Membership
Tour
Register
Log in
Ivan NIKITIN
Follow
Person
Regensburg, DE
People
Overview
Industries
Organizations
People
Information
Impact
Patents Grants
last 30 patents
Information
Patent Grant
Power module with metal substrate
Patent number
12,002,724
Issue date
Jun 4, 2024
Infineon Technologies Austria AG
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module with press-fit contacts
Patent number
11,901,273
Issue date
Feb 13, 2024
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Fluid-cooled package having shielding layer
Patent number
11,862,533
Issue date
Jan 2, 2024
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Additive manufacturing of a frontside or backside interconnect of a...
Patent number
11,688,713
Issue date
Jun 27, 2023
Infineon Technologies Austria AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module
Patent number
11,682,611
Issue date
Jun 20, 2023
Infineon Technologies AG
Michael Niendorf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic devices including electrically insulated load electrodes
Patent number
11,646,258
Issue date
May 9, 2023
Infineon Technologies AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with barrier to contain thermal interface mat...
Patent number
11,626,351
Issue date
Apr 11, 2023
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded semiconductor module having a mold step for increasing creep...
Patent number
11,621,204
Issue date
Apr 4, 2023
Infineon Technologies AG
Oliver Markus Kreiter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power semiconductor module and method for producing a power semicon...
Patent number
11,598,904
Issue date
Mar 7, 2023
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module comprising two substrates and method of manufacturing...
Patent number
11,574,889
Issue date
Feb 7, 2023
Infineon Technologies AG
Ottmar Geitner
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Spacer frame for semiconductor packages
Patent number
11,450,593
Issue date
Sep 20, 2022
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Molded semiconductor module for PCB embedding
Patent number
11,404,392
Issue date
Aug 2, 2022
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Power module with metal substrate
Patent number
11,404,336
Issue date
Aug 2, 2022
Infineon Technologies Austria AG
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package cooled with cooling fluid and comprising shielding layer
Patent number
11,244,886
Issue date
Feb 8, 2022
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor package with multi-level conductive clip for top side...
Patent number
11,075,185
Issue date
Jul 27, 2021
Infineon Technologies AG
Chii Shang Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Metallic interconnect, a method of manufacturing a metallic interco...
Patent number
10,734,352
Issue date
Aug 4, 2020
Infineon Technologies AG
Irmgard Escher-Poeppel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip carrier with electrically conductive layer extending beyond th...
Patent number
10,615,097
Issue date
Apr 7, 2020
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with partially encapsulated cooling channel for cooling an...
Patent number
10,461,017
Issue date
Oct 29, 2019
Infineon Technologies AG
Andreas Grassmann
B60 - VEHICLES IN GENERAL
Information
Patent Grant
Package with roughened encapsulated surface for promoting adhesion
Patent number
10,453,771
Issue date
Oct 22, 2019
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with roughened encapsulated surface for promoting adhesion
Patent number
10,410,949
Issue date
Sep 10, 2019
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Package with interconnections having different melting temperatures
Patent number
10,211,133
Issue date
Feb 19, 2019
Infineon Technologies AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and method of manufacturing the same
Patent number
9,847,274
Issue date
Dec 19, 2017
Infineon Technologies AG
Frank Winter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for processing a semiconductor workpiece and semiconductor w...
Patent number
9,627,335
Issue date
Apr 18, 2017
Infineon Technologies AG
Stephan Henneck
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Semiconductor device
Patent number
9,583,413
Issue date
Feb 28, 2017
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Method for forming electronic components
Patent number
9,530,752
Issue date
Dec 27, 2016
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic module and method of manufacturing the same
Patent number
9,532,459
Issue date
Dec 27, 2016
Infineon Technologies AG
Frank Winter
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Integrated circuit and method of manufacturing an integrated circuit
Patent number
9,496,228
Issue date
Nov 15, 2016
Infineon Technologies AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Electronic power device and method of fabricating an electronic pow...
Patent number
9,420,731
Issue date
Aug 16, 2016
Infineon Technologies Austria AG
Khalil Hosseini
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Multichip device including a substrate
Patent number
9,385,107
Issue date
Jul 5, 2016
Infineon Technologies AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Encapsulated semiconductor device
Patent number
9,362,191
Issue date
Jun 7, 2016
Infineon Technologies Austria AG
Khalil Hosseini
H01 - BASIC ELECTRIC ELEMENTS
Patents Applications
last 30 patents
Information
Patent Application
Semiconductor Package Providing an Even Current Distribution and St...
