Isao Ochiai

Person

Ota-city, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Leadframe systems and related methods
- Patent number 11,101,197
- Issue date Aug 24, 2021
- Semiconductor Components Industries, LLC
- Hiroshi Inoguchi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Leadframe with efficient heat dissipation for semiconductor device...
- Patent number 10,361,148
- Issue date Jul 23, 2019
- Semiconductor Components Industries, LLC
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with chips on isolated mount regions
- Patent number 8,759,955
- Issue date Jun 24, 2014
- Semiconductor Components Industries, LLC
- Hideyuki Iwamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 7,605,475
- Issue date Oct 20, 2009
- Sanyo Electric Co., LTD
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and manufacturing method of the same
- Patent number 7,511,320
- Issue date Mar 31, 2009
- Sanyo Electric Co., LTD
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with slanting side surface for external connec...
- Patent number 7,504,722
- Issue date Mar 17, 2009
- Sanyo Electric Co., LTD
- Isao Ochiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Lead frame, resin sealing mold and method for manufacturing a semic...
- Patent number 7,326,041
- Issue date Feb 5, 2008
- Sanyo Electric Co., LTD
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method of manufacturing the same
- Patent number 7,208,826
- Issue date Apr 24, 2007
- Sanyo Electric Co., LTD
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 7,119,424
- Issue date Oct 10, 2006
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and hybrid integrated circuit device
- Patent number 7,102,211
- Issue date Sep 5, 2006
- Sanyo Electric Co., LTD
- Isao Ochiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit device and method for manufacturing the same
- Patent number 7,075,188
- Issue date Jul 11, 2006
- Sanyo Electric Co., LTD
- Takuji Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing method of semiconductor device
- Patent number 7,064,046
- Issue date Jun 20, 2006
- Sanyo Electric Co., LTD
- Motoaki Wakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Resin sealing-type semiconductor device and method for manufacturin...
- Patent number 6,998,701
- Issue date Feb 14, 2006
- Sanyo Electric Co., LTD
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and method for manufacturing the same
- Patent number 6,893,903
- Issue date May 17, 2005
- Sanyo Electric Co., LTD
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lead frame, resin sealing mold and method for manufacturing a semic...
- Patent number 6,724,072
- Issue date Apr 20, 2004
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical semiconductor device
- Patent number 6,606,174
- Issue date Aug 12, 2003
- Sanyo Electric Co., LTD
- Tsutomu Ishikawa
- H04 - ELECTRIC COMMUNICATION TECHNIQUE

Patents Applicationslast 30 patents

Information Patent Application
LEADFRAME SYSTEMS AND RELATED METHODS
- Publication number 20200312748
- Publication date Oct 1, 2020
- Semiconductor Components Industries, LLC
- Hiroshi INOGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20140264807
- Publication date Sep 18, 2014
- Semiconductor Components Industries, LLC
- Hideyuki Iwamura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20130187261
- Publication date Jul 25, 2013
- Hideyuki IWAMURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device and method of manufacturing the same
- Publication number 20070090521
- Publication date Apr 26, 2007
- Sanyo Electric Co., Ltd.
- Hideo Imaizumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20050269696
- Publication date Dec 8, 2005
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Application
Semiconductor device and manufacturing method of the same
- Publication number 20050248030
- Publication date Nov 10, 2005
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and hybrid integrated circuit device
- Publication number 20050236706
- Publication date Oct 27, 2005
- Isao Ochiai
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device
- Publication number 20050218526
- Publication date Oct 6, 2005
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20050029534
- Publication date Feb 10, 2005
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Manufacturing method of semiconductor device
- Publication number 20050009302
- Publication date Jan 13, 2005
- Sanyo Electric Co., Ltd.
- Motoaki Wakui
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20040222513
- Publication date Nov 11, 2004
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Circuit device and method for manufacturing the same
- Publication number 20040212059
- Publication date Oct 28, 2004
- Takuji Kato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Resin sealing-type semiconductor device and method for manufacturin...
- Publication number 20040201082
- Publication date Oct 14, 2004
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, resin sealing mold and method for manufacturing a semic...
- Publication number 20040155365
- Publication date Aug 12, 2004
- Sanyo Electric Co., Ltd.
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method for manufacturing the same
- Publication number 20030143779
- Publication date Jul 31, 2003
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame, resin sealing mold and method for manufacturing a semic...
- Publication number 20030090877
- Publication date May 15, 2003
- Isao Ochiai
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and method of manufacturing the same
- Publication number 20020005576
- Publication date Jan 17, 2002
- Noriaki Sakamoto
- H01 - BASIC ELECTRIC ELEMENTS

Isao Ochiai

Person

Patents Grantslast 30 patents

Leadframe systems and related methods

Leadframe with efficient heat dissipation for semiconductor device...

Semiconductor device with chips on isolated mount regions

Semiconductor device

Semiconductor device and manufacturing method of the same

Semiconductor device with slanting side surface for external connec...

Lead frame, resin sealing mold and method for manufacturing a semic...

Semiconductor device and method of manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and hybrid integrated circuit device

Circuit device and method for manufacturing the same

Manufacturing method of semiconductor device

Resin sealing-type semiconductor device and method for manufacturin...

Semiconductor device and method for manufacturing the same

Lead frame, resin sealing mold and method for manufacturing a semic...

Optical semiconductor device

Patents Applicationslast 30 patents

LEADFRAME SYSTEMS AND RELATED METHODS

SEMICONDUCTOR DEVICE

SEMICONDUCTOR DEVICE

Circuit device and method of manufacturing the same

Semiconductor device and manufacturing method of the same

Semiconductor device and manufacturing method of the same

Semiconductor device and hybrid integrated circuit device

Semiconductor device

Semiconductor device and method of manufacturing the same

Manufacturing method of semiconductor device

Semiconductor device and method for manufacturing the same

Circuit device and method for manufacturing the same

Resin sealing-type semiconductor device and method for manufacturin...

Lead frame, resin sealing mold and method for manufacturing a semic...

Semiconductor device and method for manufacturing the same

Lead frame, resin sealing mold and method for manufacturing a semic...

Semiconductor device and method of manufacturing the same