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ISLAM A. SALAMA
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Scottsdale, AZ, US
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Patents Grants
last 30 patents
Information
Patent Grant
Device and method of very high density routing used with embedded m...
Patent number
12,014,989
Issue date
Jun 18, 2024
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
Patent number
11,764,158
Issue date
Sep 19, 2023
Intel Corporation
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Methods to pattern TFC and incorporation in the ODI architecture an...
Patent number
11,581,271
Issue date
Feb 14, 2023
Intel Corporation
Rahul Jain
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Substrate patch reconstitution options
Patent number
11,552,019
Issue date
Jan 10, 2023
Intel Corporation
Haifa Hariri
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Device and method of very high density routing used with embedded m...
Patent number
11,508,662
Issue date
Nov 22, 2022
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded multi-die interconnect bridge packages with lithotgraphica...
Patent number
11,043,457
Issue date
Jun 22, 2021
Intel Corporation
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Embedded multi-die interconnect bridge packages with lithographical...
Patent number
10,707,168
Issue date
Jul 7, 2020
Intel Corporation
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Systems and methods for semiconductor packages using photoimageable...
Patent number
10,553,453
Issue date
Feb 4, 2020
Intel Corporation
Sri Chaitra Chavali
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures with recessed conductive contacts for...
Patent number
10,424,561
Issue date
Sep 24, 2019
Intel Corporation
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method of forming a substrate core structure using microvia laser d...
Patent number
10,306,760
Issue date
May 28, 2019
Intel Corporation
Yonggang Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Acousto-optics deflector and mirror for laser beam steering
Patent number
10,286,488
Issue date
May 14, 2019
Intel Corporation
Chong Zhang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Embedded multi-die interconnect bridge packages with lithotgraphica...
Patent number
10,163,798
Issue date
Dec 25, 2018
Intel Corporation
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with passivated interconnects
Patent number
10,043,740
Issue date
Aug 7, 2018
Intel Coporation
Sri Ranga Sai Boyapati
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Architecture for seamless integrated display system
Patent number
9,952,823
Issue date
Apr 24, 2018
Intel Corporation
Johanna M. Swan
G02 - OPTICS
Information
Patent Grant
Integrated circuit and process for fabricating thereof
Patent number
9,941,158
Issue date
Apr 10, 2018
Intel Corporation
Charan Gurumurthy
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Integrated circuit structures with recessed conductive contacts for...
Patent number
9,865,568
Issue date
Jan 9, 2018
Intel Corporation
Kyu-Oh Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
High density interconnection of microelectronic devices
Patent number
9,842,832
Issue date
Dec 12, 2017
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Process for forming a semiconductor device substrate
Patent number
9,820,390
Issue date
Nov 14, 2017
Intel Corporation
Mihir K. Roy
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Grant
Method of forming a substrate core structure using microvia laser d...
Patent number
9,648,733
Issue date
May 9, 2017
Intel Corporation
Yonggang Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Methods of forming sensor integrated packages and structures formed...
Patent number
9,505,607
Issue date
Nov 29, 2016
Intel Corporation
Kyu Oh Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Spaced configuration of acousto-optic deflectors for laser beam sca...
Patent number
9,442,286
Issue date
Sep 13, 2016
Intel Corporation
Yonggang Li
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
High density interconnection of microelectronic devices
Patent number
9,397,071
Issue date
Jul 19, 2016
Intel Corporation
Omkar G. Karhade
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Architecture for seamless integrated display system
Patent number
9,361,059
Issue date
Jun 7, 2016
Intel Corporation
Johanna Swan
G09 - EDUCATION CRYPTOGRAPHY DISPLAY ADVERTISING SEALS
Information
Patent Grant
Device packaging with substrates having embedded lines and metal de...
Patent number
9,355,952
Issue date
May 31, 2016
Intel Corporation
Mark S Hlad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Chip package incorporating interfacial adhesion through conductor s...
Patent number
9,331,017
Issue date
May 3, 2016
Intel Corporation
Tao Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Misalignment correction for embedded microelectronic die applications
Patent number
9,266,723
Issue date
Feb 23, 2016
Intel Corporation
Grant A. Crawford
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Grant
Laser via drilling apparatus and methods
Patent number
9,211,609
Issue date
Dec 15, 2015
Intel Corporation
Islam A. Salama
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Laser cavity formation for embedded dies or components in substrate...
Patent number
9,202,803
Issue date
Dec 1, 2015
Intel Corporation
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package substrate with high density interconnect design to capture...
Patent number
9,119,313
Issue date
Aug 25, 2015
Intel Corporation
Chong Zhang
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Device packaging with substrates having embedded lines and metal de...
Patent number
9,093,313
Issue date
Jul 28, 2015
Intel Corporation
Mark S Hlad
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Patents Applications
last 30 patents
Information
Patent Application
DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED M...
Publication number
20230135165
Publication date
May 4, 2023
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED M...
Publication number
20220392842
Publication date
Dec 8, 2022
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE AND METHOD OF VERY HIGH DENSITY ROUTING USED WITH EMBEDDED M...
Publication number
20210280517
Publication date
Sep 9, 2021
Intel Corporation
Robert Alan May
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE PACKAGES WITH LITHOTGRAPHICA...
Publication number
20210257303
Publication date
Aug 19, 2021
Intel Corporation
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE PACKAGES WITH LITHOTGRAPHICA...
