Isao Ichikawa

Person

Tokyo, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Film-shaped firing material, film-shaped firing material provided w...
- Patent number 11,707,787
- Issue date Jul 25, 2023
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Film-shaped firing material and film-shaped firing material with a...
- Patent number 11,420,255
- Issue date Aug 23, 2022
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Film-shaped fired material, and film-shaped fired material with sup...
- Patent number 11,285,536
- Issue date Mar 29, 2022
- Lintec Corporation
- Isao Ichikawa
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Film-shaped firing material and film-shaped firing material with su...
- Patent number 11,267,992
- Issue date Mar 8, 2022
- Lintec Corporation
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Firing material composition, method for manufacturing film-shaped f...
- Patent number 11,219,946
- Issue date Jan 11, 2022
- Lintec Corporation
- Takeshi Mori
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Adhesive composition, adhesive sheet, and method for producing semi...
- Patent number 10,131,824
- Issue date Nov 20, 2018
- Lintec Corporation
- Sayaka Tsuchiyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 9,562,179
- Issue date Feb 7, 2017
- Lintec Corporation
- Naoya Saiki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition, an adhesive sheet and a production method of...
- Patent number 9,434,865
- Issue date Sep 6, 2016
- Lintec Corporation
- Sayaka Tsuchiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, an adhesive sheet and a production method of...
- Patent number 9,382,455
- Issue date Jul 5, 2016
- Lintec Corporation
- Sayaka Tsuchiyama
- B32 - LAYERED PRODUCTS
Information Patent Grant
Film-like adhesive, adhesive sheet for semiconductor junction, and...
- Patent number 9,296,925
- Issue date Mar 29, 2016
- Lintec Corporation
- Yoji Wakayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 9,184,082
- Issue date Nov 10, 2015
- Lintec Corporation
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Semiconductor chip laminate and adhesive composition for semiconduc...
- Patent number 8,716,401
- Issue date May 6, 2014
- Lintec Corporation
- Yasunori Karasawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive compositions for a semiconductor, an adhesive sheet for a...
- Patent number 8,703,585
- Issue date Apr 22, 2014
- Lintec Corporation
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Process for manufacturing semiconductor devices
- Patent number 8,545,663
- Issue date Oct 1, 2013
- Lintec Corporation
- Osamu Yamazaki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Adhesive composition and adhesive sheet
- Patent number 8,247,503
- Issue date Aug 21, 2012
- Lintec Corporation
- Naoya Saiki
- B32 - LAYERED PRODUCTS
Information Patent Grant
Adhesive composition, adhesive sheet and production method of semic...
- Patent number 7,851,335
- Issue date Dec 14, 2010
- Lintec Corporation
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition, adhesive sheet and production process for sem...
- Patent number 7,842,551
- Issue date Nov 30, 2010
- Lintec Corporation
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Adhesive composition and adhesive sheet
- Patent number 7,674,859
- Issue date Mar 9, 2010
- Lintec Corporation
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL WITH SUPPO...
- Publication number 20230018086
- Publication date Jan 19, 2023
- LINTEC CORPORATION
- Hidekazu NAKAYAMA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF MANUFACTURING LAMINATE
- Publication number 20220293555
- Publication date Sep 15, 2022
- LINTEC CORPORATION
- Isao ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
METHOD OF MANUFACTURING LAMINATE
- Publication number 20220293554
- Publication date Sep 15, 2022
- LINTEC CORPORATION
- Isao ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL PROVIDED W...
- Publication number 20210121959
- Publication date Apr 29, 2021
- LINTEC CORPORATION
- Isao ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A...
- Publication number 20210078080
- Publication date Mar 18, 2021
- LINTEC CORPORATION
- Takeshi MORI
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FILM-SHAPED FIRED MATERIAL, AND FILM-SHAPED FIRED MATERIAL WITH SUP...
- Publication number 20200376549
- Publication date Dec 3, 2020
- LINTEC CORPORATION
- Isao ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...
- Publication number 20200277515
- Publication date Sep 3, 2020
- LINTEC CORPORATION
- Isao ICHIKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A...
- Publication number 20200276645
- Publication date Sep 3, 2020
- LINTEC CORPORATION
- Isao ICHIKAWA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
FIRING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING FILM-SHAPED F...
- Publication number 20200273596
- Publication date Aug 27, 2020
- LINTEC CORPORATION
- Takeshi MORI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive Composition, Adhesive Sheet, and Method for Producing Semi...
- Publication number 20160160094
- Publication date Jun 9, 2016
- LINTEC CORPORATION
- Sayaka Tsuchiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Composition, Adhesive Sheet And Production Process For Sem...
- Publication number 20160017188
- Publication date Jan 21, 2016
- LINTEC CORPORATION
- Naoya Saiki
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Film-Like Adhesive, Adhesive Sheet for Semiconductor Junction, and...
- Publication number 20150225613
- Publication date Aug 13, 2015
- LINTEC CORPORATION
- Yoji Wakayama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Composition, An Adhesive Sheet and a Production Method of...
- Publication number 20130244402
- Publication date Sep 19, 2013
- LINTEC CORPORATION
- Sayaka Tsuchiyama
- B32 - LAYERED PRODUCTS
Information Patent Application
Adhesive Composition, An Adhesive Sheet and a Production Method of...
- Publication number 20130244401
- Publication date Sep 19, 2013
- LINTEC CORPORATION
- Sayaka Tsuchiyama
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Compositions for a Semiconductor, an Adhesive Sheet for a...
- Publication number 20120196404
- Publication date Aug 2, 2012
- LINTEC CORPORATION
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Semiconductor Chip Laminate and Adhesive Composition for Semiconduc...
- Publication number 20100133703
- Publication date Jun 3, 2010
- LINTEC CORPORATION
- Yasunori Karasawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Method of Semic...
- Publication number 20090246913
- Publication date Oct 1, 2009
- LINTEC CORPORATION
- Isao Ichikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Method of Semic...
- Publication number 20090246915
- Publication date Oct 1, 2009
- LINTEC CORPORATION
- Isao Ichikawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20090170284
- Publication date Jul 2, 2009
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20090004829
- Publication date Jan 1, 2009
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20080242058
- Publication date Oct 2, 2008
- LINTEC CORPORATION
- Isao Ichikawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
Adhesive Composition, Adhesive Sheet and Production Process for Sem...
- Publication number 20080124839
- Publication date May 29, 2008
- LINTEC CORPORATION
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
Process for manufacturing process of semiconductor device
- Publication number 20080066856
- Publication date Mar 20, 2008
- LINTEC CORPORATION
- Osamu YAMAZAKI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Adhesive composition, adhesive sheet and production process for sem...
- Publication number 20070276079
- Publication date Nov 29, 2007
- Lintec Corporation
- Naoya Saiki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Isao Ichikawa

