Isao Watanabe

Person

Kawasaki-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Conductive material and method for filling via-hole
- Patent number 7,531,115
- Issue date May 12, 2009
- Fujitsu Limited
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Conductive material and method for filling via-hole
- Patent number 6,886,248
- Issue date May 3, 2005
- Fujitsu Limited
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcapsulating conductive metal particles with polymerized monomers
- Patent number 6,737,108
- Issue date May 18, 2004
- Fujitsu Limited
- Hiroaki Date
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Microcapsulating conductive metal particles with polymerized monomers
- Patent number 6,406,746
- Issue date Jun 18, 2002
- Fujitsu Limited
- Hiroaki Date
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithium secondary battery and cathode composition therefor
- Patent number 6,187,477
- Issue date Feb 13, 2001
- Fujitsu Limited
- Isao Watanabe
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Lithium secondary battery and cathode composition therefor
- Patent number 6,136,475
- Issue date Oct 24, 2000
- Fujitsu Limited
- Masami Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for production of microcapsule type conductive filler
- Patent number 6,080,443
- Issue date Jun 27, 2000
- Fujitsu Limited
- Hiroaki Date
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Photosensitive, heat-resistant resin composition for forming patterns
- Patent number 6,045,975
- Issue date Apr 4, 2000
- Fujitsu Limited
- Motoaki Tani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Process for using photosensitive, heat-resistant resin composition...
- Patent number 6,013,419
- Issue date Jan 11, 2000
- Fujitsu Limited
- Motoaki Tani
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
Photosensitive, heat-resistant resin composition and process for us...
- Patent number 5,972,807
- Issue date Oct 26, 1999
- Fujitsu Limited
- Motaki Tani
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Process and apparatus and panel heater for soldering electronic com...
- Patent number 5,770,835
- Issue date Jun 23, 1998
- Fujitsu Limited
- Seiki Sakuyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Electrolytic solution for lithium secondary battery and lithium sec...
- Patent number 5,731,106
- Issue date Mar 24, 1998
- Fujitsu Limited
- Masami Tsutsumi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Process and apparatus for soldering electronic components to printe...
- Patent number 5,607,609
- Issue date Mar 4, 1997
- Fujitsu Ltd.
- Seiki Sakuyama
- B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and process for producing same
- Patent number 5,362,359
- Issue date Nov 8, 1994
- Fujitsu Limited
- Eiji Horikoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Circuit board and process for producing same
- Patent number 5,236,772
- Issue date Aug 17, 1993
- Fujitsu Limited
- Eiji Horikoshi
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of cooling a semiconductor device with a cooling unit, using...
- Patent number 5,024,264
- Issue date Jun 18, 1991
- Fujitsu Limited
- Katsuhide Natori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of cooling a semiconductor device with a cooling unit, using...
- Patent number 5,012,858
- Issue date May 7, 1991
- Fujitsu Limited
- Katsuhide Natori
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Developer comprising a carrier coated with Fe.sub.3 O.sub.4 dispers...
- Patent number 4,555,466
- Issue date Nov 26, 1985
- Fujitsu Limited
- Seiji Okada
- G03 - PHOTOGRAPHY CINEMATOGRAPHY ELECTROGRAPHY HOLOGRAPHY
Information Patent Grant
1,2-Polybutadiene compositions and cured flame retarded 1,2-polybut...
- Patent number 4,268,433
- Issue date May 19, 1981
- Fujitsu Limited
- Norio Sawatari
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
Conductive material and method for filling via-hole
- Publication number 20050147522
- Publication date Jul 7, 2005
- FUJITSU LIMITED
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Conductive material and method for filling via-hole
- Publication number 20030135997
- Publication date Jul 24, 2003
- FUJITSU LIMITED
- Isao Watanabe
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method for production of microcapsule type conductive filler
- Publication number 20020197399
- Publication date Dec 26, 2002
- FUJITSU LIMITED
- Hiroaki Date
- H01 - BASIC ELECTRIC ELEMENTS

Isao Watanabe

Person

Patents Grantslast 30 patents

Conductive material and method for filling via-hole

Conductive material and method for filling via-hole

Microcapsulating conductive metal particles with polymerized monomers

Microcapsulating conductive metal particles with polymerized monomers

Lithium secondary battery and cathode composition therefor

Lithium secondary battery and cathode composition therefor

Method for production of microcapsule type conductive filler

Photosensitive, heat-resistant resin composition for forming patterns

Process for using photosensitive, heat-resistant resin composition...

Photosensitive, heat-resistant resin composition and process for us...

Process and apparatus and panel heater for soldering electronic com...

Electrolytic solution for lithium secondary battery and lithium sec...

Process and apparatus for soldering electronic components to printe...

Circuit board and process for producing same

Circuit board and process for producing same

Method of cooling a semiconductor device with a cooling unit, using...

Method of cooling a semiconductor device with a cooling unit, using...

Developer comprising a carrier coated with Fe.sub.3 O.sub.4 dispers...

1,2-Polybutadiene compositions and cured flame retarded 1,2-polybut...

Patents Applicationslast 30 patents

Conductive material and method for filling via-hole

Conductive material and method for filling via-hole

Method for production of microcapsule type conductive filler