Issei Okada

Person

Osaka-shi, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 11,752,734
- Issue date Sep 12, 2023
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- B32 - LAYERED PRODUCTS
Information Patent Grant
Method of manufacturing copper nano-ink and copper nano-ink
- Patent number 11,465,208
- Issue date Oct 11, 2022
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Base material for printed circuit board and printed circuit board
- Patent number 11,013,113
- Issue date May 18, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Coating liquid for forming conductive layer, method for producing c...
- Patent number 10,796,812
- Issue date Oct 6, 2020
- Sumitomo Electric Industries, Ltd.
- Motohiko Sugiura
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Powder for conductive material, ink for conductive material, conduc...
- Patent number 10,610,928
- Issue date Apr 7, 2020
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metal powder, ink, sintered body, substrate for printed circuit boa...
- Patent number 10,307,825
- Issue date Jun 4, 2019
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Substrate for printed circuit board, printed circuit board, and met...
- Patent number 9,967,976
- Issue date May 8, 2018
- Sumitomo Electric Industries, Ltd.
- Kazuhiro Miyata
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Metal coating, forming method thereof, and metal wiring
- Patent number 8,507,104
- Issue date Aug 13, 2013
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Grant
Method for manufacturing electronic circuit component
- Patent number 8,026,185
- Issue date Sep 27, 2011
- Sumitomo Electric Industries, Ltd.
- Shinichi Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Granular metal powder
- Patent number 7,691,175
- Issue date Apr 6, 2010
- Sumitomo Electric Industries, Ltd.
- Kohei Shimoda
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metallic colloidal solution and inkjet-use metallic ink
- Patent number 7,608,203
- Issue date Oct 27, 2009
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of producing metal powder
- Patent number 7,510,592
- Issue date Mar 31, 2009
- Sumitomo Electric Industries, Ltd.
- Masatoshi Majima
- B22 - CASTING POWDER METALLURGY
Information Patent Grant
Metallic colloidal solution and inkjet-use metallic ink
- Patent number 7,445,731
- Issue date Nov 4, 2008
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method of manufacturing chain-structure metal powder
- Patent number 7,285,152
- Issue date Oct 23, 2007
- Sumitomo Electric Industries, Ltd.
- Kohei Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
PRINTED WIRING BOARD
- Publication number 20240251508
- Publication date Jul 25, 2024
- Sumitomo Electric Industries, Ltd.
- Masamichi YAMAMOTO
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING COPPER NANO-INK AND COPPER NANO-INK
- Publication number 20210291271
- Publication date Sep 23, 2021
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20210022245
- Publication date Jan 21, 2021
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD OF MANUFACTURING SUBSTRATE FOR PRINTED CIRCUIT BOARD
- Publication number 20200344890
- Publication date Oct 29, 2020
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD
- Publication number 20200324517
- Publication date Oct 15, 2020
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- B32 - LAYERED PRODUCTS
Information Patent Application
COATING LIQUID FOR FORMING CONDUCTIVE LAYER, METHOD FOR PRODUCING C...
- Publication number 20190077974
- Publication date Mar 14, 2019
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Application
POWDER FOR CONDUCTIVE MATERIAL, INK FOR CONDUCTIVE MATERIAL, CONDUC...
- Publication number 20190054524
- Publication date Feb 21, 2019
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- B22 - CASTING POWDER METALLURGY
Information Patent Application
COATING LIQUID FOR FORMING CONDUCTIVE LAYER AND METHOD FOR MANUFACT...
- Publication number 20180315519
- Publication date Nov 1, 2018
- Sumitomo Electric Industries, Ltd.
- Motohiko SUGIURA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR MANUFACTURING TITANIUM TRICHLORIDE SOLUTION AND DEVICE F...
- Publication number 20180305829
- Publication date Oct 25, 2018
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- C25 - ELECTROLYTIC OR ELECTROPHORETIC PROCESSES APPARATUS THEREFOR
Information Patent Application
METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...
- Publication number 20180015547
- Publication date Jan 18, 2018
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- B05 - SPRAYING OR ATOMISING IN GENERAL APPLYING LIQUIDS OR OTHER FLUENT MATER...
Information Patent Application
SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...
- Publication number 20170347459
- Publication date Nov 30, 2017
- Sumitomo Electric Industries, Ltd.
- Kazuhiro MIYATA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METAL NANOPARTICLE DISPERSION AND METAL COATING FILM
- Publication number 20170213615
- Publication date Jul 27, 2017
- Sumitomo Electric Industries, Ltd.
- Issei OKADA
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20160330850
- Publication date Nov 10, 2016
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
METHOD FOR PRODUCING PRINTED WIRING BOARD
- Publication number 20160330847
- Publication date Nov 10, 2016
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...
- Publication number 20140166495
- Publication date Jun 19, 2014
- Sumitomo Electric Industries, Ltd.
- Yoshio OKA
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...
- Publication number 20120031656
- Publication date Feb 9, 2012
- Yoshio Oka
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
CONDUCTIVE ADHESIVE AND LED SUBSTRATE USING THE SAME
- Publication number 20110140162
- Publication date Jun 16, 2011
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Application
NICKEL POWDER OR ALLOY POWDER COMPRISING NICKEL AS MAIN COMPONENT,...
- Publication number 20110141654
- Publication date Jun 16, 2011
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
NICKEL POWDER OR ALLOY POWDER HAVING NICKEL AS MAIN COMPONENT, METH...
- Publication number 20100208410
- Publication date Aug 19, 2010
- Issei Okada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT COMPONENT
- Publication number 20100003791
- Publication date Jan 7, 2010
- Sumitomo Electric Industries, Ltd.
- Shinichi Maeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Metal coating, forming method thereof, and metal wiring
- Publication number 20090197045
- Publication date Aug 6, 2009
- Issei Okada
- C22 - METALLURGY FERROUS OR NON-FERROUS ALLOYS TREATMENT OF ALLOYS OR NON-FER...
Information Patent Application
METALLIC COLLOIDAL SOLUTION AND INKJET-USE METALLIC INK
- Publication number 20080308001
- Publication date Dec 18, 2008
- Sumitomo Electric Industries, Ltd.
- Issei Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Method of producing metal powder
- Publication number 20070089565
- Publication date Apr 26, 2007
- Masatoshi Majima
- B22 - CASTING POWDER METALLURGY
Information Patent Application
Granular metal powder
- Publication number 20070074598
- Publication date Apr 5, 2007
- Kohei Shimoda
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Application
Method of forming a conductive wiring pattern by laser irradiation...
- Publication number 20060057502
- Publication date Mar 16, 2006
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Issei Okada
- C23 - COATING METALLIC MATERIAL COATING MATERIAL WITH METALLIC MATERIAL CHEMI...
Information Patent Application
Metallic colloidal solution and inkjet-use metallic ink
- Publication number 20050189520
- Publication date Sep 1, 2005
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Issei Okada
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Chain-structure metal powder, manufacturing method thereof, and con...
- Publication number 20040221683
- Publication date Nov 11, 2004
- SUMITOMO ELECTRIC INDUSTRIES, LTD.
- Kohei Shimoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Issei Okada