Publication number
20240170377
Publication date
May 23, 2024
Infineon Technologies Austria AG
Bernd Schmoelzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE
Publication number
20230411254
Publication date
Dec 21, 2023
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
POWER SEMICONDUCTOR PACKAGE HAVING FIRST AND SECOND LEAD FRAMES
Publication number
20230361088
Publication date
Nov 9, 2023
INFINEON TECHNOLOGIES AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED POWER SEMICONDUCTOR PACKAGE
Publication number
20230361087
Publication date
Nov 9, 2023
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
METHOD FOR FABRICATING A SEMICONDUCTOR DEVICE MODULE WITH INCREASED...
Publication number
20230360929
Publication date
Nov 9, 2023
Infineon Technologies Austria AG
Bernd Schmoelzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND METHOD FOR FABRICATING THE SAME
Publication number
20230352378
Publication date
Nov 2, 2023
Infineon Technologies Austria AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR PACKAGE AND A SEMICONDUCTOR DEVICE MODULE INCLUDING T...
Publication number
20230282591
Publication date
Sep 7, 2023
Infineon Technologies Austria AG
Edward Fürgut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR DIE PACKAGE
Publication number
20230282608
Publication date
Sep 7, 2023
Infineon Technologies Austria AG
Edward Fürgut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
STACKED MODULE ARRANGEMENT
Publication number
20230230905
Publication date
Jul 20, 2023
Peter Luniewski
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SOLDER STOP FEATURE FOR ELECTRONIC DEVICES
Publication number
20230170316
Publication date
Jun 1, 2023
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Module with Press-Fit Contacts
Publication number
20230121335
Publication date
Apr 20, 2023
INFINEON TECHNOLOGIES AG
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
EMBEDDED PACKAGE WITH DELAMINATION MITIGATION
Publication number
20230106642
Publication date
Apr 6, 2023
Bernd Schmoelzer
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package Comprising a Cavity with Exposed Contacts and...
Publication number
20230093341
Publication date
Mar 23, 2023
Infineon Technologies Austria AG
Julian Treu
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Module with Press-Fit Contacts
Publication number
20230026022
Publication date
Jan 26, 2023
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
SEMICONDUCTOR MODULE WITH BOND WIRE LOOP EXPOSED FROM A MOLDED BODY...
Publication number
20220352114
Publication date
Nov 3, 2022
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Module With Metal Substrate
Publication number
20220310465
Publication date
Sep 29, 2022
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MOLDED SEMICONDUCTOR MODULE HAVING A MOLD STEP FOR INCREASING CREEP...
Publication number
20220262693
Publication date
Aug 18, 2022
Oliver Markus Kreiter
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Barrier to Contain Thermal Interface Mat...
Publication number
20220238422
Publication date
Jul 28, 2022
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Fluid-Cooled Package Having Shielding Layer
Publication number
20220115293
Publication date
Apr 14, 2022
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Spacer Frame for Semiconductor Packages
Publication number
20220005752
Publication date
Jan 6, 2022
Ivan Nikitin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Module with Metal Substrate
Publication number
20210407873
Publication date
Dec 30, 2021
Wu Hu Li
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Semiconductor Module
Publication number
20210398887
Publication date
Dec 23, 2021
Michael Niendorf
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Additive Manufacturing of a Frontside or Backside Interconnect of a...
Publication number
20210225798
Publication date
Jul 22, 2021
Infineon Technologies Austria AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
ELECTRONIC DEVICES INCLUDING ELECTRICALLY INSULATED LOAD ELECTRODES
Publication number
20210043555
Publication date
Feb 11, 2021
INFINEON TECHNOLOGIES AG
Edward Fuergut
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Semiconductor Package with Multi-Level Conductive Clip for Top Side...
Publication number
20200350272
Publication date
Nov 5, 2020
Chii Shang Hong
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Power Semiconductor Module and Method for Producing a Power Semicon...
Publication number
20200183056
Publication date
Jun 11, 2020
Ivan Nikitin
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Application
Package with interconnections having different melting temperatures
Publication number
20190157192
Publication date
May 23, 2019
INFINEON TECHNOLOGIES AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Metallic Interconnect, a Method of Manufacturing a Metallic Interco...
Publication number
20190103378
Publication date
Apr 4, 2019
INFINEON TECHNOLOGIES AG
Irmgard Escher-Poeppel
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Package with interconnections having different melting temperatures
Publication number
20180138111
Publication date
May 17, 2018
INFINEON TECHNOLOGIES AG
Andreas Grassmann
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
Chip carrier with electrically conductive layer extending beyond th...
Publication number
20180102302
Publication date
Apr 12, 2018
INFINEON TECHNOLOGIES AG
Andreas GRASSMANN
H01 - BASIC ELECTRIC ELEMENTS