Iwao Maekawa

Person

Ibaraki-ken, JP

People

Patents Grantslast 30 patents

Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,781,896
- Issue date Aug 24, 2010
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,387,914
- Issue date Jun 17, 2008
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,078,094
- Issue date Jul 18, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,057,265
- Issue date Jun 6, 2006
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 7,012,320
- Issue date Mar 14, 2006
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,855,579
- Issue date Feb 15, 2005
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,825,249
- Issue date Nov 30, 2004
- Hitachi Chemical Co., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Semiconductor device and process for fabrication thereof
- Patent number 6,717,242
- Issue date Apr 6, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Laminating method of film-shaped organic die-bonding material, die-...
- Patent number 6,099,678
- Issue date Aug 8, 2000
- Hitachi Chemical Company Ltd.
- Akio Kotato
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Grant
Electroconductive resin paste
- Patent number 4,732,702
- Issue date Mar 22, 1988
- Hitachi Chemical Company, Ltd.
- Mitsuo Yamazaki
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Moistureproof insulating coating composition for packing circuit bo...
- Patent number 4,490,496
- Issue date Dec 25, 1984
- Hitachi Chemical Co., Ltd.
- Iwao Maekawa
- C09 - DYES PAINTS POLISHES NATURAL RESINS ADHESIVES MISCELLANEOUS COMPOSITION...
Information Patent Grant
Method for manufacture of polybutadiene-modified unsaturated polyester
- Patent number 4,370,446
- Issue date Jan 25, 1983
- Hitachi Chemical Company, Ltd.
- Tsutomu Toyoda
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition
- Patent number 4,367,314
- Issue date Jan 4, 1983
- Hitachi Chemical Company, Ltd.
- Akira Kageyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Process for producing polyimide-amide-carboxylic acid
- Patent number 4,338,427
- Issue date Jul 6, 1982
- Hitachi Chemical Company Ltd.
- Iwao Maekawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Oligomers and a method for the manufacture thereof
- Patent number 4,264,754
- Issue date Apr 28, 1981
- Hitachi Chemical Company, Ltd.
- Akira Kageyama
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Thermosetting resin composition
- Patent number 4,245,067
- Issue date Jan 13, 1981
- Hitachi Chemical Company, Ltd.
- Iwao Maekawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition with low shrinkage
- Patent number 4,233,413
- Issue date Nov 11, 1980
- Hitachi Chemical Company, Ltd.
- Noboru Monma
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resin composition having low shrink properties
- Patent number 4,228,251
- Issue date Oct 14, 1980
- Hitachi Chemical Company, Ltd.
- Iwao Maekawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resinous composition
- Patent number 4,224,430
- Issue date Sep 23, 1980
- Hitachi Chemical Company, Ltd.
- Iwao Maekawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...
Information Patent Grant
Resinous composition
- Patent number 4,100,120
- Issue date Jul 11, 1978
- Hitachi Chemical Company, Ltd.
- Iwao Maekawa
- C08 - ORGANIC MACROMOLECULAR COMPOUNDS THEIR PREPARATION OR CHEMICAL WORKING-...

Patents Applicationslast 30 patents

Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20080290529
- Publication date Nov 27, 2008
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF
- Publication number 20060180903
- Publication date Aug 17, 2006
- HITACHI CHEMICAL CO., Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20040253770
- Publication date Dec 16, 2004
- Hitachi Chemical Company, Ltd.
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20030160337
- Publication date Aug 28, 2003
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010035533
- Publication date Nov 1, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010016384
- Publication date Aug 23, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS
Information Patent Application
Semiconductor device and process for fabrication thereof
- Publication number 20010009780
- Publication date Jul 26, 2001
- Shinji Takeda
- H01 - BASIC ELECTRIC ELEMENTS

Iwao Maekawa

Person

Patents Grantslast 30 patents

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-...

Semiconductor device and process for fabrication thereof

Laminating method of film-shaped organic die-bonding material, die-...

Electroconductive resin paste

Moistureproof insulating coating composition for packing circuit bo...

Method for manufacture of polybutadiene-modified unsaturated polyester

Resin composition

Process for producing polyimide-amide-carboxylic acid

Oligomers and a method for the manufacture thereof

Thermosetting resin composition

Resin composition with low shrinkage

Resin composition having low shrink properties

Resinous composition

Resinous composition

Patents Applicationslast 30 patents

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

SEMICONDUCTOR DEVICE AND PROCESS FOR FABRICATION THEREOF

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof

Semiconductor device and process for fabrication thereof