Isao Yokokawa

Person

Gunma, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 10,886,163
- Issue date Jan 5, 2021
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 10,763,157
- Issue date Sep 1, 2020
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded SOI wafer
- Patent number 10,347,525
- Issue date Jul 9, 2019
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer
- Patent number 10,204,824
- Issue date Feb 12, 2019
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 9,865,497
- Issue date Jan 9, 2018
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing bonded wafer
- Patent number 9,673,086
- Issue date Jun 6, 2017
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 9,337,080
- Issue date May 10, 2016
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing a bonded SOI wafer
- Patent number 9,076,840
- Issue date Jul 7, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer and bonded SOI wafer
- Patent number 8,987,109
- Issue date Mar 24, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Method for calculating warpage of bonded SOI wafer and method for m...
- Patent number 8,962,352
- Issue date Feb 24, 2015
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- G01 - MEASURING TESTING
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,956,951
- Issue date Feb 17, 2015
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for checking ion implantation condition and method for manuf...
- Patent number 8,906,708
- Issue date Dec 9, 2014
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,728,912
- Issue date May 20, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing SOI wafer
- Patent number 8,361,888
- Issue date Jan 29, 2013
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for forming silicon oxide film of SOI wafer
- Patent number 8,053,334
- Issue date Nov 8, 2011
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing soi wafer
- Patent number 7,985,660
- Issue date Jul 26, 2011
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor wafer
- Patent number 7,959,731
- Issue date Jun 14, 2011
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for cleaning a multilayer substrate and method for bonding s...
- Patent number 7,608,548
- Issue date Oct 27, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing semiconductor wafer
- Patent number 7,550,309
- Issue date Jun 23, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of producing SOI wafer and SOI wafer
- Patent number 7,524,744
- Issue date Apr 28, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for measuring an amount of strain of a bonded strained wafer
- Patent number 7,521,265
- Issue date Apr 21, 2009
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- G01 - MEASURING TESTING
Information Patent Grant
Bonded wafer and method of producing bonded wafer
- Patent number 7,315,064
- Issue date Jan 1, 2008
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing SOI wafer and SOI wafer
- Patent number 7,091,107
- Issue date Aug 15, 2006
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating SOI wafer
- Patent number 7,084,046
- Issue date Aug 1, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Bonded wafer and method of producing bonded wafer
- Patent number 7,052,974
- Issue date May 30, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Production method for bonded substrates
- Patent number 6,959,854
- Issue date Nov 1, 2005
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for producing bonded wafer and bonded wafer
- Patent number 6,900,113
- Issue date May 31, 2005
- Shin-Etsu Handotai Co., Ltd.
- Masatake Nakano
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer
- Patent number 6,566,233
- Issue date May 20, 2003
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for manufacturing bonded wafer and bonded wafer
- Patent number 6,312,797
- Issue date Nov 6, 2001
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method of fabricating an SOI wafer and SOI wafer fabricated by the...
- Patent number 6,306,730
- Issue date Oct 23, 2001
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER
- Publication number 20230268222
- Publication date Aug 24, 2023
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20230154761
- Publication date May 18, 2023
- Shin-Etsu Handotai Co., Ltd.
- Hiroji AGA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20200203217
- Publication date Jun 25, 2020
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20190295883
- Publication date Sep 26, 2019
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING BONDED SOI WAFER
- Publication number 20190074213
- Publication date Mar 7, 2019
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING SOI WAFER
- Publication number 20180144975
- Publication date May 24, 2018
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER
- Publication number 20160197008
- Publication date Jul 7, 2016
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD OF PRODUCING BONDED WAFER
- Publication number 20160197007
- Publication date Jul 7, 2016
- Shin-Etsu Handotai Co., Ltd.
- Isao YOKOKAWA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER
- Publication number 20150340279
- Publication date Nov 26, 2015
- Shin-Etsu Handotai Co., Ltd.
- Norihiro KOBAYASHI
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20150249035
- Publication date Sep 3, 2015
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING A BONDED SOI WAFER
- Publication number 20140322895
- Publication date Oct 30, 2014
- Shin-Etsu Handotai Co., Ltd.
- Norihiro Kobayashi
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CALCULATING WARPAGE OF BONDED SOI WAFER AND METHOD FOR M...
- Publication number 20140186977
- Publication date Jul 3, 2014
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- G01 - MEASURING TESTING
Information Patent Application
METHOD FOR MANUFACTURING BONDED WAFER AND BONDED SOI WAFER
- Publication number 20140097523
- Publication date Apr 10, 2014
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20130316522
- Publication date Nov 28, 2013
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR CHECKING ION IMPLANTATION CONDITION AND METHOD FOR MANUF...
- Publication number 20130023069
- Publication date Jan 24, 2013
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20120135584
- Publication date May 31, 2012
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20110281420
- Publication date Nov 17, 2011
- Shin-Etsu Handotai Co., Ltd.
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20100129993
- Publication date May 27, 2010
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING SOI WAFER
- Publication number 20100112781
- Publication date May 6, 2010
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR FORMING SILICON OXIDE FILM OF SOI WAFER
- Publication number 20100112824
- Publication date May 6, 2010
- SHIN-ETSU HANDOTAI CO., LTD.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Manufacturing Bonded Wafer and Bonded Wafer
- Publication number 20080315349
- Publication date Dec 25, 2008
- Shin-Etsu Handotai Co., Ltd.
- Tokio Takei
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method For Producing Semiconductor Wafer
- Publication number 20080138959
- Publication date Jun 12, 2008
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for Producing Semiconductor Wafer
- Publication number 20080003785
- Publication date Jan 3, 2008
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- C30 - CRYSTAL GROWTH
Information Patent Application
Method For Producing Semiconductor Wafer
- Publication number 20070287269
- Publication date Dec 13, 2007
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for measuring an amount of strain of a bonded strained wafer
- Publication number 20070166845
- Publication date Jul 19, 2007
- Shin-Etsu Handotai Co., Ltd.
- Isao Yokokawa
- G01 - MEASURING TESTING
Information Patent Application
Multilayer substrate cleaning method, substrate bonding method, and...
- Publication number 20070023066
- Publication date Feb 1, 2007
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Bonded wafer and method of producing bonded wafer
- Publication number 20060099791
- Publication date May 11, 2006
- Shin-Etsu Handotai Co., Ltd.
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method for manufacturing soi wafer and soi wafer
- Publication number 20060051945
- Publication date Mar 9, 2006
- SHIN-ETSU HANDOTAI CO,. LTD.
- Isao Yokokawa
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Method of producing soi wafer and soi wafer
- Publication number 20050118789
- Publication date Jun 2, 2005
- SHIN-ETSU HANDOTAI CO.,LTD
- Hiroji Aga
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Production method for soi wafer
- Publication number 20050014346
- Publication date Jan 20, 2005
- Kiyoshi Mitani
- H01 - BASIC ELECTRIC ELEMENTS

