Isamu Sato

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Cu column, Cu core column, solder joint, and through-silicon via
- Patent number 10,811,376
- Issue date Oct 20, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Container and package
- Patent number 10,781,026
- Issue date Sep 22, 2020
- Senju Metal Industry Co., Ltd.
- Isamu Sato
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Solder material, solder paste, solder preform, solder joint and met...
- Patent number 10,717,157
- Issue date Jul 21, 2020
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Joining member, solder material, solder paste, formed solder, flux...
- Patent number 10,675,719
- Issue date Jun 9, 2020
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Flux composition for solder applications
- Patent number 10,610,979
- Issue date Apr 7, 2020
- Senju Metal Industry Co., Ltd.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core material, semiconductor package, and forming method of bump el...
- Patent number 10,381,319
- Issue date Aug 13, 2019
- Senju Metal Industry Co., Ltd.
- Tomoaki Nishino
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method of manufacturing cu core ball
- Patent number 10,370,771
- Issue date Aug 6, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Cu core ball, solder paste, formed solder, Cu core column, and sold...
- Patent number 10,322,472
- Issue date Jun 18, 2019
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Solder material, solder joint, and method of manufacturing the sold...
- Patent number 10,173,287
- Issue date Jan 8, 2019
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Method for producing metal ball, joining material, and metal ball
- Patent number 10,150,185
- Issue date Dec 11, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu core ball
- Patent number 10,147,695
- Issue date Dec 4, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu ball, Cu core ball, solder joint, solder paste, and solder foam
- Patent number 10,137,535
- Issue date Nov 27, 2018
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Device for coating thin molten solder film, thin solder film-covere...
- Patent number 9,956,634
- Issue date May 1, 2018
- Senju Metal Industry Co., Ltd.
- Isamu Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ni ball, Ni core ball, solder joint, solder paste, and solder foam
- Patent number 9,802,251
- Issue date Oct 31, 2017
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Cu ball
- Patent number 9,668,358
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Bump electrode, board which has bump electrodes, and method for man...
- Patent number 9,662,730
- Issue date May 30, 2017
- Senju Metal Industry Co., Ltd.
- Takahiro Hattori
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Solder bump forming method and apparatus
- Patent number 9,511,438
- Issue date Dec 6, 2016
- Senju Metal Industry Co., Ltd.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Core ball, solder paste, formed-solder, flux-coated core ball and s...
- Patent number 9,278,409
- Issue date Mar 8, 2016
- Senju Metal Industry Co., Ltd.
- Hiroyoshi Kawasaki
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...
- Patent number 9,266,196
- Issue date Feb 23, 2016
- Senju Metal Industry Co., Ltd.
- Takashi Akagawa
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Apparatus for measuring magnetic field of microwave-assisted head
- Patent number 8,680,855
- Issue date Mar 25, 2014
- TDK Corporation
- Isamu Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Microwave assisted magnetic recording head and magnetic recording m...
- Patent number 8,582,239
- Issue date Nov 12, 2013
- TDK Corporation
- Yoshikazu Soeno
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic recording method using microwave assisted head
- Patent number 8,547,655
- Issue date Oct 1, 2013
- TDK Corporation
- Tsutomu Aoyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Storing package unit and a storing method for micro solder spheres
- Patent number 8,434,614
- Issue date May 7, 2013
- Senju Metal Industry Co., Ltd.
- Isamu Sato
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Grant
Method for magnetic recording using microwave assisted magnetic head
- Patent number 8,427,773
- Issue date Apr 23, 2013
- TDK Corporation
- Tsutomu Aoyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Apparatus for measuring magnetic field of microwave-assisted head
- Patent number 8,358,127
- Issue date Jan 22, 2013
- TDK Corporation
- Isamu Sato
- G11 - INFORMATION STORAGE
Information Patent Grant
Microwave assisted magnetic head
- Patent number 8,300,346
- Issue date Oct 30, 2012
- TDK Corporation
- Hiroshi Ikeda
- G11 - INFORMATION STORAGE
Information Patent Grant
Microwave assisted magnetic head and magnetic disk device
- Patent number 8,264,916
- Issue date Sep 11, 2012
- TDK Corporation
- Tsutomu Aoyama
- G11 - INFORMATION STORAGE
Information Patent Grant
Magnetic recording and reproducing apparatus with thin-film magneti...
- Patent number 8,184,395
- Issue date May 22, 2012
- TDK Corporation
- Hiroshi Ikeda
- B82 - NANO-TECHNOLOGY
Information Patent Grant
Thin-film magnetic head having microwave magnetic exciting function...
- Patent number 8,174,937
- Issue date May 8, 2012
- TDK Corporation
- Hiroshi Ikeda
- G11 - INFORMATION STORAGE
Information Patent Grant
Microwave assisted magnetic head
- Patent number 8,107,352
- Issue date Jan 31, 2012
- TDK Corporation
- Noboru Yamanaka
- G11 - INFORMATION STORAGE

