Isao Ozawa

Person

Chigasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,854,946
- Issue date Dec 26, 2023
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 11,424,176
- Issue date Aug 23, 2022
- Kioxia Corporation
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 10,872,844
- Issue date Dec 22, 2020
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and semiconductor package including plural sol...
- Patent number 10,566,274
- Issue date Feb 18, 2020
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device package having an oscillator and an apparatus...
- Patent number 10,409,338
- Issue date Sep 10, 2019
- TOSHIBA MEMORY CORPORATION
- Manabu Matsumoto
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 10,366,942
- Issue date Jul 30, 2019
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor package
- Patent number 10,297,571
- Issue date May 21, 2019
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number 10,204,661
- Issue date Feb 12, 2019
- TOSHIBA MEMORY CORPORATION
- Manabu Matsumoto
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor device and semiconductor package
- Patent number 10,090,235
- Issue date Oct 2, 2018
- TOSHIBA MEMORY CORPORATION
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Data storage device with nonvolatile memory
- Patent number 9,911,502
- Issue date Mar 6, 2018
- TOSHIBA MEMORY CORPORATION
- Koichi Nagai
- G11 - INFORMATION STORAGE
Information Patent Grant
Data storage device including nonvolatile memory in which on/off st...
- Patent number 9,704,593
- Issue date Jul 11, 2017
- Kabushiki Kaisha Toshiba
- Koichi Nagai
- G11 - INFORMATION STORAGE
Information Patent Grant
Substrate for an electronic circuit
- Patent number D778852
- Issue date Feb 14, 2017
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Substrate for an electronic circuit
- Patent number D778850
- Issue date Feb 14, 2017
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Substrate for an electronic circuit
- Patent number D778851
- Issue date Feb 14, 2017
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device having a sealing layer covering a semiconducto...
- Patent number 9,543,271
- Issue date Jan 10, 2017
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for an electronic circuit
- Patent number D764424
- Issue date Aug 23, 2016
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device and semiconductor package having a plurality o...
- Patent number 9,275,947
- Issue date Mar 1, 2016
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Memory module and video camera
- Patent number 9,173,293
- Issue date Oct 27, 2015
- Kabushiki Kaisha Toshiba
- Yasuyuki Nagahara
- G11 - INFORMATION STORAGE
Information Patent Grant
Semiconductor module including first and second wiring portions sep...
- Patent number 9,087,831
- Issue date Jul 21, 2015
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Substrate for an electronic circuit
- Patent number D730304
- Issue date May 26, 2015
- Kabushiki Kaisha Toshiba
- Manabu Matsumoto
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 8,970,019
- Issue date Mar 3, 2015
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Portion of a substrate for an electronic circuit
- Patent number D673921
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Portion of a substrate for an electronic circuit
- Patent number D673922
- Issue date Jan 8, 2013
- Kabushiki Kaisha Toshiba
- Takakatsu Moriai
- D13 - Equipment for production, distribution, or transformation of energy
Information Patent Grant
Memory system
- Patent number 8,131,912
- Issue date Mar 6, 2012
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Grant
Semiconductor device with sealed semiconductor chip
- Patent number 7,919,837
- Issue date Apr 5, 2011
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor memory card
- Patent number 7,495,329
- Issue date Feb 24, 2009
- Kabushiki Kaisha Toshiba
- Yohichi Ohta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Semiconductor device in which semiconductor chip is mounted on lead...
- Patent number 7,339,257
- Issue date Mar 4, 2008
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Wiring board and a packaging assembly using the same
- Patent number 6,995,320
- Issue date Feb 7, 2006
- Kabushiki Kaisha Toshiba
- Takeshi Kusakabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Chip mounting substrate, first level assembly, and second level ass...
- Patent number 6,791,193
- Issue date Sep 14, 2004
- Kabushiki Kaisha Toshiba
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device
- Patent number D473198
- Issue date Apr 15, 2003
- Kabushiki Kaisha Toshiba
- Isao Ozawa
- D13 - Equipment for production, distribution, or transformation of energy

