Ismail T. Emesh

Person

Sunnyvale, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Enhanced plating bath and additive chemistries for cobalt plating
- Patent number 11,118,278
- Issue date Sep 14, 2021
- Applied Materials, Inc.
- Ismail Emesh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods and apparatus for hybrid feature metallization
- Patent number 11,024,537
- Issue date Jun 1, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods and apparatus for filling a feature disposed in a substrate
- Patent number 10,950,500
- Issue date Mar 16, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor reflow processing for feature fill
- Patent number 10,665,503
- Issue date May 26, 2020
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Methods for asymmetric deposition of metal on high aspect ratio nan...
- Patent number 10,636,655
- Issue date Apr 28, 2020
- Applied Materials, Inc.
- Ben-Li Sheu
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Grant
Co or Ni and Cu integration for small and large features in integra...
- Patent number 10,622,252
- Issue date Apr 14, 2020
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Enhanced plating bath and additive chemistries for cobalt plating
- Patent number 10,487,410
- Issue date Nov 26, 2019
- Applied Materials, Inc.
- Ismail Emesh
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for producing interconnects in semiconductor devices
- Patent number 10,062,607
- Issue date Aug 28, 2018
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Method for electrochemically depositing metal on a reactive metal film
- Patent number 9,840,788
- Issue date Dec 12, 2017
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Method for electrochemically depositing metal on a reactive metal film
- Patent number 9,828,687
- Issue date Nov 28, 2017
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Co or Ni and Cu integration for small and large features in integra...
- Patent number 9,805,976
- Issue date Oct 31, 2017
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Systems and methods for electrochemical deposition on a workpiece i...
- Patent number 9,768,060
- Issue date Sep 19, 2017
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical plating methods
- Patent number 9,704,717
- Issue date Jul 11, 2017
- Applied Materials, Inc.
- John W. Lam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Electrochemical plating methods
- Patent number 9,496,145
- Issue date Nov 15, 2016
- Applied Materials, Inc.
- John W. Lam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Grant
Methods for producing interconnects in semiconductor devices
- Patent number 9,425,092
- Issue date Aug 23, 2016
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor reflow processing for high aspect ratio fill
- Patent number 9,245,798
- Issue date Jan 26, 2016
- Applied Matrials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Seed layer passivation
- Patent number 8,357,599
- Issue date Jan 22, 2013
- Applied Materials, Inc.
- Callie A. Schieffer
- H01 - BASIC ELECTRIC ELEMENTS

Patents Applicationslast 30 patents

Information Patent Application
METHODS AND APPARATUS FOR HYBRID FEATURE METALLIZATION
- Publication number 20210043506
- Publication date Feb 11, 2021
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE
- Publication number 20200251340
- Publication date Aug 6, 2020
- Applied Materials, Inc.
- ROEY SHAVIV
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...
- Publication number 20200219720
- Publication date Jul 9, 2020
- Applied Materials, Inc.
- BEN-LI SHEU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING
- Publication number 20200048784
- Publication date Feb 13, 2020
- Applied Materials, Inc.
- Ismail EMESH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...
- Publication number 20190287791
- Publication date Sep 19, 2019
- BEN-LI SHEU
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS OF ETCHING A TUNGSTEN LAYER
- Publication number 20190198392
- Publication date Jun 27, 2019
- AMRITA B. MULLICK
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE
- Publication number 20180323103
- Publication date Nov 8, 2018
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...
- Publication number 20180122696
- Publication date May 3, 2018
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING
- Publication number 20170247806
- Publication date Aug 31, 2017
- Applied Materials, Inc.
- Ismail EMESH
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...
- Publication number 20170200642
- Publication date Jul 13, 2017
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHODS FOR PRODUCING INTERCONNECTS IN SEMICONDUCTOR DEVICES
- Publication number 20170047249
- Publication date Feb 16, 2017
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SYSTEMS AND METHODS FOR REMOVING CONTAMINATION FROM SEED LAYER SURFACE
- Publication number 20160126134
- Publication date May 5, 2016
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SYSTEMS AND METHODS FOR ELECTROCHEMICAL DEPOSITION ON A WORKPIECE I...
- Publication number 20160126104
- Publication date May 5, 2016
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL PLATING METHODS
- Publication number 20150357195
- Publication date Dec 10, 2015
- Applied Materials, Inc.
- John W. Lam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM
- Publication number 20150345045
- Publication date Dec 3, 2015
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR DEPOSITING METAL ON A REACTIVE METAL FILM
- Publication number 20150348836
- Publication date Dec 3, 2015
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM
- Publication number 20150348837
- Publication date Dec 3, 2015
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM
- Publication number 20150348826
- Publication date Dec 3, 2015
- Applied Materials, Inc.
- Roey Shaviv
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SUPER CONFORMAL METAL PLATING FROM COMPLEXED ELECTROLYTES
- Publication number 20150325477
- Publication date Nov 12, 2015
- Applied Materials, Inc.
- Roey Shaviv
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
SUPER CONFORMAL PLATING
- Publication number 20150322587
- Publication date Nov 12, 2015
- Applied Materials, Inc.
- Chris Pabelico
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
ELECTROCHEMICAL PLATING METHODS
- Publication number 20150270133
- Publication date Sep 24, 2015
- Applied Materials, Inc.
- John W. Lam
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METHODS FOR PRODUCING INTERCONNECTS IN SEMICONDUCTOR DEVICES
- Publication number 20140287577
- Publication date Sep 25, 2014
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
ELECTROCHEMICAL DEPOSITION ON A WORKPIECE HAVING HIGH SHEET RESISTANCE
- Publication number 20140103534
- Publication date Apr 17, 2014
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR REFLOW PROCESSING FOR FEATURE FILL
- Publication number 20140008812
- Publication date Jan 9, 2014
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR REFLOW PROCESSING FOR HIGH ASPECT RATIO FILL
- Publication number 20130320505
- Publication date Dec 5, 2013
- Applied Materials, Inc.
- Ismail T. Emesh
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEED LAYER PASSIVATION
- Publication number 20130127057
- Publication date May 23, 2013
- Callie A. Schieffer
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEED LAYER PASSIVATION
- Publication number 20120205793
- Publication date Aug 16, 2012
- Applied Materials, Inc.
- Callie A. Schieffer
- H01 - BASIC ELECTRIC ELEMENTS