Isao Yokokawa

Person

Patents Grantslast 30 patents

Method for manufacturing bonded wafer

Method for manufacturing SOI wafer

Method for producing bonded SOI wafer

Method for producing SOI wafer

Method for manufacturing bonded wafer

Method of producing bonded wafer

Method for manufacturing SOI wafer

Method for manufacturing a bonded SOI wafer

Method for manufacturing bonded wafer and bonded SOI wafer

Method for calculating warpage of bonded SOI wafer and method for m...

Method for manufacturing SOI wafer

Method for checking ion implantation condition and method for manuf...

Method for manufacturing SOI wafer

Method for manufacturing SOI wafer

Method for forming silicon oxide film of SOI wafer

Method for manufacturing soi wafer

Method for producing semiconductor wafer

Method for cleaning a multilayer substrate and method for bonding s...

Method for producing semiconductor wafer

Method of producing SOI wafer and SOI wafer

Method for measuring an amount of strain of a bonded strained wafer

Bonded wafer and method of producing bonded wafer

Method for producing SOI wafer and SOI wafer

Method of fabricating SOI wafer

Bonded wafer and method of producing bonded wafer

Production method for bonded substrates

Method for producing bonded wafer and bonded wafer

Method for manufacturing bonded wafer

Method for manufacturing bonded wafer and bonded wafer

Method of fabricating an SOI wafer and SOI wafer fabricated by the...

Patents Applicationslast 30 patents

METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR PRODUCING BONDED SOI WAFER

METHOD FOR PRODUCING SOI WAFER

METHOD FOR MANUFACTURING BONDED WAFER

METHOD OF PRODUCING BONDED WAFER

METHOD FOR MANUFACTURING SOI WAFER AND SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING A BONDED SOI WAFER

METHOD FOR CALCULATING WARPAGE OF BONDED SOI WAFER AND METHOD FOR M...

METHOD FOR MANUFACTURING BONDED WAFER AND BONDED SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR CHECKING ION IMPLANTATION CONDITION AND METHOD FOR MANUF...

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR MANUFACTURING SOI WAFER

METHOD FOR FORMING SILICON OXIDE FILM OF SOI WAFER

Method for Manufacturing Bonded Wafer and Bonded Wafer

Method For Producing Semiconductor Wafer

Method for Producing Semiconductor Wafer

Method For Producing Semiconductor Wafer

Method for measuring an amount of strain of a bonded strained wafer

Multilayer substrate cleaning method, substrate bonding method, and...

Bonded wafer and method of producing bonded wafer

Method for manufacturing soi wafer and soi wafer

Method of producing soi wafer and soi wafer

Production method for soi wafer