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Ivan Shubin
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San Diego, CA, US
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Patents Grants
last 30 patents
Information
Patent Grant
Reflow-compatible optical I/O assembly adapter
Patent number
10,591,689
Issue date
Mar 17, 2020
Oracle International Corporation
Chaoqi Zhang
G02 - OPTICS
Information
Patent Grant
Back-side etching and cleaving of substrates
Patent number
10,514,502
Issue date
Dec 24, 2019
Oracle International Corporation
Jin-Hyoung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Mode-hop-free hybrid external-cavity laser with passive thermo-opti...
Patent number
9,871,346
Issue date
Jan 16, 2018
Oracle International Corporation
Jin-Hyoung Lee
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid-integrated multi-chip module
Patent number
9,829,626
Issue date
Nov 28, 2017
Oracle International Corporation
Ivan Shubin
G02 - OPTICS
Information
Patent Grant
Hybrid optical source with optical proximity coupling provided by a...
Patent number
9,812,842
Issue date
Nov 7, 2017
Oracle International Corporation
Ivan Shubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Surface-normal coupler for silicon-on-insulator platforms
Patent number
9,696,486
Issue date
Jul 4, 2017
Oracle International Corporation
Xuezhe Zheng
G02 - OPTICS
Information
Patent Grant
Hybrid integrated MCM with waveguide-fiber connector
Patent number
9,698,564
Issue date
Jul 4, 2017
Oracle International Corporation
Ivan Shubin
G02 - OPTICS
Information
Patent Grant
Hybrid integration of edge-coupled chips
Patent number
9,618,709
Issue date
Apr 11, 2017
Oracle International Corporation
Xuezhe Zheng
G02 - OPTICS
Information
Patent Grant
Optical mode converter having multiple regions
Patent number
9,575,251
Issue date
Feb 21, 2017
Oracle International Corporation
Jin-Hyoung Lee
G02 - OPTICS
Information
Patent Grant
Self-assembled vertically aligned multi-chip module
Patent number
9,519,105
Issue date
Dec 13, 2016
Oracle International Corporation
Ivan Shubin
G02 - OPTICS
Information
Patent Grant
Back-side etching and cleaving of substrates
Patent number
9,488,777
Issue date
Nov 8, 2016
Oracle International Corporation
Jin-Hyoung Lee
G02 - OPTICS
Information
Patent Grant
Self-assembled vertically aligned multi-chip module
Patent number
9,470,855
Issue date
Oct 18, 2016
Oracle International Corporation
Ivan Shubin
G02 - OPTICS
Information
Patent Grant
Single shot correction of resonant optical components
Patent number
9,465,169
Issue date
Oct 11, 2016
Oracle International Corporation
Stevan S. Djordjevic
B01 - PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
Information
Patent Grant
Integrated electro-absorption modulator
Patent number
9,411,177
Issue date
Aug 9, 2016
Oracle International Corporation
John E. Cunningham
Y02 - TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMA...
Information
Patent Grant
Hybrid-integrated photonic chip package with an interposer
Patent number
9,297,971
Issue date
Mar 29, 2016
Oracle International Corporation
Hiren D. Thacker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method for fabricating multi-chip module with multi-level interposer
Patent number
9,281,268
Issue date
Mar 8, 2016
Oracle International Corporation
Eugene M. Chow
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information
Patent Grant
Hybrid-integrated photonic chip package with an interposer
Patent number
9,250,403
Issue date
Feb 2, 2016
Oracle International Corporation
Hiren D. Thacker
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Ultra-compact photodetector on an optical waveguide
Patent number
9,164,231
Issue date
Oct 20, 2015
Oracle International Corporation
Ivan Shubin
G02 - OPTICS
Information
Patent Grant
Integrated electro-absorption modulator
Patent number
9,142,698
Issue date
Sep 22, 2015
Oracle International Corporation
John E. Cunningham
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Hybrid optical source with semiconductor reflector
Patent number
8,988,770
Issue date
Mar 24, 2015
Oracle International Corporation
Xuezhe Zheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Chip package to support high-frequency processors
Patent number
8,982,563
Issue date
Mar 17, 2015
Oracle International Corporation
Kannan Raj
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Optical device with high thermal tuning efficiency
Patent number
8,971,674
Issue date
Mar 3, 2015
Oracle International Corporation
Ivan Shubin
G02 - OPTICS
Information
Patent Grant
Hybrid substrateless device with enhanced tuning efficiency
Patent number
8,796,811
Issue date
Aug 5, 2014
Oracle International Corporation
Ivan Shubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Interconnection and assembly of three-dimensional chip packages
Patent number
8,772,920
Issue date
Jul 8, 2014
Oracle International Corporation
Hiren D. Thacker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Maintaining alignment in a multi-chip module using a compressible s...