Patents Applicationslast 30 patents

Information Patent Application
SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT
- Publication number 20200061757
- Publication date Feb 27, 2020
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki NISHINO
- B22 - CASTING POWDER METALLURGY
Information Patent Application
SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER,...
- Publication number 20190358751
- Publication date Nov 28, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Naoto KAMEDA
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
CONTAINER AND PACKAGE
- Publication number 20190300262
- Publication date Oct 3, 2019
- SENJU METAL INDUSTRY CO., LTD.
- Isamu SATO
- B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information Patent Application
Flux
- Publication number 20180339375
- Publication date Nov 29, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Daisuke Maruko
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
Soldering Material, Solder Joint, and Method for Inspecting Solderi...
- Publication number 20180281118
- Publication date Oct 4, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Core Material, Semiconductor Package, and Forming Method of Bump El...
- Publication number 20180174991
- Publication date Jun 21, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Tomoaki Nishino
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...
- Publication number 20180015572
- Publication date Jan 18, 2018
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Solder Material, Solder Paste, Solder Preform, Solder Joint and Met...
- Publication number 20170312860
- Publication date Nov 2, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Takahiro Hattori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via
- Publication number 20170287862
- Publication date Oct 5, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- B32 - LAYERED PRODUCTS
Information Patent Application
Solder Material, Solder Joint, and Method of Manufacturing the Sold...
- Publication number 20170252871
- Publication date Sep 7, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam
- Publication number 20170246711
- Publication date Aug 31, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
- Publication number 20170233884
- Publication date Aug 17, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi KAWASAKI
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
Method for Producing Metal Ball, Joining Material, and Metal Ball
- Publication number 20170182600
- Publication date Jun 29, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam
- Publication number 20170080491
- Publication date Mar 23, 2017
- SENJU METAL INDUSTRY CO., LTD.
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Sold...
- Publication number 20160368105
- Publication date Dec 22, 2016
- SENJU METAL INDUSTRY CO., LTD
- Takahiro Hattori
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu Core Ball
- Publication number 20160148885
- Publication date May 26, 2016
- SENJU METAL INDUSTRY CO., LTD
- Hiroyoshi Kawasaki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...
- Publication number 20150217409
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Takashi AKAGAWA
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...
- Publication number 20150217408
- Publication date Aug 6, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT
- Publication number 20150209912
- Publication date Jul 30, 2015
- Senju Metal lndustry Co., Ltd.
- Hiroyoshi KAWASAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
Device for Coating Thin Molten Solder Film, Thin Solder Film-covere...
- Publication number 20150174678
- Publication date Jun 25, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Isamu Sato
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SOLDER BUMP FORMING METHOD AND APPARATUS
- Publication number 20150007958
- Publication date Jan 8, 2015
- SENJU METAL INDUSTRY CO., LTD.
- Issaku Sato
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Application
APPARATUS FOR MEASURING MAGNETIC FIELD OF MICROWAVE-ASSISTED HEAD
- Publication number 20130301162
- Publication date Nov 14, 2013
- Isamu SATO
- G01 - MEASURING TESTING
Information Patent Application
MICROWAVE ASSISTED MAGNETIC RECORDING HEAD AND MAGNETIC RECORDING M...
- Publication number 20120320474
- Publication date Dec 20, 2012
- TDK Corporation
- Yoshikazu Soeno
- G11 - INFORMATION STORAGE
Information Patent Application
METHOD FOR MAGNETIC RECORDING USING MICROWAVE ASSISTED MAGNETIC HEAD
- Publication number 20120243117
- Publication date Sep 27, 2012
- TDK Corporation
- Tsutomu Aoyama
- G11 - INFORMATION STORAGE
Information Patent Application
MICROWAVE ASSISTED MAGNETIC HEAD AND MAGNETIC DISK DEVICE
- Publication number 20120230167
- Publication date Sep 13, 2012
- TDK Corporation
- Tsutomu AOYAMA
- G11 - INFORMATION STORAGE
Information Patent Application
MAGNETIC RECORDING METHOD USING MICROWAVE ASSISTED HEAD
- Publication number 20120127610
- Publication date May 24, 2012
- TDK Corporation
- Tsutomu AOYAMA
- G11 - INFORMATION STORAGE
Information Patent Application
MICROWAVE ASSISTED MAGNETIC HEAD
- Publication number 20120033534
- Publication date Feb 9, 2012
- TDK Corporation
- Noboru YAMANAKA
- G11 - INFORMATION STORAGE
Information Patent Application
APPARATUS FOR MEASURING MAGNETIC FIELD OF MICROWAVE-ASSISTED HEAD
- Publication number 20110248710
- Publication date Oct 13, 2011
- TDK Corporation
- Isamu SATO
- G01 - MEASURING TESTING
Information Patent Application
MICROWAVE ASSISTED MAGNETIC HEAD
- Publication number 20110242696
- Publication date Oct 6, 2011
- TDK Corporation
- Hiroshi IKEDA
- G11 - INFORMATION STORAGE
Information Patent Application
Magnetic Recording Apparatus Provided with Microwave-Assisted Head
- Publication number 20110222185
- Publication date Sep 15, 2011
- TDK Corporation
- Tetsuya Roppongi
- G11 - INFORMATION STORAGE

