION FILM...
- Publication number 20070269962
- Publication date Nov 22, 2007
- Isamu Kawashima
- B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information Patent Application
CASSETTE CONVEYANCE METHOD AND CASSETTE CONVEYANCE APPARATUS
- Publication number 20070262276
- Publication date Nov 15, 2007
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wafer processing method and wafer processing apparatus
- Publication number 20050118823
- Publication date Jun 2, 2005
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Device for calculating the quantity of light and method thereof
- Publication number 20050027490
- Publication date Feb 3, 2005
- Isamu Kawashima
- G01 - MEASURING TESTING
Information Patent Application
Processing apparatus and wafer processing method
- Publication number 20040241963
- Publication date Dec 2, 2004
- Isamu Kawashima
- H01 - BASIC ELECTRIC ELEMENTS

Isamu Kawashima

Person

Patents Grantslast 30 patents

Tape adhering method and tape adhering device

Surface protection film peeling method and surface protection film...

Workpiece processing device

Device for calculating the quantity of light and method thereof

Processing apparatus and wafer processing method

Wafer planarization apparatus and planarization method thereof

Patents Applicationslast 30 patents

TAPE ADHERING METHOD AND TAPE ADHERING DEVICE

PEELING TAPE ADHERING METHOD AND PEELING TAPE ADHERING DEVICE

WORKPIECE PROCESSING DEVICE

TAPE ADHERING METHOD AND TAPE ADHERING DEVICE

SURFACE PROTECTION FILM PEELING METHOD AND SURFACE PROTECTION FILM...

CASSETTE CONVEYANCE METHOD AND CASSETTE CONVEYANCE APPARATUS

Wafer processing method and wafer processing apparatus

Device for calculating the quantity of light and method thereof

Processing apparatus and wafer processing method