Patent number
8,742,576
Issue date
Jun 3, 2014
Oracle International Corporation
Hiren D. Thacker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Optical device with enhanced mechanical strength
Patent number
8,600,201
Issue date
Dec 3, 2013
Oracle International Corporation
Hiren D. Thacker
G02 - OPTICS
Information
Patent Grant
Direct interlayer optical coupler
Patent number
8,548,287
Issue date
Oct 1, 2013
Oracle International Corporation
Hiren D. Thacker
G02 - OPTICS
Information
Patent Grant
Optical device on inverted, substrateless chip
Patent number
8,428,404
Issue date
Apr 23, 2013
Oracle America, Inc.
Ivan Shubin
G02 - OPTICS
Information
Patent Grant
Chip package with plank stack of semiconductor dies
Patent number
8,390,109
Issue date
Mar 5, 2013
Oracle America, Inc.
Darko R. Popovic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Multi-chip module with multi-level interposer
Patent number
8,218,334
Issue date
Jul 10, 2012
Oracle America, Inc.
Eugene M. Chow
Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Patents Applications
last 30 patents
Information
Patent Application
HYBRID FIBER INTEGRATED SOI/III-V MODULE
Publication number
20190187373
Publication date
Jun 20, 2019
Roshmere, Inc.
Ivan Shubin
G02 - OPTICS
Information
Patent Application
REFLOW-COMPATIBLE OPTICAL I/O ASSEMBLY ADAPTER
Publication number
20180267265
Publication date
Sep 20, 2018
ORACLE INTERNATIONAL CORPORATION
Chaoqi Zhang
G02 - OPTICS
Information
Patent Application
HYBRID OPTICAL SOURCE WITH OPTICAL PROXIMITY COUPLING PROVIDED BY A...
Publication number
20170294760
Publication date
Oct 12, 2017
ORACLE INTERNATIONAL CORPORATION
Ivan Shubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
HYBRID-INTEGRATED MULTI-CHIP MODULE
Publication number
20170199328
Publication date
Jul 13, 2017
ORACLE INTERNATIONAL CORPORATION
Ivan Shubin
G02 - OPTICS
Information
Patent Application
OPTICAL MODE CONVERTER HAVING MULTIPLE REGIONS
Publication number
20170045686
Publication date
Feb 16, 2017
Oracle International Corporation
Jin-Hyoung Lee
G02 - OPTICS
Information
Patent Application
BACK-SIDE ETCHING AND CLEAVING OF SUBSTRATES
Publication number
20160334577
Publication date
Nov 17, 2016
ORACLE INTERNATIONAL CORPORATION
Jin-Hyoung Lee
G02 - OPTICS
Information
Patent Application
SINGLE-SHOT CORRECTION OF RESONANT OPTICAL COMPONENTS
Publication number
20160238791
Publication date
Aug 18, 2016
Oracle International Corporation
Stevan S. Djordjevic
G02 - OPTICS
Information
Patent Application
HYBRID INTEGRATION OF EDGE-COUPLED CHIPS
Publication number
20160170158
Publication date
Jun 16, 2016
Oracle International Corporation
Xuezhe Zheng
G02 - OPTICS
Information
Patent Application
SURFACE-NORMAL COUPLER FOR SILICON-ON-INSULATOR PLATFORMS
Publication number
20150362673
Publication date
Dec 17, 2015
Oracle International Corporation
Xuezhe Zheng
G02 - OPTICS
Information
Patent Application
INTEGRATED ELECTRO-ABSORPTION MODULATOR
Publication number
20150362764
Publication date
Dec 17, 2015
Oracle International Corporation
John E. Cunningham
G02 - OPTICS
Information
Patent Application
INTEGRATED ELECTRO-ABSORPTION MODULATOR
Publication number
20150293383
Publication date
Oct 15, 2015
Oracle International Corporation
John E. Cunningham
G02 - OPTICS
Information
Patent Application
BACK-SIDE ETCHING AND CLEAVING OF SUBSTRATES
Publication number
20150071585
Publication date
Mar 12, 2015
Oracle International Corporation
Jin Hyoung Lee
G02 - OPTICS
Information
Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
Publication number
20140321803
Publication date
Oct 30, 2014
Oracle International Corporation
Hiren D. Thacker
G02 - OPTICS
Information
Patent Application
HYBRID-INTEGRATED PHOTONIC CHIP PACKAGE WITH AN INTERPOSER
Publication number
20140321804
Publication date
Oct 30, 2014
Oracle International Corporation
Hiren D. Thacker
G02 - OPTICS
Information
Patent Application
HYBRID OPTICAL SOURCE WITH SEMICONDUCTOR REFLECTOR
Publication number
20140268312
Publication date
Sep 18, 2014
Oracle International Corporation
Xuezhe Zheng
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MAINTAINING ALIGNMENT IN A MULTI-CHIP MODULE USING A COMPRESSIBLE S...
