Ivan Straznicky

Person

Carleton Place, CA

People

Patents Grantslast 30 patents

Information Patent Grant
Method and apparatus for near-end crosstalk reduction
- Patent number 11,304,289
- Issue date Apr 12, 2022
- DY4 SYSTEMS, INC.
- Robert C. Sullivan
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Fluid cooled enclosure for circuit module apparatus and methods of...
- Patent number 9,526,191
- Issue date Dec 20, 2016
- Dy 4 Systems Inc.
- Ivan Straznicky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Manufacturing process and heat dissipating device for forming inter...
- Patent number 8,941,234
- Issue date Jan 27, 2015
- DY 4 Systems, Inc.
- Ivan Straznicky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Manufacturing process and heat dissipating device for forming inter...
- Patent number 8,728,872
- Issue date May 20, 2014
- DY 4 Systems, Inc.
- Ivan Straznicky
- Y10 - TECHNICAL SUBJECTS COVERED BY FORMER USPC
Information Patent Grant
Tamper respondent module
- Patent number 8,687,371
- Issue date Apr 1, 2014
- Dy 4 Systems Inc.
- Nauman Arshad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Tamper respondent module
- Patent number 8,325,486
- Issue date Dec 4, 2012
- Dy 4 Systems Inc.
- Nauman Arshad
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Adjustable height liquid cooler in liquid flow through plate
- Patent number 7,515,418
- Issue date Apr 7, 2009
- Curtiss-Wright Controls, Inc.
- Ivan Straznicky
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Grant
Supplemental heat conduction path for card to chassis heat dissipation
- Patent number 6,873,528
- Issue date Mar 29, 2005
- Dy 4 Systems Ltd.
- Jamie Hulan
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Grant
Embedded heat pipe for a conduction cooled circuit card assembly
- Patent number 6,839,235
- Issue date Jan 4, 2005
- Dy 4 Systems Inc.
- Chad St. Louis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Patents Applicationslast 30 patents

Information Patent Application
Circuit Card Apparatus And Methods
- Publication number 20150289359
- Publication date Oct 8, 2015
- DY 4 SYSTEMS INC.
- Bob Schmidt
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
Fluid Cooled Enclosure For Circuit Module Apparatus And Methods Of...
- Publication number 20140340845
- Publication date Nov 20, 2014
- DY 4 Systems, Inc.
- Ivan Straznicky
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information Patent Application
MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...
- Publication number 20140209284
- Publication date Jul 31, 2014
- DY 4 Systems, Inc.
- Ivan Straznicky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Tamper Respondent Module
- Publication number 20130058052
- Publication date Mar 7, 2013
- DY 4 SYSTEMS INC.
- Nauman Arshad
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...
- Publication number 20130043015
- Publication date Feb 21, 2013
- DY 4 Systems, Inc.
- Ivan Straznicky
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
TAMPER RESPONDENT MODULE
- Publication number 20100177487
- Publication date Jul 15, 2010
- Nauman Arshad
- G06 - COMPUTING CALCULATING COUNTING
Information Patent Application
Adjustable height liquid cooler in liquid flow through plate
- Publication number 20070070605
- Publication date Mar 29, 2007
- Ivan Straznicky
- F28 - HEAT EXCHANGE IN GENERAL
Information Patent Application
EMBEDDED HEAT PIPE FOR A CONDUCTION COOLED CIRCUIT CARD ASSEMBLY
- Publication number 20040120116
- Publication date Jun 24, 2004
- Chad St. Louis
- H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR

Ivan Straznicky

Person

Patents Grantslast 30 patents

Method and apparatus for near-end crosstalk reduction

Fluid cooled enclosure for circuit module apparatus and methods of...

Manufacturing process and heat dissipating device for forming inter...

Manufacturing process and heat dissipating device for forming inter...

Tamper respondent module

Tamper respondent module

Adjustable height liquid cooler in liquid flow through plate

Supplemental heat conduction path for card to chassis heat dissipation

Embedded heat pipe for a conduction cooled circuit card assembly

Patents Applicationslast 30 patents

Circuit Card Apparatus And Methods

Fluid Cooled Enclosure For Circuit Module Apparatus And Methods Of...

MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...

Tamper Respondent Module

MANUFACTURING PROCESS AND HEAT DISSIPATING DEVICE FOR FORMING INTER...

TAMPER RESPONDENT MODULE

Adjustable height liquid cooler in liquid flow through plate

EMBEDDED HEAT PIPE FOR A CONDUCTION COOLED CIRCUIT CARD ASSEMBLY