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Iwao Ichikawa
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Tokyo, JP
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last 30 patents
Information
Patent Grant
Thermocompression bonding equipment
Patent number
5,698,068
Issue date
Dec 16, 1997
Sony Corporation
Iwao Ichikawa
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL
Information
Patent Grant
Thermocompression bonding apparatus, thermocompression bonding meth...
Patent number
5,439,161
Issue date
Aug 8, 1995
Sony Corporation
Norio Kawatani
H01 - BASIC ELECTRIC ELEMENTS
Information
Patent Grant
Apparatus for feeding electric circuit elements
Patent number
4,460,108
Issue date
Jul 17, 1984
Sony Corporation
Teruyoshi Noda
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for feeding electric circuit elements
Patent number
4,457,451
Issue date
Jul 3, 1984
Sony Corporation
Iwao Ichikawa
B65 - CONVEYING PACKING STORING HANDLING THIN OR FILAMENTARY MATERIAL
Information
Patent Grant
Apparatus for placing chip type circuit elements on a board
Patent number
4,451,324
Issue date
May 29, 1984
Sony Corporation
Iwao Ichikawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Method and apparatus for manufacturing hybrid integrated circuits
Patent number
4,345,371
Issue date
Aug 24, 1982
Sony Corporation
Mitsuo Ohsawa
H05 - ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
Information
Patent Grant
Apparatus for transferring parts or the like
Patent number
4,336,872
Issue date
Jun 29, 1982
Sony Corporation
Teruyoshi Noda
B29 - WORKING OF PLASTICS WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL