Ivan Shubin

Person

San Diego, CA, US

People

Patents Grantslast 30 patents

Information Patent Grant
Reflow-compatible optical I/O assembly adapter
- Patent number 10,591,689
- Issue date Mar 17, 2020
- Oracle International Corporation
- Chaoqi Zhang
- G02 - OPTICS
Information Patent Grant
Back-side etching and cleaving of substrates
- Patent number 10,514,502
- Issue date Dec 24, 2019
- Oracle International Corporation
- Jin-Hyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Mode-hop-free hybrid external-cavity laser with passive thermo-opti...
- Patent number 9,871,346
- Issue date Jan 16, 2018
- Oracle International Corporation
- Jin-Hyoung Lee
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid-integrated multi-chip module
- Patent number 9,829,626
- Issue date Nov 28, 2017
- Oracle International Corporation
- Ivan Shubin
- G02 - OPTICS
Information Patent Grant
Hybrid optical source with optical proximity coupling provided by a...
- Patent number 9,812,842
- Issue date Nov 7, 2017
- Oracle International Corporation
- Ivan Shubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Surface-normal coupler for silicon-on-insulator platforms
- Patent number 9,696,486
- Issue date Jul 4, 2017
- Oracle International Corporation
- Xuezhe Zheng
- G02 - OPTICS
Information Patent Grant
Hybrid integrated MCM with waveguide-fiber connector
- Patent number 9,698,564
- Issue date Jul 4, 2017
- Oracle International Corporation
- Ivan Shubin
- G02 - OPTICS
Information Patent Grant
Hybrid integration of edge-coupled chips
- Patent number 9,618,709
- Issue date Apr 11, 2017
- Oracle International Corporation
- Xuezhe Zheng
- G02 - OPTICS
Information Patent Grant
Optical mode converter having multiple regions
- Patent number 9,575,251
- Issue date Feb 21, 2017
- Oracle International Corporation
- Jin-Hyoung Lee
- G02 - OPTICS
Information Patent Grant
Self-assembled vertically aligned multi-chip module
- Patent number 9,519,105
- Issue date Dec 13, 2016
- Oracle International Corporation
- Ivan Shubin
- G02 - OPTICS
Information Patent Grant
Back-side etching and cleaving of substrates
- Patent number 9,488,777
- Issue date Nov 8, 2016
- Oracle International Corporation
- Jin-Hyoung Lee
- G02 - OPTICS
Information Patent Grant
Self-assembled vertically aligned multi-chip module
- Patent number 9,470,855
- Issue date Oct 18, 2016
- Oracle International Corporation
- Ivan Shubin
- G02 - OPTICS
Information Patent Grant
Single shot correction of resonant optical components
- Patent number 9,465,169
- Issue date Oct 11, 2016
- Oracle International Corporation
- Stevan S. Djordjevic
- B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information Patent Grant
Integrated electro-absorption modulator
- Patent number 9,411,177
- Issue date Aug 9, 2016
- Oracle International Corporation
- John E. Cunningham
- Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,297,971
- Issue date Mar 29, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Method for fabricating multi-chip module with multi-level interposer
- Patent number 9,281,268
- Issue date Mar 8, 2016
- Oracle International Corporation
- Eugene M. Chow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Hybrid-integrated photonic chip package with an interposer
- Patent number 9,250,403
- Issue date Feb 2, 2016
- Oracle International Corporation
- Hiren D. Thacker
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Ultra-compact photodetector on an optical waveguide
- Patent number 9,164,231
- Issue date Oct 20, 2015
- Oracle International Corporation
- Ivan Shubin
- G02 - OPTICS
Information Patent Grant
Integrated electro-absorption modulator
- Patent number 9,142,698
- Issue date Sep 22, 2015
- Oracle International Corporation
- John E. Cunningham
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Hybrid optical source with semiconductor reflector
- Patent number 8,988,770
- Issue date Mar 24, 2015
- Oracle International Corporation
- Xuezhe Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Chip package to support high-frequency processors
- Patent number 8,982,563
- Issue date Mar 17, 2015
- Oracle International Corporation
- Kannan Raj
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Optical device with high thermal tuning efficiency
- Patent number 8,971,674
- Issue date Mar 3, 2015
- Oracle International Corporation
- Ivan Shubin
- G02 - OPTICS
Information Patent Grant
Hybrid substrateless device with enhanced tuning efficiency
- Patent number 8,796,811
- Issue date Aug 5, 2014
- Oracle International Corporation
- Ivan Shubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Interconnection and assembly of three-dimensional chip packages
- Patent number 8,772,920
- Issue date Jul 8, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Maintaining alignment in a multi-chip module using a compressible s...
- Patent number 8,742,576
- Issue date Jun 3, 2014
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Optical device with enhanced mechanical strength
- Patent number 8,600,201
- Issue date Dec 3, 2013
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Grant
Direct interlayer optical coupler
- Patent number 8,548,287
- Issue date Oct 1, 2013
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Grant
Optical device on inverted, substrateless chip
- Patent number 8,428,404
- Issue date Apr 23, 2013
- Oracle America, Inc.
- Ivan Shubin
- G02 - OPTICS
Information Patent Grant
Chip package with plank stack of semiconductor dies
- Patent number 8,390,109
- Issue date Mar 5, 2013
- Oracle America, Inc.
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Multi-chip module with multi-level interposer
- Patent number 8,218,334
- Issue date Jul 10, 2012
- Oracle America, Inc.
- Eugene M. Chow
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC

Patents Applicationslast 30 patents

Information Patent Application
HYBRID FIBER INTEGRATED SOI/III-V MODULE
- Publication number 20190187373
- Publication date Jun 20, 2019
- Roshmere, Inc.
- Ivan Shubin
- G02 - OPTICS
Information Patent Application
REFLOW-COMPATIBLE OPTICAL I/O ASSEMBLY ADAPTER
- Publication number 20180267265
- Publication date Sep 20, 2018
- ORACLE INTERNATIONAL CORPORATION
- Chaoqi Zhang
- G02 - OPTICS
Information Patent Application
HYBRID OPTICAL SOURCE WITH OPTICAL PROXIMITY COUPLING PROVIDED BY A...
- Publication number 20170294760
- Publication date Oct 12, 2017
- ORACLE INTERNATIONAL CORPORATION
- Ivan Shubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
HYBRID-INTEGRATED MULTI-CHIP MODULE
- Publication number 20170199328
- Publication date Jul 13, 2017
- ORACLE INTERNATIONAL CORPORATION
- Ivan Shubin
- G02 - OPTICS
Information Patent Application
OPTICAL MODE CONVERTER HAVING MULTIPLE REGIONS
- Publication number 20170045686
- Publication date Feb 16, 2017
- Oracle International Corporation
- Jin-Hyoung Lee
- G02 - OPTICS
Information Patent Application
BACK-SIDE ETCHING AND CLEAVING OF SUBSTRATES
- Publication number 20160334577
- Publication date Nov 17, 2016
- ORACLE INTERNATIONAL CORPORATION
- Jin-Hyoung Lee
- G02 - OPTICS
Information Patent Application
SINGLE-SHOT CORRECTION OF RESONANT OPTICAL COMPONENTS
- Publication number 20160238791
- Publication date Aug 18, 2016
- Oracle International Corporation
- Stevan S. Djordjevic
- G02 - OPTICS
Information Patent Application
HYBRID INTEGRATION OF EDGE-COUPLED CHIPS
- Publication number 20160170158
- Publication date Jun 16, 2016
- Oracle International Corporation
- Xuezhe Zheng
- G02 - OPTICS
Information Patent Application
SURFACE-NORMAL COUPLER FOR SILICON-ON-INSULATOR PLATFORMS
- Publication number 20150362673
- Publication date Dec 17, 2015
- Oracle International Corporation
- Xuezhe Zheng
- G02 - OPTICS
Information Patent Application
INTEGRATED ELECTRO-ABSORPTION MODULATOR
- Publication number 20150362764
- Publication date Dec 17, 2015
- Oracle International Corporation
- John E. Cunningham
- G02 - OPTICS
Information Patent Application
INTEGRATED ELECTRO-ABSORPTION MODULATOR
- Publication number 20150293383
- Publication date Oct 15, 2015
- Oracle International Corporation
- John E. Cunningham
- G02 - OPTICS
Information Patent Application
BACK-SIDE ETCHING AND CLEAVING OF SUBSTRATES
- Publication number 20150071585
- Publication date Mar 12, 2015
- Oracle International Corporation
- Jin Hyoung Lee
- G02 - OPTICS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321803
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
- Publication number 20140321804
- Publication date Oct 30, 2014
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
HYBRID OPTICAL SOURCE WITH SEMICONDUCTOR REFLECTOR
- Publication number 20140268312
- Publication date Sep 18, 2014
- Oracle International Corporation
- Xuezhe Zheng
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...
- Publication number 20130207261
- Publication date Aug 15, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
DIRECT INTERLAYER OPTICAL COUPLER
- Publication number 20130121635
- Publication date May 16, 2013
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
ULTRA-COMPACT PHOTODETECTOR ON AN OPTICAL WAVEGUIDE
- Publication number 20130039614
- Publication date Feb 14, 2013
- Oracle International Corporation
- Ivan Shubin
- G02 - OPTICS
Information Patent Application
HYBRID SUBSTRATELESS DEVICE WITH ENHANCED TUNING EFFICIENCY
- Publication number 20130037905
- Publication date Feb 14, 2013
- Oracle International Corporation
- Ivan Shubin
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES
- Publication number 20130015578
- Publication date Jan 17, 2013
- Oracle International Corporation
- Hiren D. Thacker
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS
- Publication number 20130003310
- Publication date Jan 3, 2013
- ORACLE INTERNATIONAL CORPORATION
- Kannan Raj
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
- Publication number 20120266464
- Publication date Oct 25, 2012
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
- Publication number 20120211878
- Publication date Aug 23, 2012
- Oracle International Corporation
- Darko R. Popovic
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE WITH ENHANCED MECHANICAL STRENGTH
- Publication number 20120213467
- Publication date Aug 23, 2012
- Oracle International Corporation
- Hiren D. Thacker
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE WITH HIGH THERMAL TUNING EFFICIENCY
- Publication number 20110235962
- Publication date Sep 29, 2011
- ORACLE INTERNATIONAL CORPORATION
- Ivan Shubin
- G02 - OPTICS
Information Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
- Publication number 20110223778
- Publication date Sep 15, 2011
- ORACLE INTERNATIONAL CORPORATION
- Eugene M. Chow
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE
- Publication number 20100290736
- Publication date Nov 18, 2010
- SUN MICROSYSTEMS, INC.
- John E. Cunningham
- G02 - OPTICS
Information Patent Application
OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE
- Publication number 20100247021
- Publication date Sep 30, 2010
- SUN MICROSYSTEMS, INC.
- John E. Cunningham
- G02 - OPTICS
Information Patent Application
DUAL-LAYER THERMALLY TUNED OPTICAL DEVICE
- Publication number 20100247022
- Publication date Sep 30, 2010
- SUN MICROSYSTEMS, INC.
- Guoliang Li
- G02 - OPTICS
Information Patent Application
THERMAL TUNING OF AN OPTICAL DEVICE
- Publication number 20100247029
- Publication date Sep 30, 2010
- SUN MICROSYSTEMS, INC.
- Guoliang Li
- G02 - OPTICS