Ismail T. Emesh

Person

Patents Grantslast 30 patents

Enhanced plating bath and additive chemistries for cobalt plating

Methods and apparatus for hybrid feature metallization

Methods and apparatus for filling a feature disposed in a substrate

Semiconductor reflow processing for feature fill

Methods for asymmetric deposition of metal on high aspect ratio nan...

Co or Ni and Cu integration for small and large features in integra...

Enhanced plating bath and additive chemistries for cobalt plating

Methods for producing interconnects in semiconductor devices

Method for electrochemically depositing metal on a reactive metal film

Method for electrochemically depositing metal on a reactive metal film

Co or Ni and Cu integration for small and large features in integra...

Systems and methods for electrochemical deposition on a workpiece i...

Electrochemical plating methods

Electrochemical plating methods

Methods for producing interconnects in semiconductor devices

Semiconductor reflow processing for high aspect ratio fill

Seed layer passivation

Patents Applicationslast 30 patents

METHODS AND APPARATUS FOR HYBRID FEATURE METALLIZATION

METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE

APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...

ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING

APPARATUS AND METHODS FOR ASYMMETRIC DEPOSITION OF METAL ON HIGH AS...

METHODS OF ETCHING A TUNGSTEN LAYER

METHODS AND APPARATUS FOR FILLING A FEATURE DISPOSED IN A SUBSTRATE

CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...

ENHANCED PLATING BATH AND ADDITIVE CHEMISTRIES FOR COBALT PLATING

CO OR NI AND CU INTEGRATION FOR SMALL AND LARGE FEATURES IN INTEGRA...

METHODS FOR PRODUCING INTERCONNECTS IN SEMICONDUCTOR DEVICES

SYSTEMS AND METHODS FOR REMOVING CONTAMINATION FROM SEED LAYER SURFACE

SYSTEMS AND METHODS FOR ELECTROCHEMICAL DEPOSITION ON A WORKPIECE I...

ELECTROCHEMICAL PLATING METHODS

METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM

METHODS FOR DEPOSITING METAL ON A REACTIVE METAL FILM

METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM

METHOD FOR ELECTROCHEMICALLY DEPOSITING METAL ON A REACTIVE METAL FILM

SUPER CONFORMAL METAL PLATING FROM COMPLEXED ELECTROLYTES

SUPER CONFORMAL PLATING

ELECTROCHEMICAL PLATING METHODS

METHODS FOR PRODUCING INTERCONNECTS IN SEMICONDUCTOR DEVICES

ELECTROCHEMICAL DEPOSITION ON A WORKPIECE HAVING HIGH SHEET RESISTANCE

SEMICONDUCTOR REFLOW PROCESSING FOR FEATURE FILL

SEMICONDUCTOR REFLOW PROCESSING FOR HIGH ASPECT RATIO FILL

SEED LAYER PASSIVATION

SEED LAYER PASSIVATION