Publication number
20130207261
Publication date
Aug 15, 2013
Oracle International Corporation
Hiren D. Thacker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
DIRECT INTERLAYER OPTICAL COUPLER
Publication number
20130121635
Publication date
May 16, 2013
Oracle International Corporation
Hiren D. Thacker
G02 - OPTICS
Information
Patent Application
ULTRA-COMPACT PHOTODETECTOR ON AN OPTICAL WAVEGUIDE
Publication number
20130039614
Publication date
Feb 14, 2013
Oracle International Corporation
Ivan Shubin
G02 - OPTICS
Information
Patent Application
HYBRID SUBSTRATELESS DEVICE WITH ENHANCED TUNING EFFICIENCY
Publication number
20130037905
Publication date
Feb 14, 2013
Oracle International Corporation
Ivan Shubin
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
INTERCONNECTION AND ASSEMBLY OF THREE-DIMENSIONAL CHIP PACKAGES
Publication number
20130015578
Publication date
Jan 17, 2013
Oracle International Corporation
Hiren D. Thacker
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE TO SUPPORT HIGH-FREQUENCY PROCESSORS
Publication number
20130003310
Publication date
Jan 3, 2013
ORACLE INTERNATIONAL CORPORATION
Kannan Raj
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
Publication number
20120266464
Publication date
Oct 25, 2012
ORACLE INTERNATIONAL CORPORATION
Eugene M. Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
CHIP PACKAGE WITH PLANK STACK OF SEMICONDUCTOR DIES
Publication number
20120211878
Publication date
Aug 23, 2012
Oracle International Corporation
Darko R. Popovic
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL DEVICE WITH ENHANCED MECHANICAL STRENGTH
Publication number
20120213467
Publication date
Aug 23, 2012
Oracle International Corporation
Hiren D. Thacker
G02 - OPTICS
Information
Patent Application
OPTICAL DEVICE WITH HIGH THERMAL TUNING EFFICIENCY
Publication number
20110235962
Publication date
Sep 29, 2011
ORACLE INTERNATIONAL CORPORATION
Ivan Shubin
G02 - OPTICS
Information
Patent Application
MULTI-CHIP MODULE WITH MULTI-LEVEL INTERPOSER
Publication number
20110223778
Publication date
Sep 15, 2011
ORACLE INTERNATIONAL CORPORATION
Eugene M. Chow
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Application
OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE
Publication number
20100290736
Publication date
Nov 18, 2010
SUN MICROSYSTEMS, INC.
John E. Cunningham
G02 - OPTICS
Information
Patent Application
OPTICAL DEVICE WITH LARGE THERMAL IMPEDANCE
Publication number
20100247021
Publication date
Sep 30, 2010
SUN MICROSYSTEMS, INC.
John E. Cunningham
G02 - OPTICS
Information
Patent Application
DUAL-LAYER THERMALLY TUNED OPTICAL DEVICE
Publication number
20100247022
Publication date
Sep 30, 2010
SUN MICROSYSTEMS, INC.
Guoliang Li
G02 - OPTICS
Information
Patent Application
THERMAL TUNING OF AN OPTICAL DEVICE
Publication number
20100247029
Publication date
Sep 30, 2010
SUN MICROSYSTEMS, INC.
Guoliang Li
G02 - OPTICS