Ivan Shubin

Person

Patents Grantslast 30 patents

Reflow-compatible optical I/O assembly adapter

Back-side etching and cleaving of substrates

Mode-hop-free hybrid external-cavity laser with passive thermo-opti...

Hybrid-integrated multi-chip module

Hybrid optical source with optical proximity coupling provided by a...

Surface-normal coupler for silicon-on-insulator platforms

Hybrid integrated MCM with waveguide-fiber connector

Hybrid integration of edge-coupled chips

Optical mode converter having multiple regions

Self-assembled vertically aligned multi-chip module

Back-side etching and cleaving of substrates

Self-assembled vertically aligned multi-chip module

Single shot correction of resonant optical components

Integrated electro-absorption modulator

Hybrid-integrated photonic chip package with an interposer

Method for fabricating multi-chip module with multi-level interposer

Hybrid-integrated photonic chip package with an interposer

Ultra-compact photodetector on an optical waveguide

Integrated electro-absorption modulator

Hybrid optical source with semiconductor reflector

Chip package to support high-frequency processors

Optical device with high thermal tuning efficiency

Hybrid substrateless device with enhanced tuning efficiency

Interconnection and assembly of three-dimensional chip packages

Maintaining alignment in a multi-chip module using a compressible s...

Optical device with enhanced mechanical strength

Direct interlayer optical coupler

Optical device on inverted, substrateless chip

Chip package with plank stack of semiconductor dies

Multi-chip module with multi-level interposer

Patents Applicationslast 30 patents

HYBRID FIBER INTEGRATED SOI/III-V MODULE

REFLOW-COMPATIBLE OPTICAL I/O ASSEMBLY ADAPTER

HYBRID OPTICAL SOURCE WITH OPTICAL PROXIMITY COUPLING PROVIDED BY A...

HYBRID-INTEGRATED MULTI-CHIP MODULE

OPTICAL MODE CONVERTER HAVING MULTIPLE REGIONS

BACK-SIDE ETCHING AND CLEAVING OF SUBSTRATES

SINGLE-SHOT CORRECTION OF RESONANT OPTICAL COMPONENTS

HYBRID INTEGRATION OF EDGE-COUPLED CHIPS

SURFACE-NORMAL COUPLER FOR SILICON-ON-INSULATOR PLATFORMS

INTEGRATED ELECTRO-ABSORPTION MODULATOR

INTEGRATED ELECTRO-ABSORPTION MODULATOR

BACK-SIDE ETCHING AND CLEAVING OF SUBSTRATES

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER

HYBRID OPTICAL SOURCE WITH SEMICONDUCTOR REFLECTOR

MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...

DIRECT INTERLAYER OPTICAL COUPLER

ULTRA-COMPACT PHOTODETECTOR ON AN OPTICAL WAVEGUIDE

HYBRID SUBSTRATELESS DEVICE WITH ENHANCED TUNING EFFICIENCY

INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES

CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES

OPTICAL DEVICE WITH ENHANCED MECHANICAL STRENGTH

OPTICAL DEVICE WITH HIGH THERMAL TUNING EFFICIENCY

MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER

OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE

OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE

DUAL-LAYER THERMALLY TUNED OPTICAL DEVICE

THERMAL TUNING OF AN OPTICAL DEVICE