Person

Patents Grantslast 30 patents

Base material for printed circuit board and printed circuit board

Method of manufacturing copper nano-ink and copper nano-ink

Base material for printed circuit board and printed circuit board

Coating liquid for forming conductive layer, method for producing c...

Powder for conductive material, ink for conductive material, conduc...

Metal powder, ink, sintered body, substrate for printed circuit boa...

Substrate for printed circuit board, printed circuit board, and met...

Metal coating, forming method thereof, and metal wiring

Method for manufacturing electronic circuit component

Granular metal powder

Metallic colloidal solution and inkjet-use metallic ink

Method of producing metal powder

Metallic colloidal solution and inkjet-use metallic ink

Method of manufacturing chain-structure metal powder

Patents Applicationslast 30 patents

PRINTED WIRING BOARD

METHOD OF MANUFACTURING COPPER NANO-INK AND COPPER NANO-INK

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

METHOD OF MANUFACTURING SUBSTRATE FOR PRINTED CIRCUIT BOARD

BASE MATERIAL FOR PRINTED CIRCUIT BOARD AND PRINTED CIRCUIT BOARD

COATING LIQUID FOR FORMING CONDUCTIVE LAYER, METHOD FOR PRODUCING C...

POWDER FOR CONDUCTIVE MATERIAL, INK FOR CONDUCTIVE MATERIAL, CONDUC...

COATING LIQUID FOR FORMING CONDUCTIVE LAYER AND METHOD FOR MANUFACT...

METHOD FOR MANUFACTURING TITANIUM TRICHLORIDE SOLUTION AND DEVICE F...

METAL POWDER, INK, SINTERED BODY, SUBSTRATE FOR PRINTED CIRCUIT BOA...

SUBSTRATE FOR PRINTED CIRCUIT BOARD, PRINTED CIRCUIT BOARD, AND MET...

METAL NANOPARTICLE DISPERSION AND METAL COATING FILM

METHOD FOR PRODUCING PRINTED WIRING BOARD

METHOD FOR PRODUCING PRINTED WIRING BOARD

SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...

SUBSTRATE FOR PRINTED WIRING BOARD, PRINTED WIRING BOARD, AND METHO...

CONDUCTIVE ADHESIVE AND LED SUBSTRATE USING THE SAME

NICKEL POWDER OR ALLOY POWDER COMPRISING NICKEL AS MAIN COMPONENT,...

NICKEL POWDER OR ALLOY POWDER HAVING NICKEL AS MAIN COMPONENT, METH...

METHOD FOR MANUFACTURING ELECTRONIC CIRCUIT COMPONENT

Metal coating, forming method thereof, and metal wiring

METALLIC COLLOIDAL SOLUTION AND INKJET-USE METALLIC INK

Method of producing metal powder

Granular metal powder

Method of forming a conductive wiring pattern by laser irradiation...

Metallic colloidal solution and inkjet-use metallic ink

Chain-structure metal powder, manufacturing method thereof, and con...