Publication number
20200303310
Publication date
Sep 24, 2020
Intel Corporation
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SUBSTRATE PATCH RECONSTITUTION OPTIONS
Publication number
20200294920
Publication date
Sep 17, 2020
Intel Corporation
Haifa HARIRI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHODS TO PATTERN TFC AND INCORPORATION IN THE ODI ARCHITECTURE AN...
Publication number
20200294938
Publication date
Sep 17, 2020
Intel Corporation
Rahul JAIN
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SYSTEMS AND METHODS FOR SEMICONDUCTOR PACKAGES USING PHOTOIMAGEABLE...
Publication number
20190311916
Publication date
Oct 10, 2019
Intel Corporation
Sri Chaitra CHAVALI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED MULTI-DIE INTERCONNECT BRIDGE PACKAGES WITH LITHOTGRAPHICA...
Publication number
20190198445
Publication date
Jun 27, 2019
Intel Corporation
Amruthavalli Pallavi Alur
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH RECESSED CONDUCTIVE CONTACTS FOR...
Publication number
20180226381
Publication date
Aug 9, 2018
Intel Corporation
KYU-OH LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE WITH PASSIVATED INTERCONNECTS
Publication number
20180019197
Publication date
Jan 18, 2018
SRI RANGA SAI BOYAPATI
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER VIA DRILLING APPARATUS AND METHODS
Publication number
20170285351
Publication date
Oct 5, 2017
Islam A. Salama
G02 - OPTICS
Information
Patent Application
METHOD OF FORMING A SUBSTRATE CORE STRUCTURE USING MICROVIA LASER D...
Publication number
20170231092
Publication date
Aug 10, 2017
Intel Corporation
Yonggang Li
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH RECESSED CONDUCTIVE CONTACTS FOR...
Publication number
20170207196
Publication date
Jul 20, 2017
Intel Corporation
KYU-OH LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTEGRATED CIRCUIT STRUCTURES WITH INTERPOSERS HAVING RECESSES
Publication number
20170170109
Publication date
Jun 15, 2017
Intel Corporation
KYU-OH LEE
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER VIA DRILLING APPARATUS AND METHODS
Publication number
20170131556
Publication date
May 11, 2017
Islam A. Salama
G02 - OPTICS
Information
Patent Application
ACOUSTO-OPTICS DEFLECTOR AND MIRROR FOR LASER BEAM STEERING
Publication number
20170036301
Publication date
Feb 9, 2017
Intel Corporation
Chong Zhang
B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR
Information
Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
Publication number
20160300824
Publication date
Oct 13, 2016
Intel Corporation
Omkar G. Karhade
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD OF PROVIDING A PRINTED CIRCUIT BOARD USING LASER ASSISTED ME...
Publication number
20160302307
Publication date
Oct 13, 2016
Islam A. Salama
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
METHODS OF FORMING SENSOR INTEGRATED PACKAGES AND STRUCTURES FORMED...
Publication number
20160280535
Publication date
Sep 29, 2016
Intel Corporation
Kyu Oh Lee
B81 - MICRO-STRUCTURAL TECHNOLOGY
Information
Patent Application
ARCHITECTURE FOR SEAMLESS INTEGRATED DISPLAY SYSTEM
Publication number
20160274857
Publication date
Sep 22, 2016
Intel Corporation
Johanna M. Swan
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
ACOUSTO-OPTIC DEFLECTOR WITH MULTIPLE TRANSDUCERS FOR OPTICAL BEAM...
Publication number
20150338718
Publication date
Nov 26, 2015
Intel Corporation
Chong ZHANG
G02 - OPTICS
Information
Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
Publication number
20150318238
Publication date
Nov 5, 2015
Intel Corporation
Mark S. Hlad
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
LASER CAVITY FORMATION FOR EMBEDDED DIES OR COMPONENTS IN SUBSTRATE...
Publication number
20150279817
Publication date
Oct 1, 2015
Chong ZHANG
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HIGH DENSITY INTERCONNECTION OF MICROELECTRONIC DEVICES
Publication number
20150163904
Publication date
Jun 11, 2015
Intel Corporation
Omkar G. Karhade
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
HYBRID-CORE THROUGH HOLES AND VIAS
Publication number
20150089806
Publication date
Apr 2, 2015
Intel Corporation
MIHIR K. ROY
G06 - COMPUTING CALCULATING COUNTING
Information
Patent Application
FABRICATION OF A SUBSTRATE WITH AN EMBEDDED DIE USING PROJECTION PA...
Publication number
20150048515
Publication date
Feb 19, 2015
Chong Zhang
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE INCORPORATING INTERFACIAL ADHESION THROUGH CONDUCTOR S...
Publication number
20150021778
Publication date
Jan 22, 2015
Tao Wu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
PACKAGE ASSEMBLY CONFIGURATIONS FOR MULTIPLE DIES AND ASSOCIATED TE...
Publication number
20150014852
Publication date
Jan 15, 2015
Yueli Liu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DEVICE PACKAGING WITH SUBSTRATES HAVING EMBEDDED LINES AND METAL DE...
Publication number
20150008578
Publication date
Jan 8, 2015
Intel Corporation
Mark S. Hlad
H01 - BASIC ELECTRIC ELEMENTS