Issaku Sato

Person

  • US

Patents Grantslast 30 patents

  • Information Patent Grant

    Solder bump forming method and apparatus

    • Patent number 9,511,438
    • Issue date Dec 6, 2016
    • Senju Metal Industry Co., Ltd.
    • Issaku Sato
    • B23 - MACHINE TOOLS METAL-WORKING NOT OTHERWISE PROVIDED FOR