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220352053
- Publication date Nov 3, 2022
- KIOXIA Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20220044987
- Publication date Feb 10, 2022
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20210074609
- Publication date Mar 11, 2021
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20190295928
- Publication date Sep 26, 2019
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20180315695
- Publication date Nov 1, 2018
- Toshiba Memory Corporation
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE PACKAGE HAVING AN OSCILLATOR AND AN APPARATUS...
- Publication number 20170010639
- Publication date Jan 12, 2017
- Kabushiki Kaisha Toshiba
- Manabu MATSUMOTO
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE HAVING A SEALING LAYER COVERING A SEMICONDUCTO...
- Publication number 20160268229
- Publication date Sep 15, 2016
- Kabushiki Kaisha Toshiba
- Manabu MATSUMOTO
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DATA STORAGE DEVICE
- Publication number 20160125950
- Publication date May 5, 2016
- KABUSHIKI KAISHA TOSHIBA
- Koichi NAGAI
- G11 - INFORMATION STORAGE
Information Patent Application
MEMORY MODULE AND VIDEO CAMERA
- Publication number 20150380062
- Publication date Dec 31, 2015
- KABUSHIKI KAISHA TOSHIBA
- Yasuyuki Nagahara
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20150380061
- Publication date Dec 31, 2015
- Kabushiki Kaisha Toshiba
- Manabu MATSUMOTO
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR PACKAGE AND ELECTRONIC APPARATUS
- Publication number 20150200008
- Publication date Jul 16, 2015
- KABUSHIKI KAISHA TOSHIBA
- Isao OZAWA
- G11 - INFORMATION STORAGE
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20150155225
- Publication date Jun 4, 2015
- KABUSHIKI KAISHA TOSHIBA
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20150137363
- Publication date May 21, 2015
- Kabushiki Kaisha Toshiba
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE
- Publication number 20150130059
- Publication date May 14, 2015
- KABUSHIKI KAISHA TOSHIBA
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR PACKAGE
- Publication number 20150069632
- Publication date Mar 12, 2015
- KABUSHIKI KAISHA TOSHIBA
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MODULE
- Publication number 20130187272
- Publication date Jul 25, 2013
- Kabushiki Kaisha Toshiba
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20120326338
- Publication date Dec 27, 2012
- Kabushiki Kaisha Toshiba
- Toyokazu EGUCHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY MODULE AND VIDEO CAMERA
- Publication number 20120210049
- Publication date Aug 16, 2012
- KABUSHIKI KAISHA TOSHIBA
- Yasuyuki NAGAHARA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP
- Publication number 20110133323
- Publication date Jun 9, 2011
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE
- Publication number 20100007014
- Publication date Jan 14, 2010
- Kabushiki Kaisha Toshiba
- Hidetoshi Suzuki
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MEMORY SYSTEM
- Publication number 20090089490
- Publication date Apr 2, 2009
- Kabushiki Kaisha Toshiba
- Isao OZAWA
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME
- Publication number 20090026630
- Publication date Jan 29, 2009
- Kabushiki Kaisha Toshiba
- Isao OZAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR MEMORY CARD
- Publication number 20070170567
- Publication date Jul 26, 2007
- Kabushiki Kaisha Toshiba
- Yohichi Ohta
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Semiconductor device with sealed semiconductor chip
- Publication number 20060255436
- Publication date Nov 16, 2006
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Lead frame for semiconductor device
- Publication number 20060145329
- Publication date Jul 6, 2006
- KABUSHIKI KAISHA TOSHIBA
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device in which semiconductor chip is mounted on lead...
- Publication number 20050236698
- Publication date Oct 27, 2005
- Isao Ozawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Chip mounting substrate, first level assembly, and second level ass...
- Publication number 20050006747
- Publication date Jan 13, 2005
- Kabushiki Kaisha Toshiba
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Wiring board and a packaging assembly using the same
- Publication number 20040104465
- Publication date Jun 3, 2004
- Kabushiki Kaisha Toshiba
- Takeshi Kusakabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chip mounting substrate, first level assembly, and second level ass...
- Publication number 20040046262
- Publication date Mar 11, 2004
- Kabushiki Kaisha Toshiba
- Shinya Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor module in which plural semiconductor chips are enclos...
- Publication number 20020130404
- Publication date Sep 19, 2002
- Toshihiro Ushijima
- H01 - BASIC ELECTRIC ELEMENTS

Person

Patents Grantslast 30 patents

Semiconductor device with sealed semiconductor chip

Semiconductor device with sealed semiconductor chip

Semiconductor device with sealed semiconductor chip

Semiconductor device and semiconductor package including plural sol...

Semiconductor device package having an oscillator and an apparatus...

Semiconductor device with sealed semiconductor chip

Semiconductor package

Semiconductor device

Semiconductor device and semiconductor package

Data storage device with nonvolatile memory

Data storage device including nonvolatile memory in which on/off st...

Substrate for an electronic circuit

Substrate for an electronic circuit

Substrate for an electronic circuit

Semiconductor device having a sealing layer covering a semiconducto...

Substrate for an electronic circuit

Semiconductor device and semiconductor package having a plurality o...

Memory module and video camera

Semiconductor module including first and second wiring portions sep...

Substrate for an electronic circuit

Semiconductor device with sealed semiconductor chip

Portion of a substrate for an electronic circuit

Portion of a substrate for an electronic circuit

Memory system

Semiconductor device with sealed semiconductor chip

Semiconductor memory card

Semiconductor device in which semiconductor chip is mounted on lead...

Wiring board and a packaging assembly using the same

Chip mounting substrate, first level assembly, and second level ass...

Semiconductor device

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE PACKAGE HAVING AN OSCILLATOR AND AN APPARATUS...

SEMICONDUCTOR DEVICE HAVING A SEALING LAYER COVERING A SEMICONDUCTO...

DATA STORAGE DEVICE

MEMORY MODULE AND VIDEO CAMERA

SEMICONDUCTOR DEVICE

SEMICONDUCTOR PACKAGE AND ELECTRONIC APPARATUS

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR DEVICE AND SEMICONDUCTOR PACKAGE

SEMICONDUCTOR PACKAGE

SEMICONDUCTOR MODULE

SEMICONDUCTOR DEVICE

MEMORY MODULE AND VIDEO CAMERA

SEMICONDUCTOR DEVICE WITH SEALED SEMICONDUCTOR CHIP

SEMICONDUCTOR DEVICE

MEMORY SYSTEM

SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME

SEMICONDUCTOR MEMORY CARD

Semiconductor device with sealed semiconductor chip

Lead frame for semiconductor device

Semiconductor device in which semiconductor chip is mounted on lead...

Chip mounting substrate, first level assembly, and second level ass...

Wiring board and a packaging assembly using the same

Chip mounting substrate, first level assembly, and second level ass...

Semiconductor module in which plural semiconductor chips are enclos...