Person

Patents Grantslast 30 patents

Film-shaped firing material, film-shaped firing material provided w...

Film-shaped firing material and film-shaped firing material with a...

Film-shaped fired material, and film-shaped fired material with sup...

Film-shaped firing material and film-shaped firing material with su...

Firing material composition, method for manufacturing film-shaped f...

Adhesive composition, adhesive sheet, and method for producing semi...

Adhesive composition, adhesive sheet and production process for sem...

Adhesive composition, an adhesive sheet and a production method of...

Adhesive composition, an adhesive sheet and a production method of...

Film-like adhesive, adhesive sheet for semiconductor junction, and...

Adhesive composition, adhesive sheet and production process for sem...

Semiconductor chip laminate and adhesive composition for semiconduc...

Adhesive compositions for a semiconductor, an adhesive sheet for a...

Process for manufacturing semiconductor devices

Adhesive composition and adhesive sheet

Adhesive composition, adhesive sheet and production method of semic...

Adhesive composition, adhesive sheet and production process for sem...

Adhesive composition and adhesive sheet

Patents Applicationslast 30 patents

FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL WITH SUPPO...

METHOD OF MANUFACTURING LAMINATE

METHOD OF MANUFACTURING LAMINATE

FILM-SHAPED FIRING MATERIAL, FILM-SHAPED FIRING MATERIAL PROVIDED W...

FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A...

FILM-SHAPED FIRED MATERIAL, AND FILM-SHAPED FIRED MATERIAL WITH SUP...

FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH SU...

FILM-SHAPED FIRING MATERIAL AND FILM-SHAPED FIRING MATERIAL WITH A...

FIRING MATERIAL COMPOSITION, METHOD FOR MANUFACTURING FILM-SHAPED F...

Adhesive Composition, Adhesive Sheet, and Method for Producing Semi...

Adhesive Composition, Adhesive Sheet And Production Process For Sem...

Film-Like Adhesive, Adhesive Sheet for Semiconductor Junction, and...

Adhesive Composition, An Adhesive Sheet and a Production Method of...

Adhesive Composition, An Adhesive Sheet and a Production Method of...

Adhesive Compositions for a Semiconductor, an Adhesive Sheet for a...

Semiconductor Chip Laminate and Adhesive Composition for Semiconduc...

Adhesive Composition, Adhesive Sheet and Production Method of Semic...

Adhesive Composition, Adhesive Sheet and Production Method of Semic...

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Adhesive Composition, Adhesive Sheet and Production Process for Sem...

Process for manufacturing process of semiconductor device

Adhesive composition, adhesive sheet and production process for sem...