Person

Patents Grantslast 30 patents

Cu column, Cu core column, solder joint, and through-silicon via

Container and package

Solder material, solder paste, solder preform, solder joint and met...

Joining member, solder material, solder paste, formed solder, flux...

Flux composition for solder applications

Core material, semiconductor package, and forming method of bump el...

Method of manufacturing cu core ball

Cu core ball, solder paste, formed solder, Cu core column, and sold...

Solder material, solder joint, and method of manufacturing the sold...

Method for producing metal ball, joining material, and metal ball

Cu core ball

Cu ball, Cu core ball, solder joint, solder paste, and solder foam

Device for coating thin molten solder film, thin solder film-covere...

Ni ball, Ni core ball, solder joint, solder paste, and solder foam

Cu ball

Bump electrode, board which has bump electrodes, and method for man...

Solder bump forming method and apparatus

Core ball, solder paste, formed-solder, flux-coated core ball and s...

Ag ball, ag core ball, flux-coated ag ball, flux-coated ag core bal...

Apparatus for measuring magnetic field of microwave-assisted head

Microwave assisted magnetic recording head and magnetic recording m...

Magnetic recording method using microwave assisted head

Storing package unit and a storing method for micro solder spheres

Method for magnetic recording using microwave assisted magnetic head

Apparatus for measuring magnetic field of microwave-assisted head

Microwave assisted magnetic head

Microwave assisted magnetic head and magnetic disk device

Magnetic recording and reproducing apparatus with thin-film magneti...

Thin-film magnetic head having microwave magnetic exciting function...

Microwave assisted magnetic head

Patents Applicationslast 30 patents

SOLDER MATERIAL, SOLDER PASTE, FORMED SOLDER AND SOLDER JOINT

SOLDER ALLOY FOR BONDING CU PIPES AND/OR FE PIPES, PREFORM SOLDER,...

CONTAINER AND PACKAGE

Flux

Soldering Material, Solder Joint, and Method for Inspecting Solderi...

Core Material, Semiconductor Package, and Forming Method of Bump El...

Joining Member, Solder Material, Solder Paste, Formed Solder, Flux...

Solder Material, Solder Paste, Solder Preform, Solder Joint and Met...

Cu Column, Cu Core Column, Solder Joint, and Through-Silicon Via

Solder Material, Solder Joint, and Method of Manufacturing the Sold...

Cu Ball, Cu Core Ball, Solder Joint, Solder Paste, and Solder Foam

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Method for Producing Metal Ball, Joining Material, and Metal Ball

Ni Ball, Ni Core Ball, Solder Joint, Solder Paste, and Solder Foam

Cu Core Ball, Solder Paste, Formed Solder, Cu Core Column, and Sold...

Cu Core Ball

Ag BALL, Ag CORE BALL, FLUX-COATED Ag BALL, FLUX-COATED Ag CORE BAL...

CORE BALL, SOLDER PASTE, FORMED-SOLDER, FLUX-COATED CORE BALL AND S...

Cu CORE BALL, SOLDER PASTE AND SOLDER JOINT

Device for Coating Thin Molten Solder Film, Thin Solder Film-covere...

SOLDER BUMP FORMING METHOD AND APPARATUS

APPARATUS FOR MEASURING MAGNETIC FIELD OF MICROWAVE-ASSISTED HEAD

MICROWAVE ASSISTED MAGNETIC RECORDING HEAD AND MAGNETIC RECORDING M...

METHOD FOR MAGNETIC RECORDING USING MICROWAVE ASSISTED MAGNETIC HEAD

MICROWAVE ASSISTED MAGNETIC HEAD AND MAGNETIC DISK DEVICE

MAGNETIC RECORDING METHOD USING MICROWAVE ASSISTED HEAD

MICROWAVE ASSISTED MAGNETIC HEAD

APPARATUS FOR MEASURING MAGNETIC FIELD OF MICROWAVE-ASSISTED HEAD

MICROWAVE ASSISTED MAGNETIC HEAD

Magnetic Recording Apparatus Provided with Microwave-Assisted Head