Isao Arai

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Naka-gun, JP

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Patents Grantslast 30 patents

Information Patent Grant
High purity copper sputtering target material
- Patent number 10,889,889
- Issue date Jan 12, 2021
- Mitsubishi Materials Corporation
- Satoru Mori
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Hot-rolled copper plate
- Patent number 9,938,606
- Issue date Apr 10, 2018
- Mitsubishi Materials Corporation
- Kazunari Maki
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Power module substrate, power module substrate with heat sink, powe...
- Patent number 9,066,433
- Issue date Jun 23, 2015
- Mitsubishi Materials Corporation
- Yoshirou Kuromitsu
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES

Patents Applicationslast 30 patents

Information Patent Application
HIGH PURITY COPPER SPUTTERING TARGET MATERIAL
- Publication number 20180237901
- Publication date Aug 23, 2018
- MITSUBISHI MATERIALS CORPORATION
- Satoru Mori
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
HOT-ROLLED COPPER PLATE
- Publication number 20160047017
- Publication date Feb 18, 2016
- MITSUBISHI MATERIALS CORPORATION
- Kazunari MAKI
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
POWER MODULE SUBSTRATE, POWER MODULE SUBSTRATE WITH HEAT SINK, POWE...
- Publication number 20140192486
- Publication date Jul 10, 2014
- MITSUBISHI MATERIALS CORPORATION
- Yoshirou Kuromitsu
- C04 - CEMENTS CONCRETE ARTIFICIAL STONE CERAMICS